Abstract: Disclosed herein is a light modulator package having an inclined light transmissive lid which is manufactured or positioned such that a surface of the light transmissive lid is inclined relative to a reflective surface of a light modulating array.

Abstract: A semiconductor package using flip-chip mounting technique is disclosed. The semiconductor package includes: a semiconductor device provided with a plurality of first pads extending from the semiconductor device; a substrate provided with a plurality of second pads extending from the substrate at positions in registry with the location of the first pads of the semiconductor device; and an anisotropic conductive material interposed between the plurality of first pads and the plurality of second pads to electrically connect the first pads to associated second pads, the anisotropic conductive material positioned at discrete locations around the semiconductor device, thereby providing unobstructed clearance at desired locations between the semiconductor device and the substrate.

Abstract: The present invention relates to a MEMS package, and in particular, to the structure of a MEMS package. One aspect of the invention provides an optical modulator module package comprising a substrate, an optical modulator positioned on the substrate which modulates an optical signal and transmits the optical signal through the substrate, a driver IC (driver integrated circuit) mounted adjacent to the optical modulator which operates the optical modulator, circuit wiring formed on the substrate and configured which transfers signals for operating the optical modulator, and a printed circuit board positioned facing the substrate on the optical modulator and the driver IC for signal connection with an external circuit. With a MEMS module package according to an aspect of the invention, the overall size can be reduced by providing a different form of layer composition.

Abstract: A MEMS module package using a sealing cap having heat releasing capability is disclosed, which comprises a lower substrate, a MEMS element mounted on the lower substrate, a driver integrated circuit mounted on the lower substrate adjacently to the MEMS element which operates the MEMS element, and a sealing cap positioned in contact with the lower substrate which has a MEMS-element protrusion portion in physical contact with the MEMS element and has one or more grooves for housing the MEMS element and the driver integrated circuit. The MEMS module package using a sealing cap having heat releasing capability and a manufacturing method thereof according to an aspect of the present invention utilize an effective heat releasing structure to release the heat generated in each element.

Abstract: Disclosed herein is a light modulator module package, which is advantageous because a size of the module package is minimized and heat is efficiently dispersed while the optical properties of a light modulator device are maintained.

Abstract: A semiconductor package and packaging method using a flip-chip bonding technology is disclosed. In the semiconductor package and packaging method, the microelement array of a micro-device, for example, the micromirror array of a light modulator having micromirrors that are hyperfine elements, is sealed from the outside using flip-chip bonding technology. Thus, the microelement array is protected from the outside. The packaging method executes the packaging process using only the flip-chip bonding technology, without a wire-bonding technology, at a wafer level instead of a conventional individual semiconductor device level, thus increasing the bonding process efficiency. Furthermore, the electrode array pattern for supplying both electricity and control signals to the microelement array does not pass through a hermetic sealing layer, thus ensuring a well-sealed semiconductor package. The electrode array pattern is also finely formed to correspond to the microelement array which is extremely finely formed.

Abstract: A micro-electro-mechanical system (MEMS) package with a side sealing member and a method of manufacturing the package are disclosed. In the MEMS package and method of the present invention, a sealing member is formed on a side surface of a lid glass that is mounted on a spacer surrounding MEMS elements provided on a base substrate and covers the MEMS elements, so that the sealing member hermetically seals the MEMS elements from the external environment.

Abstract: Disclosed herein is a package structure for an optical modulator, which is configured such that an optical modulating device and electronic control circuitry are incorporated into a module, thus allowing the manufacture of a compact module while maintaining the optical properties of the optical modulating device.

Abstract: A semiconductor package and packaging method using a flip-chip bonding technology is disclosed. In the semiconductor package and packaging method, the microelement array of a micro-device, for example, the micromirror array of a light modulator having micromirrors that are hyperfine elements, is sealed from the outside using flip-chip bonding technology. Thus, the microelement array is protected from the outside. The packaging method executes the packaging process using only the flip-chip bonding technology, without a wire-bonding technology, at a wafer level instead of a conventional individual semiconductor device level, thus increasing the bonding process efficiency. Furthermore, the electrode array pattern for supplying both electricity and control signals to the microelement array does not pass through a hermetic sealing layer, thus ensuring a well-sealed semiconductor package. The electrode array pattern is also finely formed to correspond to the microelement array which is extremely finely formed.

Abstract: A micro-electro-mechanical system (MEMS) package with a side sealing member and a method of manufacturing the package are disclosed. In the MEMS package and method of the present invention, a sealing member is formed on a side surface of a lid glass that is mounted on a spacer surrounding MEMS elements provided on a base substrate and covers the MEMS elements, so that the sealing member hermetically seals the MEMS elements from the external environment.

Abstract: Disclosed are a multi-channel optical switch and a method for manufacturing the same. The multi-channel optical switch includes a supporter; an input terminal optical fiber fixed to the supporter for inputting an optical signal to be switched therethrough; multiple output terminal optical fibers fixed to the supporter for outputting the optical signal inputted through the input terminal optical fiber therethrough; multiple micro mirrors for reflecting the optical signal inputted through the input terminal optical fiber and then for directing the optical signal to a designated output terminal optical fiber among the multiple output terminal optical fibers; and multiple actuators respectively connected to the micro mirrors for adjusting the positions of the micro mirrors so that the optical signal is reflected by the micro mirrors.

Abstract: Disclosed are a multi-channel optical switch and a method for manufacturing the same. The multi-channel optical switch includes a supporter; an input terminal optical fiber fixed to the supporter for inputting an optical signal to be switched therethrough; multiple output terminal optical fibers fixed to the supporter for outputting the optical signal inputted through the input terminal optical fiber therethrough; multiple micro mirrors for reflecting the optical signal inputted through the input terminal optical fiber and then for directing the optical signal to a designated output terminal optical fiber among the multiple output terminal optical fibers; and multiple actuators respectively connected to the micro mirrors for adjusting the positions of the micro mirrors so that the optical signal is reflected by the micro mirrors.

Abstract: An arrayed waveguide grating (AWG) wavelength division multiplexer (WDM) provided with alignment waveguides, and an apparatus for aligning the arrayed waveguide grating wavelength division multiplexer. The wavelength division multiplexer is provided with alignment waveguides, to be used upon coupling the optical waveguide device to optical fiber blocks, in addition to waveguides required for achievement of desired functions, so that it can achieve a desired alignment irrespective of the achievement of those functions. Accordingly, it is unnecessary to know respective operation characteristics of individual devices, thus easy and rapid alignment and bonding can be achieved. In accordance with the present invention, the operation wavelength of the optical wavelength device can be determined by detecting the wavelength of the light output from each alignment waveguide. Accordingly, it is possible to simply determine whether or not the optical waveguide device operates normally.

Abstract: A 1×N optical wavelength-division demultiplexer alignment apparatus including a 1×N optical wavelength-division demultiplexer including an input waveguide, N output waveguides and a plurality of alignment waveguides positioned around the input and output waveguides, for demultiplexing signal light and supplying the demultiplexed signal light to the N output waveguides if the signal light has a wavelength in a communication wavelength region, and for supplying the signal light to the alignment waveguides if the signal light has wavelengths outside the communication wavelength region. A single optical fiber block has a single optical fiber to transmit the signal light to the 1×N optical wavelength-division demultiplexer, a multiple optical fiber block having N optical fibers connected to output sides of the N waveguides and alignment optical fibers connected to output sides of the alignment waveguides.

Abstract: An apparatus for aligning an optical waveguide device has functional waveguides for transmitting signal light and internal and external waveguides, located on the periphery of the functional waveguides, with optical fiber blocks and includes an optical source, a first optical fiber block having a plurality of first functional optical fibers each connected to one end of each of the functional waveguides, and a plurality of first alignment optical fibers each aligned with one end of each of the internal and external waveguides for transmitting light generated by the optical source, a second optical fiber block having a plurality of second functional optical fibers each connected to the other end of each of the functional waveguides, and a plurality of second alignment optical fibers each aligned with the other end of each of the internal and external waveguides, a measuring unit for measuring an intensity of light output from the second alignment optical fibers, and a controller for receiving the intensity of l

Abstract: A method and article for splicing metal clad optical fibers and protecting the spliced portion, and a reinforced splice between metal clad optical fibers, is provided. The method comprises the steps of fusing the exposed ends of metal clad optical fibers together, aligning the thus formed splicing area over a metal groove in a lower plate, depositing a metal adhesive on the upper surface of the lower plate, sealing the splicing area by laying a metal groove of an upper plate over that of the lower plate, and uniformly coating and hardening the metal adhesive on the splicing area of the optical fibers by applying high temperature air to the metal grooves. As described above, the splicing area of the optical fibers is protected by a soldering cream adhered thereto so that a high tensile strength is provided. Also, the length of the spliced portion is short so that the spliced optical fiber can be mounted in a small space in a device using optical fibers.