Patents by Inventor Yew Cheong Kuan

Yew Cheong Kuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Illumination unit with a solid-state light generating source, a flexible substrate, and a flexible and optically transparent encapsulant
    Publication number: 20040223328
    Abstract: An illumination unit includes a thin and flexible substrate and flexible electrical tracks formed on the flexible substrate. A number of solid-state light generating sources are arranged on the flexible substrate along the electrical tracks and are electrically connected to the electrical tracks. A flexible and optically transparent encapsulant is provided to encapsulate the light generating sources on the substrate such that the illumination unit is both thin and flexible.
    Type: Application
    Filed: January 20, 2004
    Publication date: November 11, 2004
    Inventors: Kian Shin Lee, Jan tB Yin Chua, Wen Ya Ou, Yew Cheong Kuan
  • Chip shaping for flip-chip light emitting diode
    Patent number: 6784460
    Abstract: A LED of flip-chip design comprises a light emitting region and one or more transparent substrates overlying the light emitting region. The light emitting region includes a negatively doped layer, a positively doped layer, and an active p-n junction layer between the negatively doped layer and the positively doped layer. At least one of the substrates has a pyramidal shape determined by (1) the composition of electrically conductive or electrically non-conductive material, (2) the number of side surfaces, (3) the degree of offset of an apex or top surface, and (4) the slope angle of each side surface relative to a bottom surface.
    Type: Grant
    Filed: October 10, 2002
    Date of Patent: August 31, 2004
    Assignee: Agilent Technologies, Inc.
    Inventors: Kee Yean Ng, Yew Cheong Kuan
  • Chip shaping for flip-chip light emitting diode
    Publication number: 20040070000
    Abstract: A LED of flip-chip design comprises a light emitting region and one or more transparent substrates overlying the light emitting region. The light emitting region includes a negatively doped layer, a positively doped layer, and an active p-n junction layer between the negatively doped layer and the positively doped layer. At least one of the substrates has a pyramidal shape determined by (1) the composition of electrically conductive or electrically non-conductive material, (2) the number of side surfaces, (3) the degree of offset of an apex or top surface, and (4) the slope angle of each side surface relative to a bottom surface.
    Type: Application
    Filed: October 10, 2002
    Publication date: April 15, 2004
    Inventors: Kee Yean Ng, Yew Cheong Kuan