Patents by Inventor Yi An

Yi An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11727872
    Abstract: A pixel circuit, a display substrate and a display device are disclosed. The pixel circuit includes: a threshold compensation transistor, a shielding element including a first shielding portion and a second shielding portion coupled with each other; a data writing transistor, orthographic projections of an active layer of the data writing transistor and the gate of the data writing transistor on the substrate are overlapped to form a first overlapping area; the first electrode and the active layer of the data writing transistor are in a same layer, orthographic projections of the first electrode of the data writing transistor and the second shielding portion on the substrate are overlapped to form a second overlapping area; a size of the second overlapping area in the first direction is smaller than that of the first overlapping area in the first direction.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: August 15, 2023
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Lulu Yang, Tinghua Shang, Huijuan Yang, Xiaofeng Jiang, Yupeng He, Huijun Li, Yi Qu, Meng Zhang, Xin Zhang, Hao Zhang
  • Patent number: 11726405
    Abstract: An organometallic precursor for extreme ultraviolet (EUV) lithography is provided. An organometallic precursor includes an aromatic di-dentate ligand, a transition metal coordinated to the aromatic di-dentate ligand, and an extreme ultraviolet (EUV) cleavable ligand coordinated to the transition metal. The aromatic di-dentate ligand includes a plurality of pyrazine molecules.
    Type: Grant
    Filed: February 16, 2021
    Date of Patent: August 15, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih-Cheng Liu, Yi-Chen Kuo, Yen-Yu Chen, Jr-Hung Li, Chi-Ming Yang, Tze-Liang Lee
  • Patent number: 11728110
    Abstract: An illuminated keyswitch structure is provided. A base plate includes plural openings and plural rib portions separating the openings. A drive circuit board is disposed under the base plate. A spacer having a through hole is disposed underneath the base plate and above the drive circuit board. A light-emitting part with low illuminance is disposed on the drive circuit board and in the through hole, and the light-emitting part vertically corresponding to one of the openings of the base plate. A light-permeable covering structure includes a first covering layer and a second covering layer. The second covering layer vertically corresponds to the light-emitting part and said corresponding opening of the base plate. The second covering layer blocks at least partial light of the light-emitting part toward said corresponding opening to reduce illuminating intensity provided there through.
    Type: Grant
    Filed: June 23, 2022
    Date of Patent: August 15, 2023
    Assignee: DARFON ELECTRONICS CORP.
    Inventors: Heng-Yi Huang, Hsin-Cheng Ho
  • Patent number: 11728374
    Abstract: A capacitor structure for a power semiconductor device includes a semiconductor substrate, an isolation insulating layer having a ring-shape and including an outer periphery and an inner periphery defining an opening region, a first electrode disposed on the isolation insulating layer, a dielectric layer disposed on the first electrode, and a second electrode disposed on the dielectric layer.
    Type: Grant
    Filed: October 11, 2021
    Date of Patent: August 15, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hong-Yang Chen, Tian Sheng Lin, Yi-Cheng Chiu, Hung-Chou Lin, Yi-Min Chen, Kuo-Ming Wu, Chiu-Hua Chung
  • Patent number: 11728414
    Abstract: A method of forming a semiconductor device comprises forming a fin structure; forming a source/drain structure in the fin structure; and forming a gate electrode over the fin structure. The source/drain structure includes Si1?x?yM1xM2y, where M1 includes Sn, M2 is one or more of P and As, 0.01?x?0.1, and 0.01?y?0.
    Type: Grant
    Filed: February 14, 2022
    Date of Patent: August 15, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yasutoshi Okuno, Cheng-Yi Peng, Ziwei Fang, I-Ming Chang, Akira Mineji, Yu-Ming Lin, Meng-Hsuan Hsiao
  • Patent number: 11728264
    Abstract: An interconnect structure is provided. The interconnect structure includes a first metal line. The first metal line includes a first conductive material disposed within a first dielectric layer over a substrate and a second conductive material disposed within the first dielectric layer and directly over a top of the first conductive material. The second conductive material is different from the first conductive material. A second dielectric layer is disposed over the first dielectric layer. A first via comprising a third conductive material is disposed within the second dielectric layer and on a top of the second conductive material. The second conductive material and the third conductive material have lower diffusion coefficients than the first conductive material.
    Type: Grant
    Filed: June 17, 2022
    Date of Patent: August 15, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue
  • Patent number: 11727634
    Abstract: The present disclosure discloses an intelligent position sensing system based on spatial three-dimensional model image matching, which realizes three-dimensional precise positioning and target orientation positioning of closed spaces, such as a coal mine. The position sensing system includes a three-dimensional GIS server, a position matching server, a wireless camera, and a wireless access device. Position sensing is realized by comparing an image collected by the wireless camera with a two-dimensional image generated by rendering.
    Type: Grant
    Filed: May 6, 2021
    Date of Patent: August 15, 2023
    Assignee: CHINA UNIVERSITY OF MINING AND TECHNOLOGY, BEIJING
    Inventor: Yi Liu
  • Patent number: 11726095
    Abstract: This invention resides in using metal complex-activated particles to bind molecules, polymers and other particles to each other, so as to produce multifunctional conjugates having controlled ratios of two or more different molecules.
    Type: Grant
    Filed: August 13, 2014
    Date of Patent: August 15, 2023
    Assignee: ANTEO TECHNOLOGIES PTY LTD
    Inventors: Nobuyoshi Joe Maeji, Chang-Yi Huang
  • Patent number: 11728229
    Abstract: A semiconductor structure that includes two circuit regions; two inner seal rings, each of the two inner seal rings surrounding one of the two circuit regions; an outer seal ring surrounding the two inner seal rings, wherein each of the inner seal rings and the outer seal ring has a substantially rectangular periphery with four interior corner seal ring structures; four first redundant regions between the two inner seal rings and the outer seal ring, each of the four first redundant regions being a substantially trapezoidal shape; and first dummy patterns substantially uniformly distributed in the four first redundant regions.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: August 15, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shan-Yu Huang, Hsiao-Wen Chung, Yi-Lun Chen, Huang-Sheng Lin
  • Patent number: 11728948
    Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) may identify a payload for inclusion in an uplink transmission. The UE may organize the payload into a code block group (CBG) that includes one or more code blocks (CB). The UE may map each CB of the CBG to a corresponding uplink shared channel resource unit (e.g., a physical uplink shared channel resource unit) of an uplink transmission occasion of the first UE. The uplink transmission occasion may also be shared with one or more additional UEs such that the CBG of the first UE is multiplexed with additional CBGs from the additional UEs. The UE may transmit, to a base station, the uplink transmission including each uplink shared channel resource unit on which the CBG is organized.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: August 15, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Jing Lei, Linhai He, Seyong Park, Gabi Sarkis, Yi Huang, Renqiu Wang, Wanshi Chen
  • Patent number: 11730024
    Abstract: A display device may include a first pixel column disposed on a substrate, a second pixel column adjacent to the first pixel column, a third pixel column adjacent to the second pixel column, and a first wiring, a second wiring, and a third wiring respectively and electrically connected to the first pixel column, the second pixel column, and the third pixel column. Each of the first wiring, the second wiring, and the third wiring may include a first line, a second line electrically connected to the first line, the first line and the second line being disposed on different layers, and a third line electrically connected to the second line, the first line, the second line, and the third line being disposed on different layers.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: August 15, 2023
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Sang Hoon Oh, Seung Gyu Tae, Hyun Woo Kang, Dong Hyeok Lee, Chang Ho Yi
  • Patent number: 11728923
    Abstract: Methods, systems, and devices for wireless communications are described. In some cases, randomized shifts of a base sequence may be used for transmitting uplink control information. For example, a user equipment (UE) may identify a base sequence of an uplink control message. The UE may also receive signaling that indicates a UE-specific initial shift that may be applied to the base sequence. In some examples, the signaling that indicates the randomized shift may be explicit, implicit, or a combination thereof. After determining one or more shifted sequences based on the UE-specific initial shift, a payload of the uplink control message, and the base sequence, the UE may select a shifted sequence to be transmitted, where the selection is based on a payload of the uplink control message. For example, different shifted sequences may be selected for respective transmissions of scheduling requests, 1-bit acknowledgments (ACKs), 2-bit ACKs, and the like.
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: August 15, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Renqiu Wang, Yi Huang
  • Patent number: 11726187
    Abstract: An apparatus and method for providing a filtering false photon count events for each pixel in a DTOF sensor array are disclosed herein. In some embodiments, the apparatus includes: a light source configured to emit a modulated signal towards the object; a direct time of flight (DTOF) sensor array configured to receive a reflected signal from the object, wherein the DTOF sensor array comprises a plurality of single-photon avalanche diodes (SPADs); and processing circuitry configured to receive photon event detection signals from a center pixel and a plurality of pixels orthogonally and diagonally adjacent to the center pixel and output a valid photon detection signal, in response to determining whether a sum of the received photon event detection signals is greater than a predetermined threshold.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: August 15, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chin Yin, Meng-Hsiu Wu, Chih-Lin Lee, Calvin Yi-Ping Chao, Shang-Fu Yeh
  • Patent number: 11724120
    Abstract: High frequency repetitive magnetic pulses may be used to treat pain in the foot of a person by relaxing the muscle and reducing communication of pain signals by neurons in the treatment region. A device is disclosed, which is floor mounted and incorporates a cooling mechanism and heat sink to allow high frequency magnetic stimulation to the person's foot.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: August 15, 2023
    Assignee: WAVE NEUROSCIENCE, INC.
    Inventors: Yi Jin, James William Phillips
  • Patent number: 11725270
    Abstract: A physical vapor deposition (PVD) target for performing a PVD process is provided. The PVD target includes a backing plate and a target plate coupled to the backing plate. The target plate includes a sputtering source material and a dopant, with the proviso that the dopant is not impurities in the sputtering source material. The sputtering source material includes a diffusion barrier material.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: August 15, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chia-Hsi Wang, Yen-Yu Chen, Yi-Chih Chen, Shih Wei Bih
  • Patent number: D995132
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: August 15, 2023
    Inventor: Leping Yi
  • Patent number: D995334
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: August 15, 2023
    Inventor: Yi Miao
  • Patent number: D995485
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: August 15, 2023
    Assignee: Meta Platforms Technologies, LLC
    Inventors: Yi-yaun Chen, Lorenz Henric Jentz, Jason Andrew Higgins, Scott Andrew Dallmeyer
  • Patent number: D995659
    Type: Grant
    Filed: April 20, 2023
    Date of Patent: August 15, 2023
    Inventor: Jun Yi
  • Patent number: D995757
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: August 15, 2023
    Assignee: SKYPRO MEDICAL SUPPLIES COMPANY LIMITED
    Inventor: Suet yi Wong