Abstract: The present application discloses a semiconductor device. The semiconductor device includes a memory stacking pair. The memory stacking pair includes a first memory semiconductor structure and a second memory semiconductor structure. The first memory semiconductor structure has a first front side and a first back side opposite to the first front side. The second memory semiconductor structure has a second front side and a second back side opposite to the second front side. The first memory semiconductor structure is bonded to the second memory semiconductor structure, and the first front side of the first memory semiconductor structure is proximal to the second front side of the second memory semiconductor structure, and the first back side is distal to the second back side.

Abstract: Methods, systems, and devices for wireless communication are described. A device may transmit first control signaling indicating a capability for switching between carriers of a group of carriers during uplink communications using carrier aggregation. The group of carriers include three or more carriers that are each associated with different radio frequency bands. The device may receive second control signaling that includes an indication for the device to switch to a subset of carriers of the group of carriers for transmission of an uplink message. The subset of carriers may be associated with a combination of radio frequency bands. The device may transmit the uplink message on at least one of the subset of carriers in accordance with a mapping between the combination of radio frequency bands and the at least one of the subset of carriers, where the mapping is based on the capability.

Abstract: A semiconductor device includes a semiconductor substrate, a gate structure, strained layers, source/drain contact patterns, a gate contact via, and source/drain contact vias. The gate structure is disposed over the semiconductor substrate. The strained layers are disposed aside the gate structure. The source/drain contact patterns are disposed on and electrically connected to the strained layers. Top surfaces of the source/drain contact patterns are coplanar with a top surface of the gate structure. The gate contact via is disposed on and electrically connected to the gate structure. The source/drain contact vias are disposed on and electrically connected to the source/drain contact patterns.

Abstract: A cold plate for cooling a heat-generating component in a computer system is disclosed. The cold plate includes a base member having an exterior surface for contact with the heat-generating component. The cold plate has a supply chamber defined by a supply end, and an opposite collection chamber defined by a collection end. A supply tube includes an inlet having a cross section area that is smaller than the cross section area of an outlet. The outlet is in communication with the supply chamber. A collection tube includes an inlet having a cross section area that is larger than the cross section area of an outlet. The inlet is in fluid communication with the collection chamber.

Abstract: In some aspects of the present disclosure, an electrostatic discharge (ESD) protection circuit is disclosed. In some aspects, the ESD protection circuit includes a first transistor coupled to a pad, a second transistor coupled between the first transistor and ground, a stack of transistors coupled to the first transistor, and an ESD clamp coupled between the stack of transistors and the ground.

Abstract: A display substrate, a display panel, and a display apparatus are provided. The display substrate includes a display area and a non-display area on at least one side of the display area, the non-display area including at least a retaining-wall area, a crack-blocking area, and a cut-retention area in a direction away from the display area. The display substrate includes a base substrate, an insulating layer, a first inorganic layer, and a first dummy metal layer. The insulating layer is on the base substrate, to form a blocking-area raised layer in the crack-blocking area. The first inorganic layer is on the insulating layer and at least partially covers the blocking-area raised layer, and the first inorganic layer is formed with a first slope and a second slope corresponding to opposing sides of the blocking-area raised layer, respectively, the first slope being closer to the display area than the second slope.

Abstract: A caregiving robot and a caregiving system and method employing the same are provided. The caregiving robot includes a movement module, an interaction module and a control module. The interaction module receives an input instruction from the caregiver, and the input instruction includes an identity information and a target location information of the care recipient and a caregiving task information. During execution of the caregiving task, the control module controls the movement module to make the caregiving robot move to a target location according to the target location information. When the caregiving robot arrives at the target location, the control module controls the interaction module to interact with the care recipient according to the caregiving task information so as to collect health status input from the care recipient, and generates a status report accordingly. The status report includes health status information and status evaluation information of the care recipient.

Abstract: Some embodiments of the invention provide a method of performing end-user monitoring. At a health monitor that executes on a first host computer along with a client machine and a load balancer, to monitor health of a set of two or more servers that are candidate servers for processing packets from the client machine, the method exchanges health monitoring messages with each server in the set of servers to assess health of the servers in the set. At the health monitor, the method provides health data expressing health of the servers to the load balancer to use in determining how to distribute packets from the client machine between the servers in the set of servers.

Abstract: A method for processing low resolution degraded image, a system, a storage medium, and a device therefor are provided. The present disclosure adopts a dual branch processing model, which includes an image restoration branch and an image super-resolution branch. At the same time, a fusion module is used to fuse and learn image features from the two domains, thereby improving the problem of error accumulation and high computational cost caused by the two-stage processing method.

Abstract: A culturing device includes a culturing container, a transparent plate, a cover and a light emitting assembly. The culturing container includes a body portion and an opening portion. The body portion is connected to the opening portion. The opening portion has an opening. The transparent plate is disposed on the opening portion, and covers the opening. The cover is disposed on a side of the transparent plate located farthest away from the culturing container. The cover and the transparent plate together form an airflow channel therebetween. The light emitting assembly is disposed on the cover, and is located in the airflow channel.

Abstract: An imaging lens assembly has an optical axis, and includes at least one radial reduction lens element and a light blocking element. The radial reduction lens element includes an effective optical portion and a peripheral portion. The effective optical portion includes a reduction part shrinking from a portion of the effective optical portion towards the optical axis so that the effective optical portion is non-circular. The peripheral portion and the reduction part are disposed at interval. The light blocking element includes a receiving structure and an extending light blocking structure. The extending light blocking structure and the receiving structure are disposed at interval, and the extending light blocking structure is connected to the receiving structure so that the effective optical portion is non-circular.

Abstract: The present invention provides a speaker box including a housing and a speaker unit accommodated in the housing. The speaker box also includes an air-permeable spacer accommodated in the housing. The housing includes a bottom wall away from the speaker unit and a side wall bent and extended from the bottom wall toward the speaker unit. The air-permeable spacer is enclosed with the bottom wall and the side wall to form a containment space filled with sound absorbing powder. The inner surface of the side wall is provided with a number of protruding portions that support the air-permeable spacer. The air-permeable spacer is fixedly connected with the protruding portion. The speaker box of the present invention saves internal space and increases the filling amount of the sound absorbing powder.

Abstract: An autonomous mobile robot and an operating method thereof are provided. The autonomous mobile robot includes a movement module, a detection module, a control module and an interaction module. The control module includes a determination unit and a navigation unit. The determination unit determines whether there is an obstacle near or on a predetermined path of the autonomous mobile robot according to the environment information. When the obstacle is on the predetermined path, the navigation unit decides an obstacle avoidance strategy according to the environment information and the type of the obstacle. The obstacle avoidance strategy at least includes moving along a side path, stopping aside to yield, moving backward and stopping at a yielding point to yield, and detouring. When the obstacle is near or on the predetermined path, the interaction module performs an interaction action according to the obstacle avoidance strategy and the type of the obstacle.

Abstract: One or more semiconductor processing tools may form a deep trench within a silicon wafer. The one or more semiconductor processing tools may deposit a first insulating material within the deep trench. The one or more semiconductor processing tools may form, after forming the deep trench with the silicon wafer, a shallow trench above the deep trench. The one or more semiconductor processing tools may deposit a second insulating material within the shallow trench.

Abstract: The present application relates to a bispecific antibody and a use thereof, and also to an immunoconjugate and a pharmaceutical composition comprising the bispecific antibody. The present application further relates to uses of the bispecific antibody and immunoconjugate and pharmaceutical composition comprising the bispecific antibody. The bispecific antibody prepared in the present application can recognize or bind a cell expressing Claudin 18.2 and/or recognize or bind a cell expressing 4-1BB. Moreover, tumors can be prevented and/or treated in a subject.

Abstract: A multi-beam liquid crystal antenna and a method of multi-beamforming are provided. The method includes: providing a liquid crystal modulation structure; utilizing a feeding structure to receive a feeding signal and to generate substantially an equiphase feeding electromagnetic wave to patch antenna units of the liquid crystal modulation structure; generating, by the patch antenna units, first radiation intensities and second radiation intensities respectively when the patch antenna units are utilized to receive alternating-current (AC) voltages respectively, so that the liquid crystal modulation structure forms an amplitude interference pattern; and utilizing interference of the feeding electromagnetic wave and the amplitude interference pattern to form electromagnetic beams, in which arrangement positions of the first radiation intensities and the second radiation intensities corresponding to the amplitude interference pattern change an azimuth angle and a tilt angle of each of the electromagnetic beams.

Abstract: A spindle device includes a shaft housing, a spindle, a bearing liner, a damping adjustment piston and an actuating assembly. The spindle is disposed through the shaft housing. A bearing component surrounds a shaft. The bearing liner is sleeved on the bearing component and has a liner conical surface facing away from the bearing component. The liner conical surface is non-parallel to an axial direction. A damping chamber is formed between the shaft housing and the bearing liner to be filled with a damping fluid. The damping adjustment piston is slidably located within the damping chamber and has a piston conical surface facing the liner conical surface. The piston conical surface is non-parallel to the axial direction. The actuating assembly is to drive the damping adjustment piston to move relative to the bearing liner to adjust a gap formed between the piston conical surface and the liner conical surface.

Abstract: A wearable device includes a first radiation metal element, a second radiation metal element, a ground metal element, a third radiation metal element, and a carrier element. The first radiation metal element is coupled to a positive feeding point. The second radiation metal element is coupled to the positive feeding point. The ground metal element is coupled to a negative feeding point. The third radiation metal element is adjacent to the ground metal element. A coupling gap is formed between the third radiation metal element and the ground metal element. The first radiation metal element, the second radiation metal element, the ground metal element, and the third radiation metal element are disposed on the carrier element. An antenna structure is formed by the first radiation metal element, the second radiation metal element, the ground metal element, and the third radiation metal element.

Abstract: An antenna structure includes a feeding radiation element, a first radiation element, a second radiation element, a third radiation element, and a carrier element. The feeding radiation element has a feeding point. The first radiation element is coupled to the feeding radiation element. The first radiation element has a meandering structure. The second radiation element is coupled to the feeding radiation element. The second radiation element is adjacent to the first radiation element. The third radiation element is coupled to the ground voltage. The third radiation element is adjacent to the second radiation element. The feeding radiation element, the first radiation element, the second radiation element, and the third radiation element are disposed on the carrier element.

Abstract: The present disclosure relates to a semiconductor wafer structure including a semiconductor substrate and a plurality of semiconductor devices disposed along the semiconductor substrate. A dielectric stack including a plurality of dielectric layers is arranged over the semiconductor substrate. A conductive interconnect structure is within the dielectric stack. A seal ring layer is over the dielectric stack and laterally surrounds the dielectric stack along a first sidewall of the dielectric stack. The seal ring layer includes a first protrusion that extends into a first trench in the semiconductor substrate.