Patents by Inventor Yi Cheng
Yi Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240136346Abstract: A semiconductor die package includes an inductor-capacitor (LC) semiconductor die that is directly bonded with a logic semiconductor die. The LC semiconductor die includes inductors and capacitors that are integrated into a single die. The inductors and capacitors of the LC semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. The integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.Type: ApplicationFiled: April 17, 2023Publication date: April 25, 2024Inventors: Chien Hung LIU, Yu-Sheng CHEN, Yi Ching ONG, Hsien Jung CHEN, Kuen-Yi CHEN, Kuo-Ching HUANG, Harry-HakLay CHUANG, Wei-Cheng WU, Yu-Jen WANG
-
Publication number: 20240134136Abstract: An optical transceiver module temperature control device includes a processor, a printed circuit board assembly, an optical transceiver module and a temperature adjustment element. The processor is configured to measure an ambient temperature. The printed circuit board assembly includes a first side and a second side. The first side is opposite to the second side. The optical transceiver module is disposed on the first side of the printed circuit board assembly. The temperature adjustment element is coupled to the processor and disposed on the second side of the printed circuit board assembly. The processor is configured to generate a temperature adjustment signal according to the ambient temperature and an operating temperature range. The temperature adjustment element is configured to perform heat exchange with the printed circuit board assembly according to the temperature adjustment signal to adjust a temperature of the optical transceiver module into the operating temperature range.Type: ApplicationFiled: October 23, 2023Publication date: April 25, 2024Applicant: Formerica Optoelectronics, Inc.Inventors: Yun-Cheng HUANG, Yi-Nan SHIH, Chih-Chung LIN, Yun-Chin TSAI
-
Publication number: 20240133467Abstract: A waterproof click pad device includes a click pad, a frame and a waterproof unit. The frame surrounds the click pad and surrounds an axis passing through the click pad. The waterproof unit is transverse to the axis and is in sheet form. The waterproof unit includes a frame adhesive member surrounding the axis and adhered to the frame, a first non-adhesive member surrounding the axis, connected to an inner periphery of the frame adhesive member and spaced apart from and located above the frame, a second non-adhesive member surrounding the axis, connected to an inner periphery of the first non-adhesive member and spaced apart from and located above the click pad and the frame, and an plate adhesive member connected to an inner periphery of the second non-adhesive member and adhered to the click pad.Type: ApplicationFiled: January 4, 2023Publication date: April 25, 2024Applicant: SUNREX TECHNOLOGY CORP.Inventors: Yu-Xiang GENG, Chun-Chieh CHEN, Ling-Cheng TSENG, Yi-Wen TSAI, Ching-Yao HUANG
-
Patent number: 11967272Abstract: A sweep voltage generator and a display panel are provided. The sweep voltage generator includes an output node, a current generating block and a voltage regulating block. The output node is used to provide a sweep signal. The current generating block is coupled to the output node, includes a detection path for detecting an output load variation on the output node, and adjusts the sweep signal provided by the output node based on the output load variation. The voltage regulating block is coupled to the output node for regulating a voltage of the output node.Type: GrantFiled: December 9, 2022Date of Patent: April 23, 2024Assignees: AUO Corporation, National Cheng-Kung UniversityInventors: Chih-Lung Lin, Yi-Chen Huang, Chih-I Liu, Po-Cheng Lai, Ming-Yang Deng, Chia-En Wu, Ming-Hung Chuang, Chia-Tien Peng
-
Patent number: 11967571Abstract: A semiconductor structure and a method of fabricating therefor are disclosed. A second contact pad (500) is arranged lateral to a first contact pad (420) in an interconnect structure (400). As a result, during fabrication of the interconnect structure (400), the first contact pad (420) will not be present alone in a large bland area, due to the presence of the second contact pad (500). Thus, a pattern feature for the first contact pad (420) will not be over-resolved, increasing formation accuracy of the first contact pad (420) and thus guaranteeing good electrical transmission performance of the resulting interconnect structure (400).Type: GrantFiled: March 17, 2020Date of Patent: April 23, 2024Assignee: FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.Inventors: Yi-Wang Jhan, Yung-Tai Huang, Xin You, Xiaopei Fang, Yu-Cheng Tung
-
Patent number: 11965217Abstract: A method and a kit for detecting Mycobacterium tuberculosis are provided. The method includes a step of performing a nested qPCR assay to a specimen. The nested qPCR assay includes a first round of amplification using external primers and a second round of amplification using internal primers and a probe. The external primers have sequences of SEQ ID NOs. 1 and 2, and the internal primers and the probe have sequences of SEQ ID NOs. 3 to 5.Type: GrantFiled: May 24, 2021Date of Patent: April 23, 2024Assignee: DELTA ELECTRONICS, INC.Inventors: Yi-Chen Li, Chih-Cheng Tsou, Min-Hsien Wu, Hsin-Yao Wang, Chien-Ru Lin
-
Patent number: 11966352Abstract: An information handling system with modular riser components for receiving expansion cards having various requirements. The system includes a riser body assembly having a common support structure for receiving expansion cards. The common support structure may be coupled to different expansion structures to provide support of expansion cards having requirements that would not be met by the common support structure alone.Type: GrantFiled: October 8, 2020Date of Patent: April 23, 2024Assignee: Dell Products L.P.Inventors: Yu-Feng Lin, Hao-Cheng Ku, Yi-Wei Lu
-
Publication number: 20240124163Abstract: A magnetic multi-pole propulsion array system is applied to at least one external cathode and includes a plurality of magnetic multi-pole thrusters connected adjacent to each other. Each magnetic multi-pole thruster includes a propellant provider, a discharge chamber, an anode and a plurality of magnetic components. The propellant provider outputs propellant. The discharge chamber is connected with the propellant provider to accommodate the propellant. The anode is disposed inside the discharge chamber to generate an electric field. The plurality of magnetic components is respectively disposed on several sides of the discharge chamber. One of the several sides of the discharge chamber of the magnetic multi-pole thruster is applied for one side of a discharge chamber of another magnetic multi-pole thruster.Type: ApplicationFiled: December 19, 2022Publication date: April 18, 2024Applicant: National Cheng Kung UniversityInventors: Yueh-Heng Li, Yu-Ting Wu, Chao-Wei Huang, Wei-Cheng Lo, Hsun-Chen Hsieh, Ping-Han Huang, Yi-Long Huang, Sheng-Wen Liu, Wei-Cheng Lien
-
Publication number: 20240126633Abstract: A method for responding to a command is adapted for a storage device. The method for responding to a command includes following steps of: sequentially receiving a first command and a second command by a bridge of the storage device from a host; executing the first command and the second command to generate a status completion signal or a status error signal by the bridge; and detecting an error state of at least one of the first command and the second command to execute a response mode or an idle mode by the bridge according to the error state so as to respond to the host.Type: ApplicationFiled: August 14, 2023Publication date: April 18, 2024Inventors: Yi Cheng TSAI, Sung-Kao LIU, Cheng-Yuan HSIAO, Po-Hao CHEN
-
Publication number: 20240126027Abstract: An optical device is provided. The optical device includes a substrate, a waveguide layer, a first input grating, a first fold grating, and an isolation layer. The waveguide layer is disposed on the substrate. The first input grating is disposed in the waveguide layer. A first incident light passes through the first input grating to form a first light. The first fold grating is disposed in the waveguide layer. The first light passes through the first fold grating to form a first diffracted light in a first direction and a second diffracted light in a second direction. The isolation layer includes a first well array and is disposed on the waveguide layer. When the first diffracted light in the first direction travels to a first top portion corresponding to the first well array of the waveguide layer, the first diffracted light further passes through the first well array.Type: ApplicationFiled: October 18, 2022Publication date: April 18, 2024Inventors: Wei-Hsun CHENG, Wei-Ko WANG, Hsin-Yi HSIEH
-
Publication number: 20240127765Abstract: Disclosed are a display device and a backlight control method for the display device. The display device includes a display panel, a backlight source, a first computing unit, and a second computing unit. The display panel includes a first display region and a second display region. The first light-emitting region corresponds to the first display region. The second light-emitting region corresponds to the second display region. The first computing unit calculates a first brightness distribution within a first range. The second computing unit calculates a second brightness distribution within a second range. The first light-emitting region emits light according to the first brightness distribution. The second light-emitting region emits light according to the second brightness distribution.Type: ApplicationFiled: September 11, 2023Publication date: April 18, 2024Applicants: Innolux Corporation, CARUX TECHNOLOGY PTE. LTD.Inventors: Yi-Cheng Chang, Yu-Ming Wu
-
Publication number: 20240127111Abstract: The present disclosure discloses an Internet-of-Things-oriented machine learning container image download system and a method. The Internet-of-Things-oriented machine learning container image download system includes a master node and a plurality of computing nodes; the master node is configured to store and convert a machine learning model, and build a machine learning container image from the format-converted machine learning model; and issue an image download instruction to each of the computing nodes after image information of the machine learning container image is completely built; and each of the computing nodes is configured to receive the image download instruction, download the machine learning container image, and start a machine learning container; and receive data collected by Internet-of-Things devices, and return a data processing result to the Internet-of-Things devices.Type: ApplicationFiled: January 9, 2023Publication date: April 18, 2024Applicant: NANJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONSInventors: Dengyin ZHANG, Zijie LIU, Haoran CHEN, Yi CHENG, Can CHEN, Mengda ZHU, Hui XU
-
Publication number: 20240128378Abstract: A semiconductor device includes a first transistor and a protection structure. The first transistor includes a gate electrode, a gate dielectric disposed on the gate electrode, and a channel layer disposed on the gate dielectric. The protection structure is laterally surrounding the gate electrode, the gate dielectric and the channel layer of the first transistor. The protection structure includes a first capping layer and a dielectric portion. The first capping layer is laterally surrounding and contacting the gate electrode, the gate dielectric and the channel layer of the first transistor. The dielectric portion is disposed on the first capping layer and laterally surrounding the first transistor.Type: ApplicationFiled: January 30, 2023Publication date: April 18, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Cheng Chu, Chien-Hua Huang, Yu-Ming Lin, Chung-Te Lin
-
Publication number: 20240130104Abstract: A semiconductor structure including a substrate, a first dielectric layer disposed on the substrate, a second dielectric layer disposed on the first dielectric layer and in physical contact with the first dielectric layer, an opening on the substrate and having a lower portion through the first dielectric layer and an upper portion through the second dielectric layer, an conductive layer disposed on the second dielectric layer at two sides of the opening and in physical contact with the second dielectric layer, a contact structure disposed in the lower portion of the opening, and a passivation layer covering a top surface of the contact structure, a sidewall of the second dielectric layer, and a sidewall of the conductive layer.Type: ApplicationFiled: December 27, 2023Publication date: April 18, 2024Applicant: Fujian Jinhua Integrated Circuit Co., Ltd.Inventors: Yi-Wang Jhan, Fu-Che Lee, Gang-Yi Lin, An-Chi Liu, Yifei Yan, Yu-Cheng Tung
-
Patent number: 11962100Abstract: A dual-band antenna module includes a first antenna structure and a second antenna structure. The first antenna structure includes a first insulating substrate, a conductive metal layer, a plurality of grounding supports, and a first feeding pin. The second antenna structure includes a second insulating substrate, a top metal layer, a bottom metal layer, and a second feeding pin. The conductive metal layer is disposed on the first insulating substrate. The grounding supports are configured for supporting the first insulating substrate. The second insulating substrate is disposed above the first insulating substrate. The top metal layer and the bottom metal layer are respectively disposed on a top side and a bottom side of the second insulating substrate. The first frequency band signal transmitted or received by the first antenna structure is smaller than the second frequency band signal transmitted or received by the second antenna structure.Type: GrantFiled: August 7, 2022Date of Patent: April 16, 2024Assignee: Taiwan Inpaq electronic Co., Ltd.Inventors: Ta-Fu Cheng, Shou-Jen Li, Cheng-Yi Wang, Chih-Ming Su
-
Patent number: 11962847Abstract: A channel hiatus correction method for an HDMI device is provided. A recovery code from scrambled data of the stream is obtained. A liner feedback shift register (LFSR) value of channels of the HDMI port is obtained based on the recovery code and the scrambled data of the stream. The stream is de-scrambled according to the LFSR value of the channels of the HDMI port. Video data is displayed according to the de-scrambled stream.Type: GrantFiled: November 9, 2022Date of Patent: April 16, 2024Assignee: MEDIATEK INC.Inventors: Chia-Hao Chang, You-Tsai Jeng, Kai-Wen Yeh, Yi-Cheng Chen, Te-Chuan Wang, Kai-Wen Cheng, Chin-Lung Lin, Tai-Lai Tung, Ko-Yin Lai
-
Patent number: 11961714Abstract: A substrate processing apparatus comprises a chamber member that defines an interior volume that has an aspect ratio. The chamber member comprises a pair of laterally opposing inlet walls and a loading port. Each of the pair of laterally opposing inlet walls has an inlet port configured to receive output from a remote plasma source. The loading port is arranged between the pair of inlet walls, configured to allow passage of a substrate into the interior volume.Type: GrantFiled: May 31, 2021Date of Patent: April 16, 2024Assignee: LINCO TECHNOLOGY CO., LTD.Inventors: Yi-Yuan Huang, Yi-Cheng Liu
-
Patent number: 11960720Abstract: A data processing method implemented by a network interface card device, wherein the method comprises receiving, from a first client, a first access request carrying an access address, detecting whether the first access request has a conflict; and processing the conflict according to a processing policy when the network interface card device detects that the first access request has a conflict.Type: GrantFiled: September 6, 2022Date of Patent: April 16, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Yong Shen, Yi He, Tao Cheng, Li Li
-
Patent number: 11961739Abstract: Embodiments of the present technology include semiconductor processing methods to make boron-and-silicon-containing layers that have a changing atomic ratio of boron-to-silicon. The methods may include flowing a silicon-containing precursor into a substrate processing region of a semiconductor processing chamber, and also flowing a boron-containing precursor and molecular hydrogen (H2) into the substrate processing region of the semiconductor processing chamber. The boron-containing precursor and the H2 may be flowed at a boron-to-hydrogen flow rate ratio. The flow rate of the boron-containing precursor and the H2 may be increased while the boron-to-hydrogen flow rate ratio remains constant during the flow rate increase. The boron-and-silicon-containing layer may be deposited on a substrate, and may be characterized by a continuously increasing ratio of boron-to-silicon from a first surface in contact with the substrate to a second surface of the boron-and-silicon-containing layer furthest from the substrate.Type: GrantFiled: October 5, 2020Date of Patent: April 16, 2024Assignee: Applied Materials, Inc.Inventors: Yi Yang, Krishna Nittala, Rui Cheng, Karthik Janakiraman, Diwakar Kedlaya, Zubin Huang, Aykut Aydin
-
Patent number: D1023935Type: GrantFiled: March 18, 2022Date of Patent: April 23, 2024Assignee: Acer IncorporatedInventors: Ya-Hao Chan, Yi-Heng Lee, Ming-Cheng Wu, Chun-Yu Chen