Patents by Inventor Yi Cheng Wang
Yi Cheng Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240154447Abstract: A power system including a first battery pack, a second battery pack, and a power management circuit is disclosed. The first battery pack has a first end and a second end, and has a first battery capacity. The second battery pack has a third end and a fourth end. The third end is coupled to the second end of the first battery pack and provides a low battery voltage. The fourth end is grounded, the second battery pack has a second battery capacity, and the second battery capacity is greater than the first battery capacity. The power management circuit is coupled to the second battery pack to receive the low battery voltage, and provides a component operating voltage to an electronic components based on the low battery voltage.Type: ApplicationFiled: August 29, 2023Publication date: May 9, 2024Applicant: PEGATRON CORPORATIONInventors: Yi-Hsuan Lee, Liang-Cheng Kuo, Chun-Wei Ko, Ya Ju Cheng, Chih Wei Huang, Ywh Woei Yeh, Yu Cheng Lin, Yen Ting Wang
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Publication number: 20240155185Abstract: A channel hiatus correction method for an HDMI device is provided. A recovery code from scrambled data of the stream is obtained. A liner feedback shift register (LFSR) value of channels of the HDMI port is obtained based on the recovery code and the scrambled data of the stream. The stream is de-scrambled according to the LFSR value of the channels of the HDMI port. Video data is displayed according to the de-scrambled stream.Type: ApplicationFiled: November 9, 2022Publication date: May 9, 2024Inventors: Chia-Hao CHANG, You-Tsai JENG, Kai-Wen YEH, Yi-Cheng CHEN, Te-Chuan WANG, Kai-Wen CHENG, Chin-Lung LIN, Tai-Lai TUNG, Ko-Yin LAI
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Publication number: 20240144098Abstract: Aspects of the present disclosure provide an automated labeling system. For example, the automated labeling system can include an automated labeling module (ALM) configured to receive wireless signals and ground truth of learning object and label the wireless signals with the ground truth when receiving the ground truth to generate labeled training data. The automated labeling system can also include a training database coupled to the ALM. The training database can be configured to store the labeled training data.Type: ApplicationFiled: October 16, 2023Publication date: May 2, 2024Applicant: MEDIATEK INC.Inventors: Chao Peng WANG, Chia-Da LEE, Po-Yu CHEN, Hsiao-Chien CHIU, Yi-Cheng LU
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Publication number: 20240136346Abstract: A semiconductor die package includes an inductor-capacitor (LC) semiconductor die that is directly bonded with a logic semiconductor die. The LC semiconductor die includes inductors and capacitors that are integrated into a single die. The inductors and capacitors of the LC semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. The integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.Type: ApplicationFiled: April 17, 2023Publication date: April 25, 2024Inventors: Chien Hung LIU, Yu-Sheng CHEN, Yi Ching ONG, Hsien Jung CHEN, Kuen-Yi CHEN, Kuo-Ching HUANG, Harry-HakLay CHUANG, Wei-Cheng WU, Yu-Jen WANG
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Patent number: 11965217Abstract: A method and a kit for detecting Mycobacterium tuberculosis are provided. The method includes a step of performing a nested qPCR assay to a specimen. The nested qPCR assay includes a first round of amplification using external primers and a second round of amplification using internal primers and a probe. The external primers have sequences of SEQ ID NOs. 1 and 2, and the internal primers and the probe have sequences of SEQ ID NOs. 3 to 5.Type: GrantFiled: May 24, 2021Date of Patent: April 23, 2024Assignee: DELTA ELECTRONICS, INC.Inventors: Yi-Chen Li, Chih-Cheng Tsou, Min-Hsien Wu, Hsin-Yao Wang, Chien-Ru Lin
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Patent number: 11962847Abstract: A channel hiatus correction method for an HDMI device is provided. A recovery code from scrambled data of the stream is obtained. A liner feedback shift register (LFSR) value of channels of the HDMI port is obtained based on the recovery code and the scrambled data of the stream. The stream is de-scrambled according to the LFSR value of the channels of the HDMI port. Video data is displayed according to the de-scrambled stream.Type: GrantFiled: November 9, 2022Date of Patent: April 16, 2024Assignee: MEDIATEK INC.Inventors: Chia-Hao Chang, You-Tsai Jeng, Kai-Wen Yeh, Yi-Cheng Chen, Te-Chuan Wang, Kai-Wen Cheng, Chin-Lung Lin, Tai-Lai Tung, Ko-Yin Lai
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Patent number: 11962296Abstract: Disclosed herein is a flexible sensing interface, comprising: a sensor, comprising: a core; an inner electrode in the form of a conductive material in contact with the core; an inner dielectric material substantially encasing the inner electrode; an outer electrode in the form of a conductive material in contact with the inner dielectric material and in electrical communication with the inner electrode; and an outer dielectric material substantially encasing the outer electrode; wherein the inner dielectric material and the outer dielectric material comprise an elastic material. Also disclosed herein are systems and methods for making and using the same.Type: GrantFiled: August 21, 2019Date of Patent: April 16, 2024Assignee: Georgia Tech Research CorporationInventors: Seyedeh Fereshteh Shahmiri, Chaoyu Chen, Gregory D. Abowd, Shivan Mittal, Thad Eugene Starner, Yi-Cheng Wang, Zhong Lin Wang, Dingtian Zhang, Steven L. Zhang, Anandghan Waghmare
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Publication number: 20240112959Abstract: A method of fabricating a device includes forming a dummy gate over a plurality of fins. Thereafter, a first portion of the dummy gate is removed to form a first trench that exposes a first hybrid fin and a first part of a second hybrid fin. The method further includes filling the first trench with a dielectric material disposed over the first hybrid fin and over the first part of the second hybrid fin. Thereafter, a second portion of the dummy gate is removed to form a second trench and the second trench is filled with a metal layer. The method further includes etching-back the metal layer, where a first plane defined by a first top surface of the metal layer is disposed beneath a second plane defined by a second top surface of a second part of the second hybrid fin after the etching-back the metal layer.Type: ApplicationFiled: December 1, 2023Publication date: April 4, 2024Inventors: Kuan-Ting PAN, Zhi-Chang LIN, Yi-Ruei JHAN, Chi-Hao WANG, Huan-Chieh SU, Shi Ning JU, Kuo-Cheng CHIANG
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Patent number: 11943373Abstract: An identity certificate may be issued to a blockchain node. The issuance may include issuing a first identity certificate to a first terminal and receiving a second identity certificate issuance request that is from the first terminal. A second identity certificate may be issued to the first terminal, and a third identity certificate issuance request is received from the second terminal. A third identity certificate is issued to the second terminal, so that the second terminal forwards the third identity certificate to the third terminal.Type: GrantFiled: June 2, 2021Date of Patent: March 26, 2024Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITEDInventors: Mao Cai Li, Zong You Wang, Kai Ban Zhou, Chang Qing Yang, Hu Lan, Li Kong, Jin Song Zhang, Yi Fang Shi, Geng Liang Zhu, Qu Cheng Liu, Qiu Ping Chen
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Publication number: 20240088026Abstract: A semiconductor device according to embodiments of the present disclosure includes a first die including a first bonding layer and a second die including a second hybrid bonding layer. The first bonding layer includes a first dielectric layer and a first metal coil embedded in the first dielectric layer. The second bonding layer includes a second dielectric layer and a second metal coil embedded in the second dielectric layer. The second hybrid bonding layer is bonded to the first hybrid bonding layer such that the first dielectric layer is bonded to the second dielectric layer and the first metal coil is bonded to the second metal coil.Type: ApplicationFiled: January 17, 2023Publication date: March 14, 2024Inventors: Yi Ching Ong, Wei-Cheng Wu, Chien Hung Liu, Harry-Haklay Chuang, Yu-Sheng Chen, Yu-Jen Wang, Kuo-Ching Huang
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Patent number: 11647340Abstract: A vibration transducer for sensing vibrations includes a first flexible triboelectric member, a second flexible triboelectric member, a plurality of attachment points, a first electrode and a second electrode. The first flexible triboelectric member includes a first triboelectric layer and a material being on a first position on a triboelectric series. A conductive layer is deposited on the second side thereof. The second flexible triboelectric member includes a second triboelectric layer and a material being on a second position on the triboelectric series that is different from the first position on the triboelectric series. The second triboelectric member is adjacent to the first flexible triboelectric member. When the first triboelectric member comes into and out of contact with the second triboelectric member as a result of the vibrations, a triboelectric potential difference having a variable intensity corresponding to the vibrations can be sensed between the first and second triboelectric members.Type: GrantFiled: January 18, 2021Date of Patent: May 9, 2023Assignee: Georgia Tech Research CorporationInventors: Nivedita Arora, Gregory D. Abowd, Mohit Gupta, Diego Osorio, Seyedeh Fereshteh Shahmiri, Thad Eugene Starner, Yi-Cheng Wang, Zhengjun Wang, Zhong Lin Wang, Steven L Zhang, Peter McAughan, Qiuyue Xue, Dhruva Bansal, Ryan Bahr, Emmanouil Tentzeris
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Publication number: 20230049638Abstract: Disclosed are a material pushing apparatus and a charging method thereof, and a material pushing machine and a material pushing method thereof. The material pushing apparatus comprises a charger (200) and a material pushing machine (100), and when the material pushing machine moves to the position where the charger is located, the charger can automatically supplement electric energy to the material pushing machine, such that the automation level of the material pushing apparatus is improved.Type: ApplicationFiled: May 19, 2020Publication date: February 16, 2023Inventors: LIANG CHEN, CHAO ZHENG, WEI ZHOU, YI-CHENG WANG, Di Wu, Yuan Yao, XUE-SONG WANG, SHENG LUO, XIAO-FENG ZHOU
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Patent number: 11567051Abstract: Nanoreactors comprising a metal precursor in a carrier are provided as well as methods of initiating, methods of preparing, and methods of using nanoreactors. In some embodiments, upon exposure to heat, the metal precursor forms nanoparticles that can be detected, e.g., by detecting a color change in the nanoreactor and/or by detecting the number and/or size and/or size distribution and/or shape of the nanoparticles. The nanoreactors can be used, in some embodiments, as time-temperature indicators for perishable goods.Type: GrantFiled: March 3, 2020Date of Patent: January 31, 2023Assignee: WISCONSIN ALUMNI RESEARCH FOUNDATIONInventors: Sundaram Gunasekaran, Yi-Cheng Wang
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Publication number: 20210320657Abstract: Disclosed herein is a flexible sensing interface, comprising: a sensor, comprising: a core; an inner electrode in the form of a conductive material in contact with the core; an inner dielectric material substantially encasing the inner electrode; an outer electrode in the form of a conductive material in contact with the inner dielectric material and in electrical communication with the inner electrode; and an outer dielectric material substantially encasing the outer electrode; wherein the inner dielectric material and the outer dielectric material comprise an elastic material. Also disclosed herein are systems and methods for making and using the same.Type: ApplicationFiled: August 21, 2019Publication date: October 14, 2021Inventors: Seyedeh Fereshteh Shahmiri, Chaoyu Chen, Gregory D. Abowd, Shivan Mittal, Thad Eugene Starner, Yi-Cheng Wang, Zhong Lin Wang, Dingtian Zhang, Steven L. Zhang, Anandghan Waghmare
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Publication number: 20210281955Abstract: A vibration transducer for sensing vibrations includes a first flexible triboelectric member, a second flexible triboelectric member, a plurality of attachment points, a first electrode and a second electrode. The first flexible triboelectric member includes a first triboelectric layer and a material being on a first position on a triboelectric series. A conductive layer is deposited on the second side thereof. The second flexible triboelectric member includes a second triboelectric layer and a material being on a second position on the triboelectric series that is different from the first position on the triboelectric series. The second triboelectric member is adjacent to the first flexible triboelectric member. When the first triboelectric member comes into and out of contact with the second triboelectric member as a result of the vibrations, a triboelectric potential difference having a variable intensity corresponding to the vibrations can be sensed between the first and second triboelectric members.Type: ApplicationFiled: January 18, 2021Publication date: September 9, 2021Inventors: Nivedita Arora, Gregory D. Abowd, Mohit Gupta, Diego Osorio, Seyedeh Fereshteh Shahmiri, Thad Eugene Starner, Yi-Cheng Wang, Zhengjun Wang, Zhong Lin Wang, Steven L Zhang, Peter McAughan, Qiuyue Xue, Dhruva Bansal, Ryan Bahr, Emmanouil Tentzeris
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Patent number: 10932063Abstract: A vibration transducer for sensing vibrations includes a first flexible triboelectric member, a second flexible triboelectric member, a plurality of attachment points, a first electrode and a second electrode. The first flexible triboelectric member includes a first triboelectric layer and a material being on a first position on a triboelectric series. A conductive layer is deposited on the second side thereof. The second flexible triboelectric member includes a second triboelectric layer and a material being on a second position on the triboelectric series that is different from the first position on the triboelectric series. The second triboelectric member is adjacent to the first flexible triboelectric member. When the first triboelectric member comes into and out of contact with the second triboelectric member as a result of the vibrations, a triboelectric potential difference having a variable intensity corresponding to the vibrations can be sensed between the first and second triboelectric members.Type: GrantFiled: May 29, 2019Date of Patent: February 23, 2021Assignee: Georgia Tech Research CorporationInventors: Nivedita Arora, Gregory D. Abowd, Mohit Gupta, Diego Osorio, Seyedeh Fereshteh Shahmiri, Thad Eugene Starner, Yi-Cheng Wang, Zhengjun Wang, Zhong Lin Wang, Steven L Zhang, Peter McAughan, Qiuyue Xue, Dhruva Bansal, Ryan Bahr, Emmanouil Tentzeris
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Publication number: 20200278335Abstract: Nanoreactors comprising a metal precursor in a carrier are provided as well as methods of initiating, methods of preparing, and methods of using nanoreactors. In some embodiments, upon exposure to heat, the metal precursor forms nanoparticles that can be detected, e.g., by detecting a color change in the nanoreactor and/or by detecting the number and/or size and/or size distribution and/or shape of the nanoparticles. The nanoreactors can be used, in some embodiments, as time-temperature indicators for perishable goods.Type: ApplicationFiled: March 3, 2020Publication date: September 3, 2020Applicant: Wisconsin Alumni Research FoundationInventors: Sundaram Gunasekaran, Yi-Cheng Wang
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Patent number: 10578598Abstract: Nanoreactors comprising a metal precursor in a carrier are provided as well as methods of initiating, methods of preparing, and methods of using nanoreactors. In some embodiments, upon exposure to heat, the metal precursor forms nanoparticles that can be detected, e.g., by detecting a color change in the nanoreactor and/or by detecting the number and/or size and/or size distribution and/or shape of the nanoparticles. The nanoreactors can be used, in some embodiments, as time-temperature indicators for perishable goods.Type: GrantFiled: June 8, 2016Date of Patent: March 3, 2020Assignee: Wisconsin Alumni Research FoundationInventors: Sundaram Gunasekaran, Yi-Cheng Wang
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Publication number: 20190373375Abstract: A vibration transducer for sensing vibrations includes a first flexible triboelectric member, a second flexible triboelectric member, a plurality of attachment points, a first electrode and a second electrode. The first flexible triboelectric member includes a first triboelectric layer and a material being on a first position on a triboelectric series. A conductive layer is deposited on the second side thereof. The second flexible triboelectric member includes a second triboelectric layer and a material being on a second position on the triboelectric series that is different from the first position on the triboelectric series. The second triboelectric member is adjacent to the first flexible triboelectric member. When the first triboelectric member comes into and out of contact with the second triboelectric member as a result of the vibrations, a triboelectric potential difference having a variable intensity corresponding to the vibrations can be sensed between the first and second triboelectric members.Type: ApplicationFiled: May 29, 2019Publication date: December 5, 2019Inventors: Nivedita Arora, Gregory D. Abowd, Mohit Gupta, Diego Osorio, Seyedeh Fereshteh Shahmiri, Thad Eugene Starner, Yi-Cheng Wang, Zhengjun Wang, Zhong Lin Wang, Steven L Zhang, Peter McAughan, Qiuyue Xue, Dhruva Bansal, Ryan Bahr, Emmanouil Tentzeris
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Patent number: 10242863Abstract: A substrate processing apparatus for processing a wafer including a temporary substrate and a semiconductor device. The substrate processing apparatus includes a first half portion, a second half portion and a liquid supply unit. The first half portion includes a working platform. The second half portion includes an upper cover having a first surface and a plurality of second holes. The liquid supply unit provides a liquid. The wafer is placed on the working platform, and a second surface of the semiconductor device and the first surface are spaced by a distance sufficient for allowing the liquid to come into contact with the first surface when the liquid flows at the second surface to generate a suction force on the second surface. As such, a peel force is formed between the temporary substrate and the semiconductor device to cause the two to separate from each other.Type: GrantFiled: October 3, 2016Date of Patent: March 26, 2019Assignees: WET TECHNOLOGY CO., LTD.Inventor: Yi-Cheng Wang