Abstract: A PWM comprises a voltage transformation module, a voltage-sensing module and a timer. The voltage transformation module is configured to transform an input voltage into an output voltage. The voltage-sensing module is coupled to the voltage transformation module and configured to detect a voltage of a first terminal, wherein the voltage of the first terminal is proportional to the output voltage. The timer is configured to measure the time duration for which the voltage of the first terminal is lower than a reference voltage, wherein the timer initiates a short circuit signal when the time duration is greater than a predetermined value.

Abstract: A PWM comprises a voltage transformation module, a voltage-sensing module and a timer. The voltage transformation module is configured to transform an input voltage into an output voltage. The voltage-sensing module is coupled to the voltage transformation module and configured to detect a voltage of a first terminal, wherein the voltage of the first terminal is proportional to the output voltage. The timer is configured to measure the time duration for which the voltage of the first terminal is lower than a reference voltage, wherein the timer initiates a short circuit signal when the time duration is greater than a predetermined value.

Abstract: A feedback signal sensing method includes the steps of: providing a pulse width modulation (PWM) signal having a period; charging a capacitor by a current source during a pulse duration of the period, so as to form an equivalent slope compensation ramp signal; conducting an inductor current flowing from a boost inductor to flow through an equivalent resistor during the pulse duration of the period, so as to form an equivalent inductor current signal; and using a coupling characteristic of the capacitor together with the equivalent slope compensation ramp signal and the equivalent inductor current signal to form a feedback signal.

Abstract: An apparatus for substrate processing, mainly includes a processing unit and a fluid supply unit. The processing unit includes a platform for laying a substrate. The platform includes a plurality of injection holes defined thereon, the injection holes obliquely and downwardly extend from a top surface of the platform. The fluid supply unit includes a plurality of containers containing fluids for supplying to the processing unit and fluid-connected to the injection holes of the platform. The fluids from the fluid supply unit can be obliquely injected out from the injection holes and slightly floats and moves the substrate over the platform and reacts with the substrate.

Abstract: A dimming method for light emitting diodes (LEDs), which is applied in a pulse width modulation boost circuit system, includes the following steps: (a) equally dividing a cycle into a plurality of intervals; (b) providing a plurality of control signals having the cycle and a pulse duration, wherein the pulse duration of each of the control signals is sequentially generated in the cycle; and (c) using the plurality of control signals to control a plurality of corresponding switches for dimming the LEDs connected to the switches.

Abstract: A feedback signal sensing method includes the steps of: providing a pulse width modulation (PWM) signal having a period; charging a capacitor by a current source during a pulse duration of the period, so as to form an equivalent slope compensation ramp signal; conducting an inductor current flowing from a boost inductor to flow through an equivalent resistor during the pulse duration of the period, so as to form an equivalent inductor current signal; and using a coupling characteristic of the capacitor together with the equivalent slope compensation ramp signal and the equivalent inductor current signal to form a feedback signal.

Abstract: A system and a method for manufacturing process is provided, in which the fluid used to process the processed component is also used to move the processed component through the steps during the process. The system includes a chemical supply unit, a processing platform, and a control unit. The chemical supply unit is a device for supplying a chemical fluid to react with the processed component, as well as clean water or air that may be required in the process. The processing platform receives the chemical fluid, water and air from the chemical supply unit and provides a processing environment to process the processed component. The processing platform is designed to work with the chemical supply unit so that the chemical fluid can be supplied to the processing platform to move and react with the processed component. The control unit is a programmable electronic device.

Abstract: A MOS circuit arrangement includes a silicon substrate, a semiconductor device, a field oxide layer, and a poly-protective layer. The silicon substrate has a conductive doping incorporated therein, wherein the semiconductor device is electrically connected with the silicon substrate. The field oxide layer is formed on the silicon substrate at a position spaced apart from the terminal of the semiconductor device to form an active region between the field oxide layer and the semiconductor device. The poly-protective layer deposited on the active region to communicate the field oxide layer with the terminal of the semiconductor device, wherein the poly-protective layer provides a junction breakdown path between the semiconductor device and the silicon substrate to increase a junction breakdown voltage of the semiconductor device.

Abstract: A chemical etching process and apparatus includes a control unit, an etching unit, an etchant supply unit and an air supply unit. The control unit has a programmable electronic device through which various process parameters are input to control the operations of the etching unit, the etchant supply unit and the air supply unit. The etching unit has an etching table incorporated with the etchant supply unit and the air supply unit for providing a proper etching environment for a working object to be etched. The etchant supply unit is equipped with flow control valves and electromagnetic valves respectively for controlling the flow rate and the on/off operation of etchant supply through the control unit. Also, the air supply unit is equipped with flow control valves and electromagnetic valves respectively for controlling the flow rate and the on/off operation of air supply through the control unit.