Patents by Inventor Yi-Chieh Chen

Yi-Chieh Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12641757
    Abstract: An example method for providing cooling capacity and reducing power consumption of a server assembly is disclosed. The method includes receiving temperature information corresponding to a CPU of an electrical component in the server assembly, which further includes an equipment room, and a cabinet fan module positioned adjacent to a side of the equipment room. The cabinet fan module includes electric fans therein, and the electrical component is implemented in the equipment room. The method includes determining a current power level of the CPU, and determining, using the temperature information and the current power level, a first operating speed for the electric fans. Furthermore, the method includes combining the first operating speed with a second operating speed received from a proportional-integral-derivative controller to determine a combined operating speed. The method still further includes instructing the electric fans to operate at the combined operating speed.
    Type: Grant
    Filed: June 15, 2023
    Date of Patent: May 26, 2026
    Assignee: Quanta Computer Inc.
    Inventors: Yi-Chieh Chen, Yueh-Chang Wu, Yan-Kuei Chen, Yi-Ta Hsu
  • Publication number: 20260122856
    Abstract: A fanless, sealed computer chassis for use in hot environments is disclosed. The chassis can include a chassis body having an outer wall and an inner wall. The outer wall can include external heat-dissipating features, such as fins. The chassis can include a dividing wall extending perpendicularly from the inner wall. A hot side of a thermoelectric cooler can be thermally coupled to the inner wall on one side of the dividing wall. A printed circuit board (PCB) can be secured to the chassis such that the dividing wall contacts the PCB (e.g., via a sealing layer) to divide the chassis' interior into a first enclosed space and a second enclosed space. The first enclosed space can include the thermoelectric cooler and one or more heat-susceptible components, while the second enclosed space can include one or more heat-tolerant components.
    Type: Application
    Filed: October 30, 2024
    Publication date: April 30, 2026
    Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG, Wei-Ju CHEN
  • Publication number: 20260118855
    Abstract: Methods and systems for artificial intelligence (AI)-based bias prediction for run-to-run (R2R) process control are provided. A process recipe and a target outcome of a substrate process to be performed using one or more manufacturing equipment are identified. The process recipe and the target outcome are provided as an input to a machine learning model trained to predict biases of current substrate processes performed using manufacturing equipment in view of prior substrate processes performed using the manufacturing equipment. One or more outputs of the machine learning model are obtained, where the one or more outputs include a bias of the substrate process in view of one or more prior substrate processes performed using the manufacturing equipment. One or more settings of the process recipe are updated based on the bias.
    Type: Application
    Filed: January 27, 2025
    Publication date: April 30, 2026
    Inventor: Yi-Chieh Chen
  • Publication number: 20260089891
    Abstract: An expansion card bracket for allowing operation of an expansion card in extreme cold conditions is disclosed. The expansion card bracket includes a base plate having a top surface to hold the expansion card. An aperture is formed through the base plate. A heater module with a thin film heater is attached to the base plate. The heater module is aligned with the aperture to heat an area of the expansion card. A thermal pad is inserted between the thin film heater and the expansion card. The expansion card bracket allows the heater module to be attached after the installation of the expansion card to allow for better thermal transmission and to prevent inadvertent damage or misalignment of the thermal pad.
    Type: Application
    Filed: September 26, 2024
    Publication date: March 26, 2026
    Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG, Wei-Ju CHEN, Chia-Ching CHU
  • Publication number: 20260020183
    Abstract: An immersion cooling system includes a tank configured to hold liquid coolant and one or more instances of computer equipment submerged within the liquid coolant The tank is configured to have a first tank inlet, a second tank inlet, and a tank outlet. The immersion cooling system further includes a pump configured to have a pump inlet and a pump outlet coupled to the first tank inlet. The immersion cooling system further includes a coolant distribution unit (CDU) configured to have a distribution inlet coupled to the tank outlet and a distribution outlet that is coupled to the second tank inlet and the pump inlet.
    Type: Application
    Filed: July 9, 2024
    Publication date: January 15, 2026
    Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG, Tzu-Hsuan HSU, Tzu-Chun YANG
  • Patent number: 12505821
    Abstract: An example compute cabinet assembly includes an equipment room, an air inlet channel coupled to the equipment room, and a cabinet fan module coupled to the equipment room. The compute cabinet assembly further includes first and second air outlet channels. The first air outlet channel extends along a side of the equipment room towards an outlet of the first air outlet channel. The second air outlet channel extends along another side of the equipment room towards an outlet of the second air outlet channel. The compute cabinet assembly also includes electric fans positioned in the cabinet fan module. The electric fans are configured to create airflow originating at an inlet of the air inlet channel, extending through the equipment room and cabinet fan module, and exiting the compute cabinet assembly at the outlets of the first and second air outlet channels.
    Type: Grant
    Filed: February 7, 2023
    Date of Patent: December 23, 2025
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yi-Chieh Chen, Yueh-Chang Wu, Te-Chuan Wang, Tzu-Hsuan Hsu
  • Patent number: 12471239
    Abstract: An example assembly includes an equipment room, a cabinet fan module having fans, and a processor configured to execute logic. Temperature sensors are positioned in the air inlet channel and the equipment room. An electrical component having an air inlet area is also positioned in the equipment room. The logic causes the fans to operate at a predetermined speed, and compare a temperature in the air inlet channel with a temperature at the air inlet area. In response to determining that the temperature at the air inlet area is greater than the temperature in the air inlet channel plus a constant value, the operating speed of the fans is increased. Moreover, the operating speed of the fans is decreased in response to determining that the ambient temperature in the air inlet channel plus a constant value is greater than or equal to the temperature at the air inlet area.
    Type: Grant
    Filed: February 7, 2023
    Date of Patent: November 11, 2025
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yi-Chieh Chen, Yueh-Chang Wu, Te-Chuan Wang, Tzu-Hsuan Hsu
  • Publication number: 20250338457
    Abstract: A coolant leak detection and protection system for rack mounted servers is disclosed. The system includes an inlet coolant tube and a feeder coolant tube for supplying coolant to a cold plate that is thermally in contact with a heat generating component. An outlet coolant tube collects coolant from the cold plate. A three-way valve has a first port coupled to the inlet coolant tube, a second port coupled to the feeder coolant tube, and a third port coupled to a bypass tube fluidly connected to the outlet coolant tube. A controller is coupled to a leak sensor and the three-way valve. The controller is operable to detect a leak based on a signal from the leak sensor. The controller controls the three-way valve to fluidly connect the second port to the third port to cut off coolant flow from the inlet coolant tube when a leak is detected.
    Type: Application
    Filed: April 30, 2024
    Publication date: October 30, 2025
    Inventors: Yi-Chieh CHEN, Te-Chuan WANG, Shao-Yu CHIU, Tzu-Hsuan HSU
  • Publication number: 20250328175
    Abstract: A computing system is disclosed. The computing system includes a system chassis configured to perform as a heatsink; a printed circuit board (PCB) enclosed within the system chassis; a central processing unit (CPU) mounted on the PCB within the system chassis; a film heater enclosed within the system chassis, the film heater being configured to generate heat for maintaining the CPU within an operable temperature range; and a heat spreader mounted between the CPU and the film heater. The heat spreader is configured to conduct the heat from the film heater to the CPU without affecting the layout of the PCB.
    Type: Application
    Filed: April 17, 2024
    Publication date: October 23, 2025
    Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG, Samuel CHATELIER
  • Publication number: 20250273531
    Abstract: An electronic structure includes a package structure, a first heat dissipating structure and a second heat dissipating structure. The package structure has a top surface including a first region and a second region. A first predetermined temperature at the first region is higher than a second predetermined temperature at the second region. The first heat dissipating structure includes a first portion disposed on the first region. The second heat dissipating structure includes a first portion disposed on the second region. The first portion of the first heat dissipating structure and the first portion of the second heat dissipating structure are concurrently formed through a 3D printing technique. A thickness of the first portion of the first heat dissipating structure is greater than a thickness of the first portion of the second heat dissipating structure.
    Type: Application
    Filed: February 23, 2024
    Publication date: August 28, 2025
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hong-Te LIEN, Yi-Chieh CHEN, Wen Hung HUANG, Yu-Hsun CHANG
  • Publication number: 20250227873
    Abstract: An example compute cabinet assembly includes an equipment room configured to implement electrical components therein, an air inlet channel coupled to a first side of the equipment room, and a cabinet fan module coupled to a second side of the equipment room opposite the first side. A first air outlet channel is coupled to the cabinet fan module and extends along a third side of the equipment room towards a first outlet of the first air outlet channel. Moreover, electric fans are positioned in the cabinet fan module, the electric fans being configured to create an airflow path originating at an inlet of the air inlet channel. The airflow path further extends through the equipment room and cabinet fan module. A guide plate is also positioned adjacent to an inlet of the equipment room, the guide plate being configured to uniformly distribute the airflow path through the equipment room.
    Type: Application
    Filed: March 27, 2025
    Publication date: July 10, 2025
    Inventors: Yi-Chieh CHEN, Yueh-Chang Wu, Te-Chuan Wang, Tzu-Hsuan Hsu
  • Publication number: 20250189942
    Abstract: A static auto-tuning system and method for controlling operation of a motor in a system. A speed reference signal is generated resulting in a speed response of the motor. Closed-loop feedback magnifies the rotating friction effect to an observable level. Inertia and rotating friction coefficient values of the system are estimated based on the speed frequency response and a virtual damping coefficient. A fixed low frequency speed signal may result in a first frequency response function for determining virtual damping, and a variable frequency excitation signal may result in a second frequency response function for determining the inertia and rotating friction characteristics. Closed-loop gains are determined based on these characteristics. The excitation signal may be sampled and a peak value in each interval may be identified and stored to produce an envelope of peak values for determining the gain response. Operation of the motor is controlled using the determined gains.
    Type: Application
    Filed: February 14, 2025
    Publication date: June 12, 2025
    Applicant: Nidec Motor Corporation
    Inventors: Athanasios Sarigiannidis, Bo-Ting Lyu, Yi-Chieh Chen, Shih-Chin Yang
  • Patent number: 12317449
    Abstract: A structure for protecting an electronic component from coolant leaking from a liquid cooling system is disclosed. The liquid cooling system has a manifold collecting and supplying coolant to a cold plate via inlet and outlet tubes. The cold plate is mounted over a heat-generating component on a circuit board. The structure includes a drip tray having a top surface and a length approximately the distance between the manifold and the cold plate. The drip tray includes a trough for collection of leaking coolant. The tray is inserted between the circuit board and the inlet and outlet tubes.
    Type: Grant
    Filed: August 2, 2022
    Date of Patent: May 27, 2025
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yi-Chieh Chen, Yueh-Chang Wu, Yan-Kuei Chen, Yu-Hung Wang
  • Patent number: 12289858
    Abstract: An example compute cabinet assembly includes an equipment room configured to implement electrical components therein, an air inlet channel coupled to a first side of the equipment room, and a cabinet fan module coupled to a second side of the equipment room opposite the first side. A first air outlet channel is coupled to the cabinet fan module and extends along a third side of the equipment room towards a first outlet of the first air outlet channel. Moreover, electric fans are positioned in the cabinet fan module, the electric fans being configured to create an airflow path originating at an inlet of the air inlet channel. The airflow path further extends through the equipment room and cabinet fan module. A guide plate is also positioned adjacent to an inlet of the equipment room, the guide plate being configured to uniformly distribute the airflow path through the equipment room.
    Type: Grant
    Filed: February 7, 2023
    Date of Patent: April 29, 2025
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yi-Chieh Chen, Yueh-Chang Wu, Te-Chuan Wang, Tzu-Hsuan Hsu
  • Patent number: 12235615
    Abstract: A static auto-tuning system and method for controlling operation of a motor in a system. A speed reference signal is generated resulting in a speed response of the motor. Closed-loop feedback magnifies the rotating friction effect to an observable level. Inertia and rotating friction coefficient values of the system are estimated based on the speed frequency response and a virtual damping coefficient. A fixed low frequency speed signal may result in a first frequency response function for determining virtual damping, and a variable frequency excitation signal may result in a second frequency response function for determining the inertia and rotating friction characteristics. Closed-loop gains are determined based on these characteristics. The excitation signal may be sampled and a peak value in each interval may be identified and stored to produce an envelope of peak values for determining the gain response. Operation of the motor is controlled using the determined gains.
    Type: Grant
    Filed: October 14, 2022
    Date of Patent: February 25, 2025
    Inventors: Athanasios Sarigiannidis, Bo-Ting Lyu, Yi-Chieh Chen, Shih-Chin Yang
  • Publication number: 20240268057
    Abstract: An example assembly includes an equipment room, a cabinet fan module having fans, and a processor configured to execute logic. Temperature sensors are positioned in the air inlet channel and the equipment room. An electrical component having an air inlet area is also positioned in the equipment room. The logic causes the fans to operate at a predetermined speed, and compare a temperature in the air inlet channel with a temperature at the air inlet area. In response to determining that the temperature at the air inlet area is greater than the temperature in the air inlet channel plus a constant value, the operating speed of the fans is increased. Moreover, the operating speed of the fans is decreased in response to determining that the ambient temperature in the air inlet channel plus a constant value is greater than or equal to the temperature at the air inlet area.
    Type: Application
    Filed: February 7, 2023
    Publication date: August 8, 2024
    Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG, Tzu-Hsuan HSU
  • Publication number: 20240265903
    Abstract: An example compute cabinet assembly includes an equipment room, an air inlet channel coupled to the equipment room, and a cabinet fan module coupled to the equipment room. The compute cabinet assembly further includes first and second air outlet channels. The first air outlet channel extends along a side of the equipment room towards an outlet of the first air outlet channel. The second air outlet channel extends along another side of the equipment room towards an outlet of the second air outlet channel. The compute cabinet assembly also includes electric fans positioned in the cabinet fan module. The electric fans are configured to create airflow originating at an inlet of the air inlet channel, extending through the equipment room and cabinet fan module, and exiting the compute cabinet assembly at the outlets of the first and second air outlet channels.
    Type: Application
    Filed: February 7, 2023
    Publication date: August 8, 2024
    Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG, Tzu-Hsuan HSU
  • Publication number: 20240268059
    Abstract: An example compute cabinet assembly includes an equipment room configured to implement electrical components therein, an air inlet channel coupled to a first side of the equipment room, and a cabinet fan module coupled to a second side of the equipment room opposite the first side. A first air outlet channel is coupled to the cabinet fan module and extends along a third side of the equipment room towards a first outlet of the first air outlet channel. Moreover, electric fans are positioned in the cabinet fan module, the electric fans being configured to create an airflow path originating at an inlet of the air inlet channel. The airflow path further extends through the equipment room and cabinet fan module. A guide plate is also positioned adjacent to an inlet of the equipment room, the guide plate being configured to uniformly distribute the airflow path through the equipment room.
    Type: Application
    Filed: February 7, 2023
    Publication date: August 8, 2024
    Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG, Tzu-Hsuan HSU
  • Patent number: 12052846
    Abstract: A heat sink comprises a first portion and a second portion. The first portion is configured to contact a heat-generating electronic component. The first portion is formed from a first group of materials and has a first plurality of fins. The second portion is coupled to the first portion. The second portion is formed from a second group of materials and has a second plurality of fins. The second group of materials is different than the first group of materials. The first group of materials can include extruded aluminum, stamped aluminum, or both. The second group of materials can include die-cast metal. The first plurality of fins can have a smaller fin pitch than the second plurality of fins. The heat sink can further comprise a third portion coupled to the first portion, such that the first portion is positioned between the second portion and the third portion.
    Type: Grant
    Filed: February 11, 2022
    Date of Patent: July 30, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yi-Chieh Chen, Yueh-Chang Wu, Ching-Yi Shih, Kang Hsu
  • Publication number: 20240196573
    Abstract: An example method for providing cooling capacity and reducing power consumption of a server assembly is disclosed. The method includes receiving temperature information corresponding to a CPU of an electrical component in the server assembly, which further includes an equipment room, and a cabinet fan module positioned adjacent to a side of the equipment room. The cabinet fan module includes electric fans therein, and the electrical component is implemented in the equipment room. The method includes determining a current power level of the CPU, and determining, using the temperature information and the current power level, a first operating speed for the electric fans. Furthermore, the method includes combining the first operating speed with a second operating speed received from a proportional-integral-derivative controller to determine a combined operating speed. The method still further includes instructing the electric fans to operate at the combined operating speed.
    Type: Application
    Filed: June 15, 2023
    Publication date: June 13, 2024
    Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Yan-Kuei CHEN, Yi-Ta HSU