Abstract: A cathode assembly for a physical vapor deposition (PVD) system includes a target holder and a thickness detector. The target holder is for holding a target, in which the target has a first major surface and a second major surface. The first major surface and the second major surface are respectively proximal and distal to the target holder. The thickness detector is disposed on the target holder. At least one portion of the first major surface is exposed to the thickness detector for allowing the thickness detector to detect the thickness of the target through the first major surface.

Abstract: An isolation feature with a nitrogen-doped fill dielectric and a method of forming the isolation feature are disclosed. In an exemplary embodiment, the method of forming the isolation feature comprises receiving a substrate having a top surface. A recess is etched in the substrate, the recess extending from the top surface into the substrate. A dielectric is deposited within the recess such that the depositing of the dielectric includes introducing nitrogen during a chemical vapor deposition process. Accordingly, the deposited dielectric includes a nitrogen-doped dielectric. The deposited dielectric may include a nitrogen-doped silicon oxide. In some embodiments, the depositing of the dielectric disposes the nitrogen-doped dielectric in contact with a surface of the recess. In further embodiments, a liner material is deposited within the recess prior to the depositing of the dielectric within the recess.

Abstract: A method for assembling multiple integrated circuit dies into a system-in-package chip is disclosed, the method comprising: providing a plurality of integrated circuit dies; disposing at least one redistribution layer on at least one of the plurality of integrated circuit dies for making wire connections among the plurality of integrated circuit dies without using a substrate underneath the plurality of integrated circuit dies; establishing wire connections among the plurality of integrated circuit dies and verifying the plurality of wire connections; and packaging the plurality of integrated circuit dies and the verified wire connections into a system-in-package chip.

Abstract: A cathode assembly for a physical vapor deposition (PVD) system includes a target holder and a thickness detector. The target holder is for holding a target, in which the target has a first major surface and a second major surface. The first major surface and the second major surface are respectively proximal and distal to the target holder. The thickness detector is disposed on the target holder. At least one portion of the first major surface is exposed to the thickness detector for allowing the thickness detector to detect the thickness of the target through the first major surface.

Abstract: A method for assembling multiple integrated circuit dies into a system-in-package chip is disclosed, the method comprising: providing a plurality of integrated circuit dies; disposing at least one redistribution layer on at least one of the plurality of integrated circuit dies for making wire connections among the plurality of integrated circuit dies without using a substrate underneath the plurality of integrated circuit dies; establishing wire connections among the plurality of integrated circuit dies and verifying the plurality of wire connections; and packaging the plurality of integrated circuit dies and the verified wire connections into a system-in-package chip.

Abstract: The present invention discloses an efficient way to connect multiple integrated circuit dies using redistribution layers (RDL) for making wire connections. Antenna diodes are used to create ground paths so as to remove non-sticking pads on the RDL to ensure the integrity of the wire connections before packaging the multiple integrated circuit dies into a system-in-package (SIP) chip, thereby eliminating unnecessary yield loss in a functional test caused by the non-sticking pads. In another aspect, electrostatic discharge (ESD) protection can be provided through the antenna diodes across two different power domains by disposing a diode in one integrated circuit die for ESD protection of a terminal in another integrated circuit die.

Abstract: A decoupling circuit for enhancing isolation of two monopole antennas is disclosed. The two monopole antennas substantially symmetrically stand on a bottom, and a gap is formed between the two monopole antennas. The decoupling circuit includes a grounding element located on the bottom and electrically connected to a ground, a connection bar substantially perpendicular to the bottom, including a first terminal electrically connected to the grounding element, a second terminal extending to the gap, a first branch extending from the second terminal of the connection bar to a first monopole antenna of the two monopole antennas, and a second branch extending from the second terminal of the connection bar to a second monopole antenna of the two monopole antennas.

Abstract: A decoupling circuit for enhancing isolation of two antennas is disclosed. The two antennas are substantially symmetrically disposed on a substrate. The decoupling circuit includes a first and second metal strips parallel disposed between the two antennas and electrically connected to a ground, a connection strip electrically connected between terminals of the first and second metal strips, to substantially form a doorframe structure, a first comb structure comprising a plurality of metal segments parallel to each other, disposed on the substrate, electrically connected to and perpendicular to the first metal strip, and a second comb structure comprising a plurality of metal segments parallel to each other, disposed on the substrate, electrically connected to and perpendicular to the second metal strip.

Abstract: An isolation feature with a nitrogen-doped fill dielectric and a method of forming the isolation feature are disclosed. In an exemplary embodiment, the method of forming the isolation feature comprises receiving a substrate having a top surface. A recess is etched in the substrate, the recess extending from the top surface into the substrate. A dielectric is deposited within the recess such that the depositing of the dielectric includes introducing nitrogen during a chemical vapor deposition process. Accordingly, the deposited dielectric includes a nitrogen-doped dielectric. The deposited dielectric may include a nitrogen-doped silicon oxide. In some embodiments, the depositing of the dielectric disposes the nitrogen-doped dielectric in contact with a surface of the recess. In further embodiments, a liner material is deposited within the recess prior to the depositing of the dielectric within the recess.

Abstract: A decoupling circuit for enhancing isolation of two antennas is disclosed. The two antennas are substantially symmetrically disposed on a substrate. The decoupling circuit includes a first and second metal strips parallel disposed between the two antennas and electrically connected to a ground, a connection strip electrically connected between terminals of the first and second metal strips, to substantially form a doorframe structure, a first comb structure comprising a plurality of metal segments parallel to each other, disposed on the substrate, electrically connected to and perpendicular to the first metal strip, and a second comb structure comprising a plurality of metal segments parallel to each other, disposed on the substrate, electrically connected to and perpendicular to the second metal strip.

Abstract: A decoupling circuit for enhancing isolation of two monopole antennas is disclosed. The two monopole antennas substantially symmetrically stand on a bottom, and a gap is formed between the two monopole antennas. The decoupling circuit includes a grounding element located on the bottom and electrically connected to a ground, a connection bar substantially perpendicular to the bottom, including a first terminal electrically connected to the grounding element, a second terminal extending to the gap, a first branch extending from the second terminal of the connection bar to a first monopole antenna of the two monopole antennas, and a second branch extending from the second terminal of the connection bar to a second monopole antenna of the two monopole antennas.

Abstract: Disclosed is a microcapsule composition for inhibiting an ethylene response in plants, which comprises a plurality of microcapsules, each including an agent for blocking an ethylene binding site in plants in an oil droplet, and a coating encapsulating the oil droplet and the agent for blocking the ethylene binding site in plants. A method for preparing microcapsules of an agent for blocking the ethylene binding site in plants, and a method for inhibiting an ethylene response in plants are also disclosed.

Abstract: An isolated Lactobacillus paracasei strain LT12 and its genetically-engineered variant that possesses immune regulating activity and uses thereof for regulating immune responses and treating allergy.

Abstract: An isolated Lactobacillus paracasei strain LT12 and its genetically-engineered variant that possesses immune regulating activity and uses thereof for regulating immune responses and treating allergy.

Abstract: Disclosed is a microcapsule composition for inhibiting an ethylene response in plants, which comprises a plurality of microcapsules, each including an agent for blocking an ethylene binding site in plants in an oil droplet, and a coating encapsulating the oil droplet and the agent for blocking the ethylene binding site in plants. A method for preparing microcapsules of an agent for blocking the ethylene binding site in plants, and a method for inhibiting an ethylene response in plants are also disclosed.

Abstract: The present invention relates to a pharmaceutical composition for rapidly reducing the uric acid level in blood in a subject, which comprises anserine in an amount of greater than 50 mg to about 600 mg. The present invention further relates to a package comprising the pharmaceutical composition comprising anserine, and a label and/or an insert indicating that the composition is administered to a subject to provide anserine in an amount of greater than 50 mg to about 600 mg per dose. In addition, the present invention relates to a method for rapidly reducing the uric acid level in blood in a subject, which comprises administering anserine in an amount of greater than 50 mg to about 600 mg to the subject.

Abstract: The present invention relates to a pharmaceutical composition for rapidly reducing the uric acid level in blood in a subject, which comprises anserine in an amount of greater than 50 mg to about 600 mg. The present invention further relates to a package comprising the pharmaceutical composition comprising anserine, and a label and/or an insert indicating that the composition is administered to a subject to provide anserine in an amount of greater than 50 mg to about 600 mg per dose. In addition, the present invention relates to a method for rapidly reducing the uric acid level in blood in a subject, which comprises administering anserine in an amount of greater than 50 mg to about 600 mg to the subject.