Abstract: An electronic device includes a first substrate structure, multiple electronic elements and a second substrate structure. The first substrate structure includes a first substrate. The electronic elements are disposed on the first substrate. The second substrate structure is coupled to the first substrate structure. The second substrate structure includes a second substrate, a protection circuit, a driving circuit and a bonding pad. The protection circuit is disposed on the second substrate. The driving circuit is disposed on the second substrate and configured to drive at least a part of the electronic elements. The bonding pad is disposed on the second substrate. The protection circuit is respectively coupled to the bonding pad and the driving circuit. The electronic device may reduce the damage caused by electrostatic discharge or reduce the impact of the bonding process of the bonding pad on signal conduction.

Abstract: A data serializer, a latch data device using the same and a controlling method thereof are provided. The data serializer includes at least one data buffer and a de-skew buffer. The data buffer at least receives an inputting data and a controlling signal. An outputting signal and a complementary outputting signal, which is complementary to the outputting signal, are formed when the controlling signal is at a predetermined level. The de-skew buffer receives the complementary outputting signal to accelerate or slow down forming the outputting signal.

Abstract: Aspects described herein include devices, wireless communication apparatuses, methods, and associated operations for heatsinks integrating millimeter wave and non-millimeter wave operation. In some aspects, an apparatus comprising a millimeter wave (mmW) module is provided. The apparatus includes at least one mmW antenna and at least one mmW signal node configured to communicate a data signal in association with the at least one mmW antenna. The apparatus further includes mixing circuitry configured to convert between the data signal and a mmW signal for communications associated with the at least one mmW antenna. The apparatus further includes a heatsink comprising a non-mmW antenna and a non-mmW feed point coupled to the non-mmW antenna. The non-mmW feed point is configured to provide a signal path to the non-mmW antenna for a non-mmW signal. The heatsink is mechanically coupled to the mmW module.

Abstract: A computation apparatus and a computation method with input swapping are provided. The computation apparatus includes a non-zero detection circuit, a swapper policy circuit, a swapper matrix circuit, and an adder tree. The non-zero detection circuit is configured to receive input vectors, inspect non-zero operands in the input vectors and generate a non-zero indicative signal indicating the non-zero operands. The swapper policy circuit is configured to receive and interpret the non-zero indicative signal, and generate multiplexer (MUX) selection signals for swapping the non-zero operands according to a set of swapping policies. The swapper matrix circuit is configured to receive the input vectors and the MUX selection signal, and perform swapping on operands in the input vectors according to the MUX selection signal. The adder tree is configured to receive the input vectors with the swapped operands and perform additions on the input vectors to output a computation result.

Abstract: A memory device and an operation method thereof are provided. The memory device includes memory cells, each having a static random access memory (SRAM) cell and a non-volatile memory cell. The SRAM cell is configured to store complementary data at first and second storage nodes. The non-volatile memory cell is configured to replicate and retain the complementary data before the SRAM cell loses power supply, and to rewrite the replicated data to the first and second storage nodes of the SRAM cell after the power supply of the SRAM cell is restored.

Abstract: A video encoder with quality estimation is shown. The video encoder has a video compressor, a video reconstructor, a quality estimator, and an encoder top controller. The video compressor receives the source data of a video to generate compressed data. The video reconstructor is coupled to the video compressor for generation of playback-level data that is buffered for inter prediction by the video compressor, wherein the video reconstructor generates intermediate data and, based on the intermediate data, the video reconstructor generates playback-level data. The quality estimator is coupled to the video reconstructor to receive the intermediate data. Quality estimation is performed based on the intermediate data rather than the playback-level data. Based on the quality estimation result, the encoder top controller adjusts at least one video compression factor in real time.

Abstract: A memory test circuit is provided. The memory test circuit is disposed in a memory chip and electrically coupled to a memory macro of the memory chip. A high speed clock receives an input signal and an external clock signal. The input signal includes a plurality of test bits. A finite state machine controller provides a pattern type. A pattern generator generates and provides a test signal to at least one memory cell of the memory chip to write the test signal to the at least one memory cell based on the pattern type and the external clock signal. A test frequency of the test signal is determined based on the high speed clock. An output comparator outputs a comparison signal based on a difference between the test signal and a readout signal corresponding to the test signal read from the at least one memory cell.

Abstract: A memory test circuit is provided. The memory test circuit is disposed in a memory array and including: a test array, including test cells out of memory cells of the memory array; a write multiplexer, configured to selectively output one of a test signal and a reference voltage based on a write measurement signal, wherein the test signal is output to write into at least one test cell and the reference voltage is output to a sense amplifier; and a read multiplexer, configured to selectively receive and output one of a readout signal corresponding to the test signal and an amplified signal based on a read measurement signal, wherein the readout signal is read from the at least one test cell and the amplified signal is obtained for a read margin evaluation from the sense amplifier by amplifying a voltage difference between the readout signal and the reference voltage.

Abstract: A data serializer, a latch data device using the same and a controlling method thereof are provided. The data serializer includes at least one data buffer and a de-skew buffer. The data buffer at least receives an inputting data and a controlling signal. An outputting signal and a complementary outputting signal, which is complementary to the outputting signal, are formed when the controlling signal is at a predetermined level. The de-skew buffer receives the complementary outputting signal to accelerate or slow down forming the outputting signal.

Abstract: Disclosed is a semiconductor device that has a first layer including conductive material, a bond wire coupled to an upper surface of the first layer, and a second layer including conductive material underneath the first layer. One or more interconnects couple the second layer to the first layer. In an example, the second layer has a plurality of discontinuous sections that includes (i) a connected section coupled to the one or more interconnects and (ii) one or more floating sections that are at least in part surrounded by the connected section, where the one or more floating sections are electrically floating and isolated from the connected section. The semiconductor device also includes an under-pad circuit on a substrate underneath the second layer, the under-pad circuit to transmit signals to one or more components external to the semiconductor device though the first layer.

Abstract: The present invention relates to an electrically operated switch, and particularly to an electrically operated switch for long-term use comprising a first electrically conductive heat-dissipating fin, a second electrically conductive heat-dissipating fin, and a plurality of relays. All the input terminals on the plurality of relays are interconnected through the first electrically conductive heat-dissipating fin, and all the output terminals on the plurality of relays are interconnected through the second electrically conductive heat-dissipating fin. In the present invention, the plurality of relays is interconnected through a first electrically conductive heat-dissipating fin and a second electrically conductive heat-dissipating fin.

Abstract: A data serializer, a latch data device using the same and a controlling method thereof are provided. The data serializer includes at least one data buffer and a de-skew buffer. The data buffer at least receives an inputting data and a controlling signal. An outputting signal and a complementary outputting signal, which is complementary to the outputting signal, are formed when the controlling signal is at a predetermined level. The de-skew buffer receives the complementary outputting signal to accelerate or slow down forming the outputting signal.

Abstract: Disclosed is a semiconductor device that has a first layer including conductive material, a bond wire coupled to an upper surface of the first layer, and a second layer including conductive material underneath the first layer. One or more interconnects couple the second layer to the first layer. In an example, the second layer has a plurality of discontinuous sections that includes (i) a connected section coupled to the one or more interconnects and (ii) one or more floating sections that are at least in part surrounded by the connected section, where the one or more floating sections are electrically floating and isolated from the connected section. The semiconductor device also includes an under-pad circuit on a substrate underneath the second layer, the under-pad circuit to transmit signals to one or more components external to the semiconductor device though the first layer.

Abstract: A fixture for bonding films to an object includes a base, a cavity wall fixed to the base, and a receiving cavity defined by the cavity wall and the base. The cavity wall includes opposing inner and outer surfaces and an end surface at an end away from the base. The end surface defines protrusions interconnecting with recesses and being recessed towards the base. Each recess penetrates the inner surface and the outer surface. A method for employing the device is also provided. The fixture and the method for bonding avoid center wrapping after bonding.

Abstract: An integrated circuit device can comprise addressable memory, and a receiver. Data integrity logic can be coupled to the input data path and configured to receive a data stream having a reference address, and a plurality of data chunks with data integrity codes. Also, the data integrity logic can include a configuration store to store configuration data for the data integrity checking. Also, the integrated circuit can include logic to parse the data chunks and the data integrity codes from the data stream, and logic to compute computed data integrity codes of data chunks in the received data stream, and compare the computed data integrity codes with received data integrity codes to test for data errors in the received data stream. The data integrity logic includes logic responsive to the configuration data that control the data integrity logic. In one aspect, the data integrity data indicates a floating boundary data integrity mode or a fixed boundary data integrity mode.

Abstract: An integrated circuit device can comprise addressable memory, and a receiver. Data integrity logic can be coupled to the input data path and configured to receive a data stream having a reference address, and a plurality of data chunks with data integrity codes. Also, the data integrity logic can include a configuration store to store configuration data for the data integrity checking. Also, the integrated circuit can include logic to parse the data chunks and the data integrity codes from the data stream, and logic to compute computed data integrity codes of data chunks in the received data stream, and compare the computed data integrity codes with received data integrity codes to test for data errors in the received data stream. The data integrity logic includes logic responsive to the configuration data that control the data integrity logic. In one aspect, the data integrity data indicates a floating boundary data integrity mode or a fixed boundary data integrity mode.

Abstract: A fixture for bonding films to an object includes a base, a cavity wall fixed to the base, and a receiving cavity defined by the cavity wall and the base. The cavity wall includes opposing inner and outer surfaces and an end surface at an end away from the base. The end surface defines protrusions interconnecting with recesses and being recessed towards the base. Each recess penetrates the inner surface and the outer surface. A method for employing the device is also provided. The fixture and the method for bonding avoid center wrapping after bonding.