Abstract: A method includes: transporting a wafer to an apparatus, the apparatus including: a first chamber configured to receive the wafer and a first gas; a second chamber surrounding the first chamber and configured to receive a second gas; a plurality of gas inlets on a chamber wall of the second chamber; and a plurality of gas vents on the chamber wall of the second chamber; heating the first chamber while keeping a gas pressure difference between the first chamber and the second chamber within a tolerance limit; and cooling the first chamber by exchanging the second gas in the second chamber while keeping the gas pressure difference within the tolerance limit.

Abstract: An inverter device includes a converter circuit and a filter. The converter circuit converts a DC input voltage into an AC intermediate voltage based on six control signals, and includes first and second converters. Each of the first and second converters includes three switches, two diodes and a coupled inductor circuit. The switches of the first converter operate respectively based on three of the control signals. The switches of the second converter operate respectively based on the other three of the control signals. The filter filters the AC intermediate voltage to generate an AC output voltage.

Abstract: Disclosed is a semiconductor device that has a first layer including conductive material, a bond wire coupled to an upper surface of the first layer, and a second layer including conductive material underneath the first layer. One or more interconnects couple the second layer to the first layer. In an example, the second layer has a plurality of discontinuous sections that includes (i) a connected section coupled to the one or more interconnects and (ii) one or more floating sections that are at least in part surrounded by the connected section, where the one or more floating sections are electrically floating and isolated from the connected section. The semiconductor device also includes an under-pad circuit on a substrate underneath the second layer, the under-pad circuit to transmit signals to one or more components external to the semiconductor device though the first layer.

Abstract: The present invention includes substituted arylmethyl ureas and heteroarylmethyl-ureas, and compositions comprising the same, that can be used to treat and/or prevent hepatitis B virus (HBV) infections in a patient.

Abstract: An improved mechanism of electric lock for door, comprising a case, on both side of the opening of the case arranged keeper arms, drive rods, and rotate member, and a drive mechanism connected to a drive member and a brake member; to achieve lock mode, the drive member drive the brake member to be engaged with the rotate member, making the keeper arms and drive rod unable to rotate, so the keeper arms can block the latch bolt from going through the opening; to achieve unlock mode, the drive member drive the brake member to be separate from the rotate member, making the keeper arms and drive rod able to rotate, so the latch bolt is able to go through the opening.

Abstract: The present disclosure includes substituted isoindolinyl 2,2?-bipyrimidinyl compounds, analogues thereof, and compositions comprising the same, which can be used to treat, ameliorate, and/or prevent hepatitis B virus (HBV) and/or hepatitis B virus (HBV)-hepatitis D virus (HDV) infection in a patient.

Abstract: The invention relates to a microcarrier, comprising a continuous medium of a biocompatible polymer for culturing cells and having a three-dimensional scaffold architecture delineated peripherally by a continuous outer wall, in which spherical macropores are stacked to one another and interconnected by connecting pores. The continuous outer wall is formed with exposure pores at positions where it is in contact with the macropores, through which the interior of the microcarrier may be in fluid communication with the ambient culture medium. The microcarrier herein is produced by cast-molding and, therefore, has a continuous outer wall which provides additional mechanical strength while maintaining high porosity. The microcarrier thus produced is configured in the form of a basic geometrical body. The invention further relates to a cast-molding process for producing the microcarrier.

Abstract: An information handling system may include an organic light-emitting diode (OLED) display layer of a video display to display an image to a user; an A-cover forming a housing behind the OLED display layer; and a physically bifurcated display daughter board between the OLED display layer and the A-cover, the physically bifurcated display daughter board including: a first portion of the display daughter board including a source driver integrated circuit (IC) operatively coupled to a processor to receive graphics data; and a second portion of the display daughter board comprising a power management integrated circuit (PMIC) operatively coupled to the first portion and a power source; the second portion of the display daughter board being mechanically coupled to an interior surface of the A-cover to dissipate heat away from the OLED display layer.

Abstract: A pixel array substrate includes a base, pixel structures, first bonding pads, first wirings, and a first testing element. The pixel structures are disposed on an active area of a first surface of the base. The first bonding pads are disposed on a peripheral region of the first surface. Each of the first wirings is disposed on a corresponding first bonding pad, a first sidewall of the base, and a corresponding second bonding pad. The first testing element is disposed on the active area of the first surface and has a first testing line. The first testing line is electrically connected to at least one of the first bonding pads, and an end of the first testing line is substantially aligned with an edge of the base.

Abstract: A method for fabricating a semiconductor device includes the steps of forming a metal gate on a substrate, a spacer around the metal gate, and a first interlayer dielectric (ILD) layer around the spacer, performing a plasma treatment process to transform the spacer into a first bottom portion and a first top portion, performing a cleaning process to remove the first top portion, and forming a second ILD layer on the metal gate and the first ILD layer.

Abstract: In some examples, an electronic device comprises a voltage supply circuit to provide a reference voltage usable to discharge pixels in a display device; and a scaler circuit coupled to the voltage supply circuit. The scaler circuit is to buffer first and second frames and dynamically control the voltage supply circuit to modify the reference voltage based on a frequency of the first frame differing from a frequency of the second frame.

Abstract: In some examples, an electronic device comprises a voltage supply circuit to provide a reference voltage usable to discharge pixels in a display device; and a scaler circuit coupled to the voltage supply circuit. The scaler circuit is to buffer first and second frames and dynamically control the voltage supply circuit to modify the reference voltage based on a frequency of the first frame differing from a frequency of the second frame.

Abstract: A Bluetooth earphone includes an antenna and a circuit board. The circuit board includes a first grounding branch and a second grounding branch. The first grounding branch is connected in series to a first switch, and the second grounding branch is connected in series to a second switch. When the first switch is on, the first grounding branch serves as a current return path of the antenna. When the second switch is on, the second grounding branch serves as a current return path of the antenna. By controlling the on or off state of the first switch and the second switch, the Bluetooth earphone can switch ground structures of the antenna and select different current return paths for the antenna, to switch radiation patterns of the antenna.

Abstract: A method includes placing a wafer on a susceptor, wherein the wafer has a first radius, wherein a top surface of the susceptor has a second radius that is greater than the first radius; using microwave radiation to heat the wafer and the susceptor; and removing the wafer from the susceptor.

Abstract: Provided are novel compounds of Formula (I): pharmaceutically acceptable salts thereof, and pharmaceutical compositions thereof, which are useful in the treatment of diseases and disorders mediated by ROR?. Also provided are pharmaceutical compositions comprising the novel compounds of Formula (I) and methods for their use in treating one or more inflammatory, metabolic, autoimmune and other diseases or disorders.

Abstract: A heat pump system with a refrigerant flow path comprising, in the heating mode of operation: a compressor coupled to receive refrigerant from a heating mode first refrigerant stream and a heating mode second refrigerant stream of the refrigerant flow path; the condenser coupled to receive refrigerant from the compressor; and a heat exchanger for transferring heat between the heating mode first refrigerant stream and the heating mode second refrigerant stream, wherein the heating mode first refrigerant stream comprises: the first expansion valve coupled to receive refrigerant from the condenser; the first evaporator coupled to receive refrigerant from the first expansion valve; and the heat exchanger coupling the heating mode first refrigerant stream from the first evaporator to the compressor, wherein the heating mode second refrigerant stream comprises: the second expansion valve; the heat exchanger coupling the heating mode second refrigerant stream from the condenser to the second expansion valve; and the

Abstract: The present invention provides a control method of a processor, wherein the control method comprises the steps of: transmitting image data of a first frame to an integrated circuit, wherein the first frame corresponds to a first frame rate; determining a second frame rate of a second frame next to the first frame; determining if a difference between the second frame rate and the first frame rate belongs to a large scale frame rate adjustment or a small scale frame rate adjustment; if the difference between the second frame rate and the first frame rate belongs to the large scale frame rate adjustment, using a first mode to transmit image data of the second frame; and if the difference between the second frame rate and the first frame rate belongs to the small scale frame rate adjustment, using a second mode to transmit image data of the second frame.

Abstract: Provided is a bispecific recombinant protein, comprising a high affinity tumor-targeting arm and a low affinity fusion protein blocking the interaction of CD47 with SIRP?. The antibody corresponding to the high affinity tumor-targeting arm does not bind to CD47, and its binding affinity to the target antigen on the tumor cell is at least 6 times as great as the binding affinity of monomer fusion protein homodimer corresponding to the low affinity fusion protein blocking the interaction of CD47 with SIRP?, to a CD47 on the tumor cell, wherein the low affinity fusion protein blocking the interaction of CD47 with SIRP? comprises a SIRP? extracellular truncation. Also provided are nucleic acid molecules encoding recombinant proteins and the use of the recombinant proteins and nucleic acid molecules in the manufacture of a medicament for treating tumors.

Abstract: An electric lock, comprising: a case combining with a side plate and a case cover; a latch bolt, a latch bolt shaft and a latch bolt spring, the front end of the latch bolt shaft is combined with a blocking member, and the blocking member uses the elastic force of the latch bolt spring to stick out of the side plate to lock, when the external force applied to the latch bolt shaft is sufficient to resist the elastic force of the latch bolt spring, the blocking member will retract into the side plate to unlock; a unlock crank, having an electric push member, and a push member relative to the latch bolt shaft; and a linear actuator and an actuating arm, the front end of the actuating arm is combined with a push block relative to the electric push member, and a push block return spring is set relative to the push block.

Abstract: In an example, a computing device may include a battery, a controller to monitor an operation of the battery, and a basic input/output system (BIOS). The BIOS may initiate a boot process to load an operating system of the computing device. Further, the BIOS may obtain information associated with the operation of the battery from the controller during the boot process. Furthermore, the BIOS may update a log data structure to record the obtained information. Also, the BIOS may determine a health status of the battery based on the updated log data structure and output a notification, during the boot process, indicative of health of the battery based on the determined health status.