Abstract: A light emitting device including a lighting unit and a conversion material is disclosed. The conversion material is configured to convert a part of the invisible light emitted from the lighting unit into a visible light, which indicates that the lighting unit is in operation. The spectral energy of visible light is less than 20% of the spectral energy measured within a wavelength range of 200 nm to 380 nm.

Abstract: A light emitting device including a lighting unit and a conversion material is disclosed. The conversion material is configured to convert a part of the invisible light emitted from the lighting unit into a visible light, which indicates that the lighting unit is in operation. The spectral energy of visible light is less than 20% of the spectral energy measured within a wavelength range of 200 nm to 380 nm.

Abstract: Disclosed herein are methods of (i) detecting cancer or cancer type in a subject or (ii) simultaneously testing for, or distinguishing between, multiple types of cancer in a subject; methods of screening subjects for a prevalence of cancer type or cancer types; methods of managing a subject with a cancer type; and methods of identifying whether a subject having a cancer type is responding to management of that cancer type; and methods of generating a response profile specific for a cancer type.

Abstract: An LED package includes a chip carrier, an adhesive layer, one high-voltage LED die, and an encapsulating member. The chip carrier defines a receiving space. The adhesive layer is disposed in the receiving space and has a thermal conductivity of larger than or equal to 1 W/mK. The high-voltage LED die is attached to the adhesive layer to be received in the reflective space and has a top surface formed with a trench. The trench of the high-voltage LED die is disposed at an optical center of the receiving space. The encapsulating member encapsulates the high-voltage LED die and includes a plurality of diffusers. The trench is embedded with the encapsulating member and has a width ranging from 1 ?m to 10 ?m and a depth of less than or equal to 50 ?m.

Abstract: An LED package includes a chip carrier, an adhesive layer, one high-voltage LED die, and an encapsulating member. The chip carrier defines a receiving space. The adhesive layer is disposed in the receiving space and has a thermal conductivity of larger than or equal to 1 W/mK. The high-voltage LED die is attached to the adhesive layer to be received in the reflective space and has a top surface formed with a trench. The trench of the high-voltage LED die is disposed at an optical center of the receiving space. The encapsulating member encapsulates the high-voltage LED die and includes a plurality of diffusers. The trench is embedded with the encapsulating member and has a width ranging from 1 ?m to 10 ?m and a depth of less than or equal to 50 ?m.

Abstract: A magnetic thermal module, subjected to a magnetic field, includes at least one magnetic thermal material and a container. The magnetic thermal material is used for generating calories or frigories in response to a variable and controllable magnetic field. The container is used for containing the magnetic thermal material. Furthermore, a magnetic thermal device is disclosed herein.