Package of a light emitting diode

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Description

FIG. 1 is a perspective view of package of a light emitting diode showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for package of a light emitting diode, as shown and described.

Referenced Cited
U.S. Patent Documents
D559803 January 15, 2008 Lee
D566055 April 8, 2008 Kim
D578969 October 21, 2008 Kobayakawa
D580891 November 18, 2008 Sung et al.
D595674 July 7, 2009 Wang et al.
D595675 July 7, 2009 Wang et al.
D597971 August 11, 2009 Kobayakawa et al.
D599750 September 8, 2009 Kim et al.
20080185605 August 7, 2008 Wada et al.
20090101897 April 23, 2009 Murphy et al.
Patent History
Patent number: D622680
Type: Grant
Filed: Dec 4, 2009
Date of Patent: Aug 31, 2010
Assignees: Silitek Electronic (Guangzhou) Go., Ltd. (Guangzhou), Lite-On Technology Corp. (Taipei)
Inventors: Chen-Hsiu Lin (Taipei), Yi-Fei Lee (Taipei), Chang-Yen Lin (Taipei)
Primary Examiner: Selina Sikder
Attorney: Rosenberg, Klein & Lee
Application Number: 29/347,322
Classifications