Abstract: In a method of manufacturing a semiconductor device, a source/drain structure is formed over a substrate, a first interlayer dielectric (ILD) layer including one or more dielectric layers is formed over the source/drain structure, a first opening is formed in the first ILD layer to at least partially expose the source/drain structure, a sacrificial layer is formed on an inner wall of the first opening, a first insulating layer is formed on the sacrificial layer, a conductive layer is formed on the first insulating layer so as to form a source/drain contact in contact with the source/drain structure, the sacrificial layer is removed to form a space between the first insulating layer and the first ILD layer, and a second insulating layer is formed over the source/drain contact and the first ILD layer to cap an upper opening the space, thereby forming an air gap.

Abstract: Managing noise during an online conference session includes obtaining audio data from an endpoint participating in an online conference session. The audio data is derived from audio captured at the endpoint that includes musical sounds. The audio data is processed to identify a portion of the audio data in which a decibel level of the musical sounds is stable for a period of time. Non-musical noise present, if any, in the audio data with the musical sounds is identified and the non-musical noise is attenuated from the audio data to generate noise-reduced musical audio data. The noise-reduced musical audio data is transmitted for play out at one or more other endpoints participating in the online conference session.

Abstract: An electronic device including a first base, a first conductive layer, an insulating layer, a first electronic element, a second base, and a second electronic element is provided. The first conductive layer is disposed on the first base. The insulating layer is disposed on the first conductive layer and has a first hole, wherein the first hole exposes at least a portion of the first conductive layer. The first electronic element is disposed on the first base. The second base is disposed between the insulating layer and the first electronic element, and has a second hole. The second electronic element is electrically connected to the first conductive layer. The first electronic element is electrically connected to the first conductive layer via the second hole and the first hole, and in a cross-sectional view of the electronic device, the second hole is different from the first hole in width.

Abstract: Embodiments of the present disclosure provide semiconductor device structures and methods of forming the same. The method includes forming a first fin structure and a second fin structure from a substrate, depositing a first conformal layer over the first and second fin structures and between the first and second fin structures, depositing a second conformal layer on the first conformal layer, depositing a third conformal layer on the second conformal layer, depositing a fourth conformal layer on the third conformal layer, depositing a first insulating material on the fourth conformal layer between the first and second fin structures, and depositing a second insulating material on the first insulating material. The first and second fin structures are embedded by the second insulating material. The method further includes removing portions of the second insulating material and the first, second, third, and fourth conformal layers to expose the first and second fin structures.

Abstract: A sensor device is provided. The sensor device includes a first substrate, a second substrate, a flow channel and a first reaction group. The second substrate is disposed opposite the first substrate. The flow channel is disposed between the first substrate and the second substrate, and the flow channel includes a fluidic boundary. The first reaction group is disposed on the first substrate and includes a first reaction site, a second reaction site and a third reaction site. The first reaction site is closer to the fluidic boundary than the second reaction site, and a size of the first reaction site is greater than or equal to a size of the second reaction site. The second reaction site is closer to the fluidic boundary than the third reaction site, and the size of the second reaction site is greater than a size of the third reaction site.

Abstract: A resilient substrate structure, which can be rolled up around an axis, includes a substrate, a working patterned layer and a resilient structure. The substrate has a first surface and a second surface. The substrate is defined with a first edge and a second edge in a direction parallel to the axis. The working patterned layer is arranged on the substrate. The resilient structure is arranged on the second surface. The resilient structure includes a composite layer and a supporting layer, which keep attaching to each other. The composite layer has curve-able segments, each of which is parallel to the axis and connects to the first and second edges. The resilient structure is transformed to contain multiple wavy segments when the resilient substrate structure is at the retraction state. An electronic device including the resilient substrate structure and electronic elements is also disclosed.

Abstract: A tiled electronic device includes a plurality of display panels, and at least one of the display panels includes a flexible substrate, a pixel, and two signal wires. The flexible substrate has a display portion and a bent portion connected to the display portion. The pixel is disposed on the display portion. The signal wires are disposed on the flexible substrate, and electrically connected to the pixel. Each of the signal wires has a first segment disposed on the display portion, and a second segment disposed on the bent portion. The two first sections have a first pitch, and the two second sections have a second pitch. The first pitch is different than the second pitch.

Abstract: A camera module includes an imaging lens having an optical axis, a variable through hole mechanism, an image sensor, an image sensor actuating module and a flexible printed circuit. The variable through hole mechanism is disposed corresponding to the imaging lens to adjust an amount of light into the imaging lens. The image sensor is disposed on the optical axis and is configured to convert imaging light passing through the imaging lens into an image signal. The image sensor actuating module is configured to move the image sensor. The variable through hole mechanism and the image sensor actuating module each have a coil disposed on the flexible printed circuit. The flexible printed circuit is electrically connected to the variable through hole mechanism and the image sensor actuating module.

Abstract: A power supply device includes at least one magnetic member, a first circuit board and a second circuit board. The first circuit board is disposed over the magnetic member and is electrically connected to the magnetic member. The first circuit board has an opening. The second circuit board is electrically connected to the first circuit board. The second circuit board is disposed over the first circuit board and faces the opening of the first circuit board.

Abstract: An electronic apparatus has a first region and a second region adjacent to the first region. The electronic apparatus includes a first light-emitting assembly including a plurality of first light-emitting units in the first region. The electronic apparatus includes a second light-emitting assembly disposed adjacent to the first light-emitting assembly. The second light-emitting assembly includes a plurality of second light-emitting units in the second region. A third region is included in the first region, a fourth region is included in the second region, and the third region is adjacent to the fourth region. The difference in percentage between the average brightness in the third region and the average brightness in the fourth region is less than the difference in percentage between the average brightness in the first region and the average brightness in the second region.

Abstract: The disclosure provides an electronic device including a support plate and a first panel. The support plate includes a first bridge member and a second bridge member. The first panel is disposed on the support plate and includes a substrate, a signal line, a third bridge member, and a fourth bridge member. The signal line is disposed on the substrate. The third bridge member penetrates through the substrate and is electrically connected to the signal line and the first bridge member. The fourth bridge member penetrates through the substrate and is electrically connected to the signal line and the second bridge member.

Abstract: An electronic device is provided. The electronic device includes a first substrate and a plurality of light-emitting elements disposed on the first substrate. The plurality of light-emitting elements include a contact pad; an intermediate substrate disposed on the contact pad; and a light-emitting unit disposed on the intermediate substrate. The electronic device further includes a second substrate and a first thin-film transistor array disposed on the second substrate for driving at least a portion of the plurality of light-emitting elements. The light-emitting unit is electrically connected to the contact pad through a via hole that penetrates the intermediate substrate.

Abstract: An adjustable aperture module includes a blade assembly, a fixed component connected to the blade assembly, a movable component connected to the blade assembly, and a driving mechanism. The blade assembly includes light-blocking blades overlapping one another in a circumferential direction surrounding a central axis and together forming a light pass aperture. The movable component is disposed corresponding to the fixed component. The driving mechanism is configured to rotate the movable component in the circumferential direction relative to the fixed component. The driving mechanism includes at least one coil assembly and at least one magnet arranged along the circumferential direction. The coil assembly includes at least two coils. The magnet is disposed on the movable component and includes at least one magnetic pole. The magnetic pole is disposed corresponding to the coil assembly and facing at least two coils of the coil assembly.

Abstract: Provided is a composition for simultaneously targeting a nucleic acid sequence and providing intron selection in cells in vitro, ex vivo or in vivo. The composition includes one or more nucleic acid molecules each including an artificial nucleic acid sequence flanked with capping sequences, and Lambda beta protein or a linear or circular vector including a nucleic acid sequence encoding the Lambda beta protein, wherein each of the capping sequences is homologous to a region in a target nucleic acid sequence, and the artificial nucleic acid sequence is an intron sequence. The present disclosure also provides a method for editing a target nucleic acid sequence in cells by introducing the composition into the cells.

Abstract: A tiled electronic device includes a plurality of display panels, and at least one of the display panels includes a flexible substrate, a pixel, and two signal wires. The flexible substrate has a display portion and a bent portion connected to the display portion. The pixel is disposed on the display portion. The signal wires are disposed on the flexible substrate, and electrically connected to the pixel. Each of the signal wires has a first segment disposed on the display portion, and a second segment disposed on the bent portion. The two first sections have a first pitch, and the two second sections have a second pitch. The first pitch is different than the second pitch.

Abstract: A light-emitting device is provided. The light-emitting device includes a circuit substrate, an array substrate, a plurality of light-emitting units and a driver. The circuit substrate has a top surface. A top circuit is disposed on the top surface. The array substrate is disposed on the top surface of the circuit substrate and electrically connected to the top circuit. The light-emitting units are disposed on the array substrate. The light-emitting device further includes an electrical connection structure, a plurality of light extraction layers, a protective layer, a plurality of test pads, and a light absorption layer. The plurality of test pads are disposed on the array substrate, and the light absorption layer covers at least one of the test pads.

Abstract: Managing noise during an online conference session includes obtaining audio data from an endpoint participating in an online conference session. The audio data is derived from audio captured at the endpoint that includes musical sounds. The audio data is processed to identify a portion of the audio data in which a decibel level of the musical sounds is stable for a period of time. Non-musical noise present, if any, in the audio data with the musical sounds is identified and the non-musical noise is attenuated from the audio data to generate noise-reduced musical audio data. The noise-reduced musical audio data is transmitted for play out at one or more other endpoints participating in the online conference session.

Abstract: An electronic apparatus includes a first light emitting array and a second light emitting array. The first light emitting array includes first light-emitting units disposed in a first region and a first sub region. The second light emitting array is disposed adjacent to the first light emitting array. The second light emitting array includes second light-emitting units disposed in a second region and a second sub region. The difference between the average brightness in the first region and the average brightness in the second region is in a range from 0% to 20%, and the difference between the average brightness in the first sub region and the average brightness in the second sub region is less than the difference between the average brightness in the first region and the average brightness in the second region.

Abstract: An electronic device includes: a circuit substrate; a first substrate overlapped with the circuit substrate; a first electronic unit attached on the first substrate; a second substrate disposed between the first substrate and the circuit substrate; a first transistor attached on the second substrate and electrically connected to the first electronic unit; and a first conductive element penetrating the second substrate, wherein the first transistor is electrically connected to the circuit substrate through the first conductive element.

Abstract: An eyeglass's structure includes a frame, a connecting seat, and a buckle. The frame includes a connection part formed on two sides of the frame separately; the connecting seat corresponding to the connection part has a sliding slot selectively situated in a lock or unlock position; and the buckle is slidably installed in the sliding slot and includes two elastic arms connected to each other and an end pivoted to the connection part. When the buckle is in the lock position, each elastic arm is bound by the sliding slot. When the buckle is in the unlock position, each elastic arm can be elastically deformed by external forces to detach the connection part, so as to achieve the effect of disassembling or assembling the frame quickly.