Abstract: An adjustable connector is electrically connected with corresponding signal contacts on a circuit board by a multiple of leaf springs. As a result of the flexibility of the leaf springs, the adjustable connector can move within a small range in relation to the circuit board while keeping in electrical connection with the circuit board so as to adjust the position of the adjustable connector on the circuit board.

Abstract: A pixel structure including an active device, a pixel electrode connected with the active device, a bottom electrode disposed under the pixel electrode, upper electrodes disposed between the pixel electrode and the bottom electrode and connected with the pixel electrode, a first dielectric layer disposed between the bottom electrode and the upper electrodes and a second dielectric layer disposed between the upper electrodes and the pixel electrode is provided. The total area of the upper electrodes overlapping with the bottom electrode is A, and the overlapping portion of the pixel electrode and each upper electrode includes a contact region and a reserved region having total area B. The dielectric constant and thickness of the first dielectric layer is ?1 and d1; and for second dielectric layer ?2 and d2, wherein 0.5<(?1·d2·A)/(?2·d1·B)<1.5.

Abstract: An electronic apparatus. A pedestal includes a guiding member. A main body is detachably connected to the guiding member and includes a guiding groove in which the guiding member relatively slides. A positioning mechanism is movably disposed in the guiding member and guiding groove, controlling the sliding position of the guiding member with respect to the guiding groove.

Abstract: A shielding structure for suppressing electromagnetic interference in a printed circuit board has at least a pad. A chip is disposed on the printed circuit board and a heat sink is disposed on the chip. The shielding structure includes a main body and a sidewall. In this case, the main body has a contacting portion and an opening. The contacting portion is in contact with the heat sink and one part of the heat sink protrudes from the main body via the opening. The sidewall is encircled around the main body. The sidewall is connected to the main body, has a connecting portion electrically connected to the pad. The main body, the sidewall, and the printed circuit board form a containing space, and the chip is disposed in the containing space.

Abstract: An adjustable connector is electrically connected with corresponding signal contacts on a circuit board by a multiple of leaf springs. As a result of the flexibility of the leaf springs, the adjustable connector can move within a small range in relation to the circuit board while keeping in electrical connection with the circuit board so as to adjust the position of the adjustable connector on the circuit board.

Abstract: An adjustable connector is electrically connected with corresponding signal contacts on a circuit board by a multiple of leaf springs. As a result of the flexibility of the leaf springs, the adjustable connector can move within a small range in relation to the circuit board while keeping in electrical connection with the circuit board so as to adjust the position of the adjustable connector on the circuit board.

Abstract: A shielding module is used for shielding an electrical device. In this case, the shielding module includes a heat-dissipating component, a casing and a connection component. The heat-dissipating component has a contacting portion to contact with the electrical device. The electrical device is located in the casing, which has an opening. The heat-dissipating component is disposed in the opening. The connection component and the casing fasten the heat-dissipating component on the electrical device. Furthermore, an electrical apparatus is provided and includes an electrical device, a heat-dissipating component, a casing, and a connection component. In this case, the electrical device is fastened on a circuit board. The heat-dissipating component has a contacting portion adjacent to the electrical device. The electrical device is disposed in the casing, which has an opening. The heat-dissipating component is disposed in the opening.

Abstract: A projection apparatus. A support pedestal is slidably disposed on a base. An optical engine is disposed on the support pedestal. An alignment mechanism is disposed on the base and connected to the support pedestal, adjusting the position of the optical engine with respect to the base. The alignment mechanism includes a fixed pedestal, an adjustment screw, a nut, and a resilient member. The fixed pedestal is fixed to the base. The nut is connected to the support pedestal and slidably disposed on the base. The adjustment screw is rotatably disposed in the fixed pedestal and nut and engages the nut. The resilient member is disposed between the fixed pedestal and the nut to provide resilience to the fixed pedestal and nut, such that the adjustment screw abuts the nut.

Abstract: A thin film transistor array substrate and method for repairing the same are provided. Each pixel unit of the thin film transistor array substrate has a plurality of upper electrodes, which are coupled to a common line to form a plurality of storage capacitors. If a storage capacitor defects, the portion of the pixel electrode corresponding to the defective storage capacitor is electrically isolated from the other portion of the pixel electrode in the pixel unit. Therefore, the other storage capacitors in the pixel unit can normally display. The thin film transistor array substrate and method for repairing the same provided by the present invention repair the defective storage capacitor in the thin film transistor array substrate and improve the manufacturing yield.

Abstract: A buckling structure for buckling a first housing with a first lateral plate and a second housing is provided. The buckling structure includes a first baffle and a second baffle. The first baffle having a first buckling portion is disposed in the first housing and is substantially parallel to the first lateral plate. The second baffle having a second portion is disposed in the second housing. The first buckling portion is buckled with the second buckling portion when the second baffle is inserted between the first baffle and the lateral plate, so that the first housing and the second housing are combined tightly.

Abstract: A portable computer and a shock absorber assembly thereof. The portable computer includes a body, a hard disc drive, a supporting member, an isolator, a vibration absorber, and a damper. The hard disc drive is disposed in the body. The supporting member is disposed on the hard disc drive. The isolator is disposed on the supporting member. The vibration absorber is disposed on the hard disc drive. The damper is disposed on the vibration absorber. Thus, the hard disc drive is connected to the body via the isolator, and connected to the vibration absorber via the damper. As a result, the vibration of the hard disc drive can be reduced.

Abstract: A fan fasten device is for fixing at least one fan. The fan fasten device includes a chassis and a fastener. At least one fixing portion is set on the chassis, and at least one end of the fastener is connected with the fixing portion.

Abstract: A shielding module is used for shielding an electrical device. In this case, the shielding module includes a heat-dissipating component, a casing and a connection component. The heat-dissipating component has a contacting portion to contact with the electrical device. The electrical device is located in the casing, which has an opening. The heat-dissipating component is disposed in the opening. The connection component and the casing fasten the heat-dissipating component on the electrical device. Furthermore, an electrical apparatus is provided and includes an electrical device, a heat-dissipating component, a casing, and a connection component. In this case, the electrical device is fastened on a circuit board. The heat-dissipating component has a contacting portion adjacent to the electrical device. The electrical device is disposed in the casing, which has an opening. The heat-dissipating component is disposed in the opening.

Abstract: A shielding device includes a shell and a touch portion. In this case, the shell shields an electronic device. The touch portion is disposed on the shell and touches the electronic device. An electronic apparatus, including a circuit board, a shell and a touch portion, is also provided. In this case, at least one electronic device is disposed on the circuit board. The shell shields the electronic device. The touch portion is on the shell and touches the electronic device.

Abstract: An easily-assembled connecting mechanism and the apparatus using the same. The apparatus comprises a first and second pieces. The connecting mechanism includes a hook member and a holding member. The hook member has a head portion and a lever portion connected to the first piece; The extendable receptacle member has a plurality of cantilevered arms disposed around a through hole of the second piece. Each cantilevered arm of the extendable receptacle member has a holding portion to fix the head portion of the hook member and an inner tapered surface forming a cone. During joining of the first and second pieces, the cantilevered arms are elastically deformed, and the head of the hook member is pushed into and fixed by the holding portion of the holding member.

Abstract: An adjustable connector is electrically connected with corresponding signal contacts on a circuit board by a multiple of leaf springs. As a result of the flexibility of the leaf springs, the adjustable connector can move within a small range in relation to the circuit board while keeping in electrical connection with the circuit board so as to adjust the position of the adjustable connector on the circuit board.

Abstract: A method and apparatus for improving a uniformity of a thermally grown silicon dioxide layer including thermally growing a layer over the exposed silicon portions including silicon dioxide according to a thermal oxide growing process; exposing the gas reactant feed lines to reactant gases during at least one of the step of thermally growing a layer and a cleaning process following the step of thermally growing a layer; and, purging the gas flow pathways to bypass the reactor chamber with at least one purge gas source including an inert gas to remove residual reactant gas contaminants to improve a subsequently thermally grown silicon dioxide layer.

Abstract: A method and apparatus for improving a uniformity of a thermally grown silicon dioxide layer including thermally growing a layer over the exposed silicon portions including silicon dioxide according to a thermal oxide growing process; exposing the gas reactant feed lines to reactant gases during at least one of the step of thermally growing a layer and a cleaning process following the step of thermally growing a layer; and, purging the gas flow pathways to bypass the reactor chamber with at least one purge gas source including an inert gas to remove residual reactant gas contaminants to improve a subsequently thermally grown silicon dioxide layer.

Abstract: A cylinder apparatus having a container whose inner space is divided into two space section by a piston, each space section having an opening for installing a tube, respectively, a needle valve installed on the tube for adjusting air pressure of the space section, and a door connected to the piston via a rod, is described. The moving speed of the door is identical to that of the piston.

Abstract: An apparatus for measuring tension and stress, which is capable of adjusting an angle of measurement. The apparatus includes a base plate, a supporting member, and a body for measuring tension and stress. The supporting member is mounted on the base plate. The supporting member further includes a revolving spindle supported by a bearing so that the body for measuring tension and stress can be attached to the supporting member in a way that the body for measuring tension and stress is capable of turning on the revolving spindle. In this way, the user can adjust the angle between the body for measuring tension and stress and the base plate, fulfilling the purpose of doing measurement for an object in an arbitrary angle of measurement.