Patents by Inventor Yi Ju

Yi Ju has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8693435
    Abstract: A method and system for the UE and RNC to reduce transmission latency and potentially prevent loss of PDUs upon a MAC layer reset. UE generation of the status PDU is coupled with the MAC layer reset. The RNC generates a message with a MAC reset indication. Following the MAC layer reset all PDUs stored in the UE MAC layer reordering buffers are flushed to RLC entities and then processed by RLC entities prior to the generation of a PDU status report. The PDU status report provides to the RNC the status of all successfully received PDUs. Upon reception of a PDU status report in the RNC, missing PDUs are realized and retransmitted to the UE.
    Type: Grant
    Filed: April 26, 2010
    Date of Patent: April 8, 2014
    Assignee: InterDigital Technology Corporation
    Inventors: Stephen E. Terry, Yi-Ju Chao
  • Publication number: 20140077045
    Abstract: A testing fixture is provided, which is adapted to adjust the position of an object to be tested and includes a first translation mechanism, a second translation mechanism and a height-adjusting mechanism. The first translation mechanism is able to move along a first axis, the second translation mechanism is disposed at the first translation mechanism and is able to move along a second axis perpendicular to the first axis, and the height-adjusting mechanism is disposed at the second translation mechanism and adapted to hold the object to be tested and is able to move along a third axis perpendicular to the first axis and the second axis.
    Type: Application
    Filed: January 14, 2013
    Publication date: March 20, 2014
    Applicant: ASKEY COMPUTER CORP.
    Inventor: Yi-Ju Chen
  • Patent number: 8675044
    Abstract: An image playback method includes starting an image display module, detecting glasses data in a predetermined range, comparing the detected glasses data with a set of data to generate a first comparison result, and the image display module playing a 3D image or a 2D image according to the first comparison result.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: March 18, 2014
    Assignee: Wistron Corporation
    Inventors: Yi-Ju Yu, Shih-Lin Chiu, Wen-Chin Wu
  • Publication number: 20140036671
    Abstract: Managing the transmission and retransmission of radio link control (RLC) data protocol data units (PDUs) is disclosed. An indication is received that an RLC data PDU was not successfully received by a receiving device. The RLC data PDU, that was not successfully received, is retransmitted, and prioritized over non-retransmitted RLC data PDUs. A number of times that the RLC data PDU was retransmitted is determined.
    Type: Application
    Filed: October 9, 2013
    Publication date: February 6, 2014
    Applicant: InterDigital Technology Corporation
    Inventors: Stephen E. Terry, Yi-Ju Chao, James M. Miller
  • Patent number: 8605564
    Abstract: An audio mixing method includes: performing an audio processing operation upon a first audio input derived from at least one decoded audio input to generate a processed audio output, and generating a mixed audio signal by mixing at least a second audio input and the processed audio output. An audio mixing apparatus includes an audio processing circuit and an audio mixing circuit. The audio processing circuit is utilized for performing an audio processing operation upon a first audio input derived from at least one decoded audio input and accordingly generating a processed audio output. The audio mixing circuit is coupled to the audio processing circuit, and utilized for generating a mixed audio signal by mixing at least a second audio input and the processed audio output.
    Type: Grant
    Filed: April 28, 2011
    Date of Patent: December 10, 2013
    Assignee: Mediatek Inc.
    Inventor: Yi-Ju Lien
  • Publication number: 20130314962
    Abstract: A three-phase reactor power saving device, comprising: a first capacitor set, connected electrically to a three-phase AC power supply, to store electric energy; a reactor set, connected electrically to said first capacitor set, to convert said electric energy into AC self-induced energy; a three-phase transformer, connected electrically to said reactor set, to boost said AC self-induced energy into boosted AC self-induced energy; a second capacitor set, connected electrically to said three-phase transformer, to store said boosted AC self-induced energy; a rectifier circuit, connected electrically to said three-phase transformer, to rectify current of said boosted AC self-induced energy into a DC current; a power regulating capacitor, connected electrically to said rectifier circuit; and a first DC reactor and a second DC reactor, connected electrically to said rectifier circuit, to output first DC self-induced energy and second DC self-induced energy to said load, to raise power saving efficiency.
    Type: Application
    Filed: September 5, 2012
    Publication date: November 28, 2013
    Applicant: RONG SHIN JONG CO., LTD.
    Inventors: YI JU CHUNG, CHIA HSIEN PU
  • Publication number: 20130314952
    Abstract: A single-phase reactor power saving device, used to receive an AC power supply, and comprising: a first capacitor, connected electrically to said AC power supply, to store electric energy; a first and a second reactor, connected electrically to said first capacitor, to output first AC self-induced energy, and second AC self-induced energy; a center-tapped circuit, connected electrically to said first reactor and said second reactor, to convert currents of said first AC self-induced energy and said second AC self-induced energy into a DC current; a second capacitor, connected electrically to said center-tapped circuit, to store energy of said DC current; and a first DC reactor and a second DC reactor, connected electrically to said center-tapped circuit, to generate and output respectively currents of first DC self-induced energy and second DC self-induced energy to said load, to raise power saving efficiency and quality of power supply.
    Type: Application
    Filed: September 5, 2012
    Publication date: November 28, 2013
    Applicant: RONG SHIN JONG CO., LTD.
    Inventors: YI JU CHUNG, CHIA HSIEN PU
  • Publication number: 20130311105
    Abstract: An embodiment of a method for generating a flow order that minimizes the accumulation of phasic synchrony error in sequence data is described that comprises the steps of: (a) generating a plurality of sequential orderings of nucleotides species comprising a k-base length, wherein the sequential orderings define a sequence of introduction of nucleotide species into a sequencing by synthesis reaction environment; (b) simulating acquisition of sequence data from one or more reference genomes using the sequential orderings, wherein the sequence data comprises an accumulation of phasic synchrony error; and (c) selecting one or more of the sequential orderings using a read length parameter and an extension rate parameter.
    Type: Application
    Filed: March 13, 2013
    Publication date: November 21, 2013
    Inventors: Yi-Ju Chen, Chiu Tai Andrew Wong
  • Patent number: 8587013
    Abstract: A semiconductor package structure includes an insulating substrate, a patterned conductive layer, a light emitting diode (LED) chip and a conductive connection part. The insulating substrate has an upper surface divided into an element configuration region and an element bonding region. The patterned conductive layer includes plural circuits located in the element configuration region and at least one bonding pad located in the element bonding region. The LED chip is flip chip bonded on the patterned conductive layer and electrically connected to the circuits. The conductive connection part has a first end point electrically connected to the bonding pad and a second end point electrically connected to an external circuit. The bonding pad and a corner of the LED chip are disposed correspondingly. A horizontal distance between an apex of the corner and the first end point of the conductive connection part is greater than or equal to 30 micrometers.
    Type: Grant
    Filed: November 6, 2012
    Date of Patent: November 19, 2013
    Assignee: Genesis Photonics Inc.
    Inventors: Po-Jen Su, Chih-Ling Wu, Yi-Ru Huang, Yi-Ju Shih
  • Publication number: 20130301417
    Abstract: A system and method which permit the RNC to control purging of data buffered in the Node B. The RNC monitors for a triggering event, which initiates the purging process. The RNC then informs the Node B of the need to purge data by transmitting a purge command, which prompts the Node B to delete at least a portion of buffered data. The purge command can include instructions for the Node B to purge all data for a particular UE, data in one or several user priority transmission queues or in one or more logical channels in the Node B, depending upon the particular data purge triggering event realized in the RNC.
    Type: Application
    Filed: July 22, 2013
    Publication date: November 14, 2013
    Applicant: InterDigital Technology Corporation
    Inventors: Stephen E. Terry, Yi-Ju Chao, James M. Miller
  • Patent number: 8565241
    Abstract: A medium access control (MAC) architecture reduces transmission latency for data block retransmissions. A plurality of data blocks are received and temporarily stored in a first memory (e.g., queue, buffer). The plurality of data blocks are then transmitted. A determination is made as to whether each of the transmitted data blocks was received successfully or needs to be retransmitted because the data block was not received successfully. Each of the transmitted data blocks that needs to be retransmitted is marked and temporarily stored in a second memory having a higher priority than the first memory. The marked data blocks are retransmitted before data blocks stored in the first memory location.
    Type: Grant
    Filed: October 27, 2011
    Date of Patent: October 22, 2013
    Assignee: InterDigital Technology Corporation
    Inventors: Stephen E. Terry, Yi-Ju Chao, James M. Miller
  • Patent number: 8559452
    Abstract: The present invention allows for effective sharing of the hardware memory of a wireless transmit receive unit (WTRU). The memory will be shared among various buffers of different entities. More particularly, memory will be shared among the MAC reordering buffers and the RLC reception buffers.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: October 15, 2013
    Assignee: InterDigital Technology Corporation
    Inventors: Stephen G. Dick, Stephen E. Terry, Yi-Ju Chao
  • Publication number: 20130252944
    Abstract: The present invention relates to novel compounds of Formula (I), wherein M, A and Y are defined as in Formula (I); invention compounds are modulators of metabotropic glutamate receptors—subtype 4 (“mGluR4”) which are useful for the treatment or prevention of central nervous system disorders as well as other disorders modulated by mGluR4 receptors. The invention is also directed to pharmaceutical compositions and the use of such compounds in the manufacture of medicaments, as well as to the use of such compounds for the prevention and treatment of such diseases in which mGluR4 is involved.
    Type: Application
    Filed: July 11, 2011
    Publication date: September 26, 2013
    Inventors: Christelle Bolea, Sylvain Celanire, Lam Tang, Philip Jones, Nigel J. Liverton, Richard Soll, Jingchao Dong, Zhiyu Lei, Fuqing Liu, Yanling Kong, Yi Ju, Haoyong Zhang, Jieping Wei, Qiaoxin Wei, Minxiang Zhang, Yunfu Luo
  • Patent number: 8531021
    Abstract: A package stack device includes a first package structure having a plurality of first metal posts and a first electronic element disposed on a surface thereof, a second package structure having a plurality of second metal posts and a second electronic element disposed on opposite surfaces thereof, and an encapsulant formed between the first and second package structures for encapsulating the first electronic element. By connecting the first and second metal posts, the second package structure is stacked on the first package structure with the support of the metal posts and the encapsulant filling the gap therebetween so as to prevent warpage of the substrate.
    Type: Grant
    Filed: June 15, 2011
    Date of Patent: September 10, 2013
    Assignee: Unimicron Technology Corporation
    Inventors: Chu-Chin Hu, Shih-Ping Hsu, Yi-Ju Chen
  • Patent number: 8493865
    Abstract: A system and method which permit the RNC to control purging of data buffered in the Node B. The RNC monitors for a triggering event, which initiates the purging process. The RNC then informs the Node B of the need to purge data by transmitting a purge command, which prompts the Node B to delete at least a portion of buffered data. The purge command can include instructions for the Node B to purge all data for a particular UE, data in one or several user priority transmission queues or in one or more logical channels in the Node B, depending upon the particular data purge triggering event realized in the RNC.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: July 23, 2013
    Assignee: InterDigital Technology Corporation
    Inventors: Stephen E. Terry, Yi-Ju Chao, James M. Miller
  • Publication number: 20130172958
    Abstract: The disclosure relates to a current stimulator, which comprises a high voltage output module, a voltage control module and a charge pump module. The high voltage output module includes a plurality of stacked transistors, and receives an input control signal able to turn on/off the current stimulator and a first voltage. A second voltage is generated by adding the voltages output by all the transistors to the first voltage and then output to the voltage control module. The voltage control module outputs a voltage control signal able to stabilize the stimulus current for the load according to the second voltage and the load impedance variation. The charge pump regulates the first voltage according to the voltage control signal, and outputs the regulated first voltage to the high voltage output module. Thereby, the current stimulator can adaptively stabilize the stimulus current, responding to load impedance variation.
    Type: Application
    Filed: April 4, 2012
    Publication date: July 4, 2013
    Inventors: Chun-Yu Lin, Yi-ju Li, Ming-Dou Ker
  • Publication number: 20130169144
    Abstract: A LED package structure capable of adjusting the spatial color uniformity and the light distribution curve includes a substrate unit, a light-emitting unit, a transparent package unit, and a phosphor package unit. The light-emitting unit includes at least one light-emitting element for generating a light-emitting source to show a predetermined light distribution curve. The transparent package unit includes a transparent package resin body covering the light-emitting element. The phosphor package unit includes a phosphor package resin body covering the transparent package resin body. Hence, when the light-emitting source generated by the light-emitting element is transformed into a light-projecting source through the transparent package resin body and the phosphor package resin body sequentially, and the spatial color uniformity and the light distribution curve of the light-projecting source can be adjusted according to the phosphor package resin body having a non-uniform thickness.
    Type: Application
    Filed: January 3, 2012
    Publication date: July 4, 2013
    Applicant: LUSTROUS TECHNOLOGY LTD.
    Inventors: KAO-HSU CHOU, CHIA-LUNG HSUEH, YI-JU LI, SHIH-MIN WU, DAWSON LIU
  • Publication number: 20130153944
    Abstract: A semiconductor package structure includes an insulating substrate, a patterned conductive layer, a light emitting diode (LED) chip and a conductive connection part. The insulating substrate has an upper surface divided into an element configuration region and an element bonding region. The patterned conductive layer includes plural circuits located in the element configuration region and at least one bonding pad located in the element bonding region. The LED chip is flip chip bonded on the patterned conductive layer and electrically connected to the circuits. The conductive connection part has a first end point electrically connected to the bonding pad and a second end point electrically connected to an external circuit. The bonding pad and a corner of the LED chip are disposed correspondingly. A horizontal distance between an apex of the corner and the first end point of the conductive connection part is greater than or equal to 30 micrometers.
    Type: Application
    Filed: November 6, 2012
    Publication date: June 20, 2013
    Inventors: Po-Jen Su, Chih-Ling Wu, Yi-Ru Huang, Yi-Ju Shih
  • Publication number: 20130148344
    Abstract: A light emitting device including an insulating substrate, a plurality of light emitting diode (LED) chips and a patterned conductive layer is provided. The insulating substrate has an upper surface. The LED chips are disposed on the insulating substrate and located on the upper surface. The dominant wavelengths of the LED chips are in a wavelength range of a specific color light and the dominant wavelengths of at least two of the LED chips are different. The patterned conductive layer is disposed between the insulating substrate and LED chips, and electrically connected to the LEDs chip.
    Type: Application
    Filed: November 6, 2012
    Publication date: June 13, 2013
    Inventors: Po-Jen Su, Yun-Li Li, Yi-Ju Shih, Cheng-Yen Chen, Gwo-Jiun Sheu
  • Publication number: 20130122727
    Abstract: An electronic device includes a body, a door, and a connection module. The body has an opening located at a side of the body. The door is pivoted to the body and capable of rotating between an opening position and a closing position in relative to the body for exposing or covering the opening. The connection module is slidably connected to the body. When the door is rotated to the opening position in relative to the body and exposes the opening, the door drives the connection module to slide to a working position in relative to the body, and when the door is rotated to the closing position in relative to the body and covers the opening, the door drives the connection module to slide to a retracted position in relative to the body.
    Type: Application
    Filed: November 7, 2012
    Publication date: May 16, 2013
    Inventors: Yi-Ju Liao, Hsien-Tang Liao, Long-Cheng Chang, Po-Chin Yu, Wei-Chih Hsu