Abstract: A method for making iridium oxide nanoparticles includes dissolving an iridium salt to obtain a salt-containing solution, mixing a complexing agent with the salt-containing solution to obtain a blend solution, and adding an oxidating agent to the blend solution to obtain a product mixture. A molar ratio of a complexing compound of the complexing agent to the iridium salt is controlled in a predetermined range so as to permit the product mixture to include iridium oxide nanoparticles.

Abstract: A method for fabricating a semiconductor device includes the steps of first forming a first inter-metal dielectric (IMD) layer on a substrate and a metal interconnection in the first IMD layer, forming a magnetic tunneling junction (MTJ) and a top electrode on the metal interconnection, forming a spacer adjacent to the MTJ and the top electrode, forming a second IMD layer around the spacer, forming a cap layer on the top electrode, the spacer, and the second IMD layer, and then patterning the cap layer to form a protective cap on the top electrode and the spacer.

Abstract: A semiconductor device includes a substrate, a first dielectric layer, a second dielectric layer, and a third dielectric layer. The first dielectric layer is disposed on the substrate, around a first metal interconnection. The second dielectric layer is disposed on the first dielectric layer, around a via and a second metal interconnection. The second metal interconnection directly contacts the first metal interconnection. The third dielectric layer is disposed on the second dielectric layer, around a first magnetic tunneling junction (MTJ) structure and a third metal interconnection. The third metal interconnection directly contacts top surfaces of the first MTJ structure and the second metal interconnection, and the first MTJ structure directly contacts the via.

Abstract: A hybrid random access memory for a system-on-chip (SOC), including a semiconductor substrate with a MRAM region and a ReRAM region, a first dielectric layer on the semiconductor substrate, multiple ReRAM cells in the first dielectric layer on the ReRAM region, a second dielectric layer above the first dielectric layer, and multiple MRAM cells in the second dielectric layer on the MRAM region.

Abstract: A motor control apparatus receives a DC power source through a DC terminal and is coupled to a motor. The motor control apparatus includes a brake, an inverter, and a controller. The brake is coupled to the inverter. The brake includes an energy-consuming component and a switch component. The controller controls the inverter to convert the DC power source to drive the motor. When the controller determines that the DC power source is interrupted, the controller stops controlling the inverter, and the switch component is self-driven turned on so that a back electromotive force generated by the motor is consumed through the energy-consuming component.

Abstract: An operating system with automatic login mechanism and an automatic login method are provided. The operating system includes a first electronic device, a second electronic device and a server device. The second electronic device includes a biometric sensor. When a login event of the first electronic is triggered, the first electronic device sends a login request to the second electronic device directly or via the server device, so that the second electronic device performs a biometric verification by the biometric sensor according to the login request. When the biometric verification is passed, the second electronic device sends a first login credential to the first electronic device directly or via the server device, so that the first electronic device performs an automatic login operation of the first electronic device according to the first login credential.

Abstract: An operating system with automatic login mechanism and an automatic login method are provided. The operating system includes a first electronic device, a second electronic device and a server device. The second electronic device includes a biometric sensor. When a login event of the first electronic is triggered, the first electronic device sends a login request to the second electronic device directly or via the server device, so that the second electronic device performs a biometric verification by the biometric sensor according to the login request. When the biometric verification is passed, the second electronic device sends a first login credential to the first electronic device directly or via the server device, so that the first electronic device performs an automatic login operation of the first electronic device according to the first login credential.

Abstract: A login mechanism for an operating system, including: a computer device, loaded with a computer operating system; and a mobile device, capable of sending a login password for the computer operating system, and capable of authenticating a human biometric feature. In the login mechanism of the present invention, the login password for the computer operating system is stored on the mobile device. When a user logs in to the computer operating system, the mobile device authenticates a biometric feature. After authentication succeeds, the mobile device transfers the login password to the computer device, so as to log in to the computer operating system. A user does not need to enter a login password, and two-factor authentication including login password authentication and biometric feature authentication is used to protect the security of login to the computer operating system.

Abstract: A login mechanism for an operating system, including: a computer device, loaded with a computer operating system; and a mobile device, capable of sending a login password for the computer operating system, and capable of authenticating a human biometric feature. In the login mechanism of the present invention, the login password for the computer operating system is stored on the mobile device. When a user logs in to the computer operating system, the mobile device authenticates a biometric feature. After authentication succeeds, the mobile device transfers the login password to the computer device, so as to log in to the computer operating system. A user does not need to enter a login password, and two-factor authentication including login password authentication and biometric feature authentication is used to protect the security of login to the computer operating system.

Abstract: A login mechanism for an operating system, including: a computer device, loaded with a computer operating system; and a mobile device, capable of sending a login password for the computer operating system, and capable of authenticating a human biometric feature. In the login mechanism of the present invention, the login password for the computer operating system is stored on the mobile device. When a user logs in to the computer operating system, the mobile device authenticates a biometric feature. After authentication succeeds, the mobile device transfers the login password to the computer device, so as to log in to the computer operating system. A user does not need to enter a login password, and two-factor authentication including login password authentication and biometric feature authentication is used to protect the security of login to the computer operating system.

Abstract: A manufacturing method of an electronic device includes: providing a substrate; forming a source and a drain on the substrate; forming a semiconductor layer on the substrate; forming a first light sensitive material layer on the semiconductor layer; removing a first portion of the first light sensitive material layer by a first exposure and development process and maintaining a second portion of the first light sensitive material layer to serve as a first gate insulation layer; patterning the semiconductor layer to form a channel layer below the first gate insulation layer; forming a second light sensitive material layer on the substrate; removing a third portion of the second light sensitive material layer by a second exposure and development process to expose at least a part of the first gate insulation layer; and forming a first gate on the first gate insulation layer. An electronic device is also provided.

Abstract: A structure and a method for packaging an organic optoelectronic device are provided. In this method, a first substrate is provided, and a first barrier layer is disposed on the first substrate. An organic optoelectronic device is formed on the first barrier layer, and a first recess is also formed on the first barrier layer, in which the first recess forms a closed loop to surround the organic optoelectronic device. A sealant fills the first recess, and a second barrier layer is disposed on the organic optoelectronic device, in which the sealant attaches the second barrier layer to the first barrier layer to surround the organic optoelectronic device.

Abstract: An electronic device with a fold mode and an unfold mode includes a display module and an input module. The display module includes a first connecting component, a second connecting component and a flexible displaying panel. The second connecting component rotates relative to the first connecting component via a first direction to form as the fold mode or the unfold mode. The flexible displaying panel is disposed on the first connecting component and the second connecting component. The flexible displaying panel is bent to be U-shaped when the display module is formed as the fold mode. The flexible displaying panel is flat when the display module is formed as the unfold mode, and a planar normal vector points toward a second direction. The input module is rotatably connected to the display module via a third direction.

Abstract: An electronic device package of the disclosure includes a gas barrier substrate, a base layer, an electronic device and a barrier film. The base layer is disposed on the gas barrier substrate and made of a light curing material. The electronic device is disposed on the base layer. The barrier film is disposed on the gas barrier substrate, in which the barrier film and the gas barrier substrate clad the electronic device and the base layer. The disclosure also provides a manufacturing method of an electronic device package.

Abstract: A transistor structure including a gate, an insulation layer, a patterned semiconductor layer, a source, a drain and a light absorption layer and a manufacturing method thereof are provided. The gate is disposed on a substrate. An area of the gate overlaps an area of the patterned semiconductor layer. The insulation layer is disposed between the gate and the patterned semiconductor layer. The source and the drain are separated from each other and in contact with the patterned semiconductor layer. The patterned semiconductor layer is disposed between the light absorption layer and the substrate. An area of the light absorption layer overlaps an area of the patterned semiconductor layer. An absorption spectrum of the light absorption layer overlaps an absorption spectrum of the patterned semiconductor layer.

Abstract: A manufacturing method of an electronic device includes: providing a substrate; forming a source and a drain on the substrate; forming a semiconductor layer on the substrate; forming a first light sensitive material layer on the semiconductor layer; removing a first portion of the first light sensitive material layer by a first exposure and development process and maintaining a second portion of the first light sensitive material layer to serve as a first gate insulation layer; patterning the semiconductor layer to form a channel layer below the first gate insulation layer; forming a second light sensitive material layer on the substrate; removing a third portion of the second light sensitive material layer by a second exposure and development process to expose at least a part of the first gate insulation layer; and forming a first gate on the first gate insulation layer. An electronic device is also provided.

Abstract: A transistor structure including a gate, an insulation layer, a patterned semiconductor layer, a source, a drain and a light absorption layer and a manufacturing method thereof are provided. The gate is disposed on a substrate. An area of the gate overlaps an area of the patterned semiconductor layer. The insulation layer is disposed between the gate and the patterned semiconductor layer. The source and the drain are separated from each other and in contact with the patterned semiconductor layer. The patterned semiconductor layer is disposed between the light absorption layer and the substrate. An area of the light absorption layer overlaps an area of the patterned semiconductor layer. An absorption spectrum of the light absorption layer overlaps an absorption spectrum of the patterned semiconductor layer.

Abstract: A structure and a method for packaging an organic optoelectronic device are provided. In this method, a first substrate is provided, and a first barrier layer is disposed on the first substrate. An organic optoelectronic device is formed on the first barrier layer, and a first recess is also formed on the first barrier layer, in which the first recess forms a closed loop to surround the organic optoelectronic device. A sealant fills the first recess, and a second barrier layer is disposed on the organic optoelectronic device, in which the sealant attaches the second barrier layer to the first barrier layer to surround the organic optoelectronic device.

Abstract: An electronic device package of the disclosure includes a gas barrier substrate, a base layer, an electronic device and a barrier film. The base layer is disposed on the gas barrier substrate and made of a light curing material. The electronic device is disposed on the base layer. The barrier film is disposed on the gas barrier substrate, in which the barrier film and the gas barrier substrate clad the electronic device and the base layer. The disclosure also provides a manufacturing method of an electronic device package.

Abstract: An electronic device with a fold mode and an unfold mode includes a display module and an input module. The display module includes a first connecting component, a second connecting component and a flexible displaying panel. The second connecting component rotates relative to the first connecting component via a first direction to form as the fold mode or the unfold mode. The flexible displaying panel is disposed on the first connecting component and the second connecting component. The flexible displaying panel is bent to be U-shaped when the display module is formed as the fold mode. The flexible displaying panel is flat when the display module is formed as the unfold mode, and a planar normal vector points toward a second direction. The input module is rotatably connected to the display module via a third direction.