Patents by Inventor Yi-Kai Wang
Yi-Kai Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11588808Abstract: An operating system with automatic login mechanism and an automatic login method are provided. The operating system includes a first electronic device, a second electronic device and a server device. The second electronic device includes a biometric sensor. When a login event of the first electronic is triggered, the first electronic device sends a login request to the second electronic device directly or via the server device, so that the second electronic device performs a biometric verification by the biometric sensor according to the login request. When the biometric verification is passed, the second electronic device sends a first login credential to the first electronic device directly or via the server device, so that the first electronic device performs an automatic login operation of the first electronic device according to the first login credential.Type: GrantFiled: July 31, 2020Date of Patent: February 21, 2023Assignee: GoTrustID Inc.Inventors: Darren Tien-Chi Lee, Minglian Chen, Jeng-Lung Li, Yi-Kai Wang
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Publication number: 20210136056Abstract: An operating system with automatic login mechanism and an automatic login method are provided. The operating system includes a first electronic device, a second electronic device and a server device. The second electronic device includes a biometric sensor. When a login event of the first electronic is triggered, the first electronic device sends a login request to the second electronic device directly or via the server device, so that the second electronic device performs a biometric verification by the biometric sensor according to the login request. When the biometric verification is passed, the second electronic device sends a first login credential to the first electronic device directly or via the server device, so that the first electronic device performs an automatic login operation of the first electronic device according to the first login credential.Type: ApplicationFiled: July 31, 2020Publication date: May 6, 2021Applicant: GoTrustID Inc.Inventors: Darren Tien-Chi Lee, Minglian Chen, Jeng-Lung Li, Yi-Kai Wang
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Publication number: 20200134149Abstract: A login mechanism for an operating system, including: a computer device, loaded with a computer operating system; and a mobile device, capable of sending a login password for the computer operating system, and capable of authenticating a human biometric feature. In the login mechanism of the present invention, the login password for the computer operating system is stored on the mobile device. When a user logs in to the computer operating system, the mobile device authenticates a biometric feature. After authentication succeeds, the mobile device transfers the login password to the computer device, so as to log in to the computer operating system. A user does not need to enter a login password, and two-factor authentication including login password authentication and biometric feature authentication is used to protect the security of login to the computer operating system.Type: ApplicationFiled: October 29, 2019Publication date: April 30, 2020Inventors: Darren Tien-Chi Lee, Jeng Lung Li, Yi-Kai Wang, Jiacheng Xu
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Patent number: 10474804Abstract: A login mechanism for an operating system, including: a computer device, loaded with a computer operating system; and a mobile device, capable of sending a login password for the computer operating system, and capable of authenticating a human biometric feature. In the login mechanism of the present invention, the login password for the computer operating system is stored on the mobile device. When a user logs in to the computer operating system, the mobile device authenticates a biometric feature. After authentication succeeds, the mobile device transfers the login password to the computer device, so as to log in to the computer operating system. A user does not need to enter a login password, and two-factor authentication including login password authentication and biometric feature authentication is used to protect the security of login to the computer operating system.Type: GrantFiled: December 7, 2017Date of Patent: November 12, 2019Assignee: GOTRUSTID, INC.Inventors: Darren Tien-Chi Lee, Jeng Lung Li, Yi-Kai Wang, Jiacheng Xu
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Publication number: 20180165436Abstract: A login mechanism for an operating system, including: a computer device, loaded with a computer operating system; and a mobile device, capable of sending a login password for the computer operating system, and capable of authenticating a human biometric feature. In the login mechanism of the present invention, the login password for the computer operating system is stored on the mobile device. When a user logs in to the computer operating system, the mobile device authenticates a biometric feature. After authentication succeeds, the mobile device transfers the login password to the computer device, so as to log in to the computer operating system. A user does not need to enter a login password, and two-factor authentication including login password authentication and biometric feature authentication is used to protect the security of login to the computer operating system.Type: ApplicationFiled: December 7, 2017Publication date: June 14, 2018Inventors: DARREN TIEN-CHI LEE, JENG LUNG LI, YI-KAI WANG
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Patent number: 9954171Abstract: A manufacturing method of an electronic device includes: providing a substrate; forming a source and a drain on the substrate; forming a semiconductor layer on the substrate; forming a first light sensitive material layer on the semiconductor layer; removing a first portion of the first light sensitive material layer by a first exposure and development process and maintaining a second portion of the first light sensitive material layer to serve as a first gate insulation layer; patterning the semiconductor layer to form a channel layer below the first gate insulation layer; forming a second light sensitive material layer on the substrate; removing a third portion of the second light sensitive material layer by a second exposure and development process to expose at least a part of the first gate insulation layer; and forming a first gate on the first gate insulation layer. An electronic device is also provided.Type: GrantFiled: September 12, 2014Date of Patent: April 24, 2018Assignee: Wistron CorporationInventors: Yu-Jung Peng, Hsin-Yu Hsieh, Yi-Kai Wang
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Patent number: 9530987Abstract: A structure and a method for packaging an organic optoelectronic device are provided. In this method, a first substrate is provided, and a first barrier layer is disposed on the first substrate. An organic optoelectronic device is formed on the first barrier layer, and a first recess is also formed on the first barrier layer, in which the first recess forms a closed loop to surround the organic optoelectronic device. A sealant fills the first recess, and a second barrier layer is disposed on the organic optoelectronic device, in which the sealant attaches the second barrier layer to the first barrier layer to surround the organic optoelectronic device.Type: GrantFiled: April 29, 2015Date of Patent: December 27, 2016Assignee: WISTRON CORP.Inventors: Tarng-Shiang Hu, Yi-Kai Wang, Chi-Jen Kao
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Patent number: 9442529Abstract: An electronic device with a fold mode and an unfold mode includes a display module and an input module. The display module includes a first connecting component, a second connecting component and a flexible displaying panel. The second connecting component rotates relative to the first connecting component via a first direction to form as the fold mode or the unfold mode. The flexible displaying panel is disposed on the first connecting component and the second connecting component. The flexible displaying panel is bent to be U-shaped when the display module is formed as the fold mode. The flexible displaying panel is flat when the display module is formed as the unfold mode, and a planar normal vector points toward a second direction. The input module is rotatably connected to the display module via a third direction.Type: GrantFiled: November 19, 2014Date of Patent: September 13, 2016Assignee: Wistron CorporationInventors: Hao-Chien Huang, Yi-Kai Wang, Chia-Han Chen, Chun-Yu Lin, Hsin-Yu Hsieh
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Patent number: 9373803Abstract: An electronic device package of the disclosure includes a gas barrier substrate, a base layer, an electronic device and a barrier film. The base layer is disposed on the gas barrier substrate and made of a light curing material. The electronic device is disposed on the base layer. The barrier film is disposed on the gas barrier substrate, in which the barrier film and the gas barrier substrate clad the electronic device and the base layer. The disclosure also provides a manufacturing method of an electronic device package.Type: GrantFiled: August 5, 2014Date of Patent: June 21, 2016Assignee: Wistron CorporationInventors: Chi-Jen Kao, Ko-Yu Chiang, Yi-Kai Wang, Tarng-Shiang Hu
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Patent number: 9281380Abstract: A transistor structure including a gate, an insulation layer, a patterned semiconductor layer, a source, a drain and a light absorption layer and a manufacturing method thereof are provided. The gate is disposed on a substrate. An area of the gate overlaps an area of the patterned semiconductor layer. The insulation layer is disposed between the gate and the patterned semiconductor layer. The source and the drain are separated from each other and in contact with the patterned semiconductor layer. The patterned semiconductor layer is disposed between the light absorption layer and the substrate. An area of the light absorption layer overlaps an area of the patterned semiconductor layer. An absorption spectrum of the light absorption layer overlaps an absorption spectrum of the patterned semiconductor layer.Type: GrantFiled: August 6, 2014Date of Patent: March 8, 2016Assignee: Wistron CorporationInventors: Chi-Jen Kao, Yu-Jung Peng, Yi-Kai Wang
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Publication number: 20150287924Abstract: A manufacturing method of an electronic device includes: providing a substrate; forming a source and a drain on the substrate; forming a semiconductor layer on the substrate; forming a first light sensitive material layer on the semiconductor layer; removing a first portion of the first light sensitive material layer by a first exposure and development process and maintaining a second portion of the first light sensitive material layer to serve as a first gate insulation layer; patterning the semiconductor layer to form a channel layer below the first gate insulation layer; forming a second light sensitive material layer on the substrate; removing a third portion of the second light sensitive material layer by a second exposure and development process to expose at least a part of the first gate insulation layer; and forming a first gate on the first gate insulation layer. An electronic device is also provided.Type: ApplicationFiled: September 12, 2014Publication date: October 8, 2015Inventors: Yu-Jung Peng, Hsin-Yu Hsieh, Yi-Kai Wang
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Publication number: 20150234433Abstract: An electronic device with a fold mode and an unfold mode includes a display module and an input module. The display module includes a first connecting component, a second connecting component and a flexible displaying panel. The second connecting component rotates relative to the first connecting component via a first direction to form as the fold mode or the unfold mode. The flexible displaying panel is disposed on the first connecting component and the second connecting component. The flexible displaying panel is bent to be U-shaped when the display module is formed as the fold mode. The flexible displaying panel is flat when the display module is formed as the unfold mode, and a planar normal vector points toward a second direction. The input module is rotatably connected to the display module via a third direction.Type: ApplicationFiled: November 19, 2014Publication date: August 20, 2015Inventors: Hao-Chien Huang, Yi-Kai Wang, Chia-Han Chen, Chun-Yu Lin, Hsin-Yu Hsieh
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Publication number: 20150235967Abstract: A transistor structure including a gate, an insulation layer, a patterned semiconductor layer, a source, a drain and a light absorption layer and a manufacturing method thereof are provided. The gate is disposed on a substrate. An area of the gate overlaps an area of the patterned semiconductor layer. The insulation layer is disposed between the gate and the patterned semiconductor layer. The source and the drain are separated from each other and in contact with the patterned semiconductor layer. The patterned semiconductor layer is disposed between the light absorption layer and the substrate. An area of the light absorption layer overlaps an area of the patterned semiconductor layer. An absorption spectrum of the light absorption layer overlaps an absorption spectrum of the patterned semiconductor layer.Type: ApplicationFiled: August 6, 2014Publication date: August 20, 2015Inventors: Chi-Jen Kao, Yu-Jung Peng, Yi-Kai Wang
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Publication number: 20150236307Abstract: A structure and a method for packaging an organic optoelectronic device are provided. In this method, a first substrate is provided, and a first barrier layer is disposed on the first substrate. An organic optoelectronic device is formed on the first barrier layer, and a first recess is also formed on the first barrier layer, in which the first recess forms a closed loop to surround the organic optoelectronic device. A sealant fills the first recess, and a second barrier layer is disposed on the organic optoelectronic device, in which the sealant attaches the second barrier layer to the first barrier layer to surround the organic optoelectronic device.Type: ApplicationFiled: April 29, 2015Publication date: August 20, 2015Inventors: Tarng-Shiang HU, Yi-Kai WANG, Chi-Jen KAO
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Publication number: 20150236286Abstract: An electronic device package of the disclosure includes a gas barrier substrate, a base layer, an electronic device and a barrier film. The base layer is disposed on the gas barrier substrate and made of a light curing material. The electronic device is disposed on the base layer. The barrier film is disposed on the gas barrier substrate, in which the barrier film and the gas barrier substrate clad the electronic device and the base layer. The disclosure also provides a manufacturing method of an electronic device package.Type: ApplicationFiled: August 5, 2014Publication date: August 20, 2015Inventors: Chi-Jen Kao, Ko-Yu Chiang, Yi-Kai Wang, Tarng-Shiang Hu
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Patent number: 9054326Abstract: A structure and a method for packaging an organic optoelectronic device are provided. In this method, a first substrate is provided, and a first barrier layer is disposed on the first substrate. An organic optoelectronic device is formed on the first barrier layer, and a first recess is also formed on the first barrier layer, in which the first recess forms a closed loop to surround the organic optoelectronic device. A sealant fills the first recess, and a second barrier layer is disposed on the organic optoelectronic device, in which the sealant attaches the second barrier layer to the first barrier layer to surround the organic optoelectronic device.Type: GrantFiled: November 3, 2013Date of Patent: June 9, 2015Assignee: WISTRON CORP.Inventors: Tarng-Shiang Hu, Yi-Kai Wang, Chi-Jen Kao
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Patent number: 9042000Abstract: A flexible liquid crystal display and a flexible fluid display are provided. The flexible liquid crystal display includes a first module, a second module, at least two supporting structures and a liquid crystal layer. The second module is disposed correspondingly to the first module. The supporting structures are separately disposed between the first module and the second module and used for abutting the first module and the second module, so that a space between the first module and the second module is divided into a flexible area and two non-flexible areas. The flexible area is located between the two non-flexible areas. The liquid crystal layer is disposed in the flexible area and the two non-flexible areas.Type: GrantFiled: May 27, 2014Date of Patent: May 26, 2015Assignee: WISTRON CORPORATIONInventors: Tarng-Shiang Hu, Yi-Kai Wang, Yu-Jung Peng, Tsung-Hua Yang, Chih-Hao Chang
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Publication number: 20150004546Abstract: A method for fabricating a photo spacer and an array substrate having the photo spacer are provided. At least one exposure process, a developing process, and a baking process are performed to a photo-sensitive material layer formed a substrate to fabricate a photo spacer, wherein the at least one exposure process includes a back side exposure process. The substrate has a light transmitting region and a light shielding region so that the photo-sensitive material layer is defined into a first block and a second block after the back side exposure process. The developing process is performed to at least remove the second block. A front side exposure process is performed to the first block. The baking process is performed to cure the first block of the photo-sensitive material layer to form a photo spacer.Type: ApplicationFiled: September 16, 2014Publication date: January 1, 2015Inventors: Yi-Kai Wang, Tarng-Shiang Hu, Tsung-Hua Yang, Yu-Jung Peng, Chih-Hao Chang
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Publication number: 20140374761Abstract: A structure, a method for manufacturing a structure, and an illuminating structure of a thin film transistor are disclosed. In the method, a substrate is provided, and a patterned first conductor layer is formed on the substrate. A patterned semiconductor layer, a patterned insulation layer, and a patterned second conductor layer are formed after forming the patterned first conductor layer, in which the patterned insulation layer contacts with the patterned second conductor layer. A first permeation barrier layer which covers the patterned second conductor layer and the patterned insulation layer is formed.Type: ApplicationFiled: April 7, 2014Publication date: December 25, 2014Applicant: WISTRON CORP.Inventors: Yi-Kai WANG, Tarng-Shiang HU, Chi-Jen KAO
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Publication number: 20140346471Abstract: A method for packaging an organic photoelectric device is disclosed. In the method, an inorganic substrate is provided, an organic layer is coated or pasted on the inorganic substrate to form a hybrid substrate. An organic photoelectric device is formed on the hybrid substrate, and the organic layer and the organic photoelectric device are patterned to define a package region. A permeation barrier layer is disposed on the package region to cover the organic photoelectric device.Type: ApplicationFiled: February 25, 2014Publication date: November 27, 2014Applicant: Wistron Corp.Inventors: Chi-Jen KAO, Tarng-Shiang HU, Yi-Kai WANG, Ko-Yu CHIANG