Abstract: A light-emitting diode (LED) display device, includes: a plurality of displaying basic-units, each of the displaying basic-units having a plurality of sub-pixel regions, on which a plurality of red LED units, a plurality of green LED units, a plurality of blue LED units, and a plurality of white LED units are selectively provided; and a control unit, performing an image reconstruction process for an input image, thereby making each of the displaying basic-units display color, color grayscale, or black-and-white grayscale; wherein in each of the displaying basic-units, the quantity of green LED units is more than or equal to the quantity of white LED units, and the quantity of green LED units is more than the quantity of blue LED units or red LED units.

Abstract: A wafer defect detection device adapted for detecting a sample to be tested including two detection features is provided. The wafer defect detection device includes a stage adapted for holding the sample to be tested, a light source module configured to output a detection light to the sample to be tested and reflect a reflected light, and an image sensor disposed on a path of the reflected light and adapted for receiving an image frame. The detection light includes spectra of a first light and a second light, which have two different peak wavelengths. The spectrum of the first light is adapted for detecting one of the detection features. The spectrum of the second light is adapted for detecting other one of the detection features. Luminous intensities of the first light and the second light are independently controlled. The reflected light includes the image frame, which displays the detection features.

Abstract: A semiconductor package includes a redistribution structure and an encapsulated die electrically connected to the redistribution structure. The redistribution structure includes a first conductive pad, first and second conductive vias, and a first dielectric layer. The first conductive pad includes opposing first and second sides, the first conductive via lands on the first side of the first conductive pad and is tapered in a direction from the first side toward the second side. The second conductive via lands on the second side of the first conductive pad and is tapered in a direction from the second side toward the first side. The first dielectric layer laterally covers the first conductive pad and the first conductive via, and the first dielectric layer includes opposing first and second surfaces. The encapsulated die is disposed below the first side of the first conductive via.

Abstract: A wafer defect inspection apparatus including a carrier base, a light source module, a beam splitter, filters and image sensors are provided. The carrier base carries a sample to be tested. The light source module includes an illuminating unit and a pellicle mirror. The illuminating unit emits an inspection light ray. A reflective surface is capable of reflecting the inspection light ray to the sample to be tested, so that a reflective light ray formed by reflecting the inspection light ray reflected by the sample to be tested passes through the pellicle mirror and is then split into splitting light rays by the beam splitter. The filters are configured to be passed through by different bands corresponding to the splitting light rays. The image sensors receive the splitting light rays to generate imaging frames. Two corresponding positions in any two of the imaging frames have two different contrast ratios.

Abstract: A force-sensitive key module and a force-sensitive switch structure are provided. The force-sensitive switch structure includes a first protective layer, a second protective layer, a first conductive layer, a second conductive layer and a force-sensitive layer. The first protective layer receives a pressing force. The second conductive layer is aligned with the first conductive layer. The force-sensitive layer is installed on the first conductive layer or the second conductive layer. When the first protective layer receives the pressing force, an electric connection between the first conductive layer and the second conductive layer is established, and the force-sensitive layer generates an analog sensing signal in response to the pressing force. When a magnitude of the pressing force is changed, the analog sensing signal is correspondingly changed according to an impedance change of the force-sensitive layer.

Abstract: A micro light-emitting diode display device and a micro light-emitting diode structure. The micro light-emitting diode display device includes a circuit substrate and a plurality of display pixels, the display pixels are arranged on the circuit substrate and are electrically connected with the circuit substrate individually. Each display pixel includes a plurality of series-connection structures, and the light wavelengths of the series-connection structures are different. Each series-connection structure includes at least two micro light-emitting elements, and the light wavelengths of the at least two micro light-emitting elements are within a wavelength range of one color light. The circuit substrate provides a driving voltage to drive the series-connection structures of each display pixel.

Abstract: Disclosed are an ultrasonic treatment tip and an ultrasonic therapeutic apparatus. The ultrasonic treatment tip is configured to connect the ultrasonic therapeutic apparatus, the ultrasonic treatment tip includes: an outer shell, a cover body, an inner shell, a heat dissipation structure, a sound-permeable membrane and a transducer, the outer shell is provided with a first port; the cover body covers the first port, the cover body and the outer shell are configured to limit an installation cavity, the cover body is provided with an avoidance hole connected to the installation cavity, and the cover body is connected to the ultrasonic treatment handle; the inner shell is provided at the installation cavity, the inner shell is provided with a receiving cavity for receiving an ultrasonic transmission medium, and the receiving cavity is provided with a second port.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a device region and a seal ring region surrounding the device region. The semiconductor device structure includes a seal ring structure over the seal ring region. The seal ring structure surrounds the device region. The semiconductor device structure includes a bonding film over the seal ring structure and the substrate. The semiconductor device structure includes a bonding pad embedded in the bonding film. The bonding pad overlaps the seal ring structure along an axis perpendicular to a first top surface of the substrate, and a second top surface of the bonding pad is substantially level with a third top surface of the bonding film.

Abstract: A hard disk failure prediction method, a hard disk failure prediction system, a device and a medium are provided. The method includes: acquiring SMART attribute values of a hard disk; performing data standardization processing on the SMART attribute values, and filtering the processed SMART attribute values to obtain filtered SMART attribute values; constructing a hard disk failure prediction key database according to the filtered SMART attribute values, a warning value and a rating value corresponding to the filtered SMART attribute values; optimizing a decision tree-based hard disk failure prediction model by using the hard disk failure prediction key database to obtain an optimized decision tree-based hard disk failure prediction model; and acquiring SMART attribute values of a target hard disk hard disk, and predicting a health of the target hard disk to obtain a prediction result. The present disclosure improves the accuracy of failure prediction.

Abstract: The invention discloses a method for rendering on the basis of hemispherical orthogonal function, the method comprising the following steps: selecting rendering fragments and establishing a local coordinate system; acquiring a bidirectional reflectance distribution function of a material; if global illumination is an orthogonal function, determining a rotation matrix of an orthogonal function coefficient according to the rotation angles of the global coordinate system and the local coordinate system, and calculating a local orthogonal function illumination coefficient; converting the local orthogonal function illumination coefficient into a hemispherical orthogonal function illumination coefficient; sampling to obtain the spatial distribution of a bidirectional reflection distribution function of a rendered material; obtaining a hemispherical orthogonal function of the bidirectional reflection distribution function of the rendered material; and using the dot product of a hemispherical orthogonal function coef

Abstract: A method for forming a high electron mobility transistor is disclosed. A mesa structure having a channel layer and a barrier layer is formed on a substrate. The mesa structure has two first edges extending along a first direction and two second edges extending along a second direction. A passivation layer is formed on the substrate and the mesa structure. A first opening and a plurality of second openings connected to a bottom surface of the first opening are formed and through the passivation layer, the barrier layer and a portion of the channel layer. In a top view, the first opening exposes the two first edges of the mesa structure without exposing the two second edges of the mesa structure. A metal layer is formed in the first opening and the second openings thereby forming a contact structure.

Abstract: A radiographic inspection device and a method of inspecting an object are provided. The radiographic inspection device includes: a support frame, where an inspection space applicable to inspect an object is formed within the support frame, and the inspection space has an entrance and an exit which are connecting to an outside; a transfer channel applicable to carry the object to move through the inspection space; a first shielding curtain and a second shielding curtain respectively mounted at the entrance and the exit; and a driving mechanism mounted on the support frame and configured to drive at least one of the first shielding curtain and the second shielding curtain to move, in response to the object getting close to or moving away from at least one of the entrance and the exit, so as to open or close the at least one of the entrance or the exit.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: The present disclosure relates to a method for controlling a movable platform. The method may include obtaining a target object selection operation input by a user on an interaction interface, the interaction interface displaying a three-dimensional model of an operation area, the target object selection operation configured to determine a position of a target object in the operation area; determining a target orientation of the movable platform when the target object is operated based on an orientation of the three-dimensional model displayed on the interaction interface when the target object selection operation is obtained; and determining a target position of the movable platform when the movable platform performs operation on the target object based on the position of the target object, the target orientation, and an operation distance of the movable platform.

Abstract: The present invention is related to a novel positive electrode active material for lithium-ion battery. The positive electrode active material is expressed by the following formula: Li1.2NixMn0.8-x-yZnyO2, wherein x and y satisfy 0<x?0.8 and 0<y?0.1. In addition, the present invention provides a method of manufacturing the positive electrode active material. The present invention further provides a lithium-ion battery which uses said positive electrode active material.

Abstract: A carrier structure is provided, in which at least one positioning area is defined on a chip-placement area of a package substrate, and at least one alignment portion is disposed on the positioning area. Therefore, the precision of manufacturing the alignment portion is improved by disposing the positioning area on the chip-placement area, such that the carrier structure can provide a better alignment mechanism for the chip placement operation.

Abstract: A localization device and a localization method for a vehicle are provided. The localization device includes an inertia measurer, an encoder, an image capturing device, and a processor. The processor obtains an encoded data by the encoder to generate a first odometer data, obtains an inertial data by the inertia measurer to generate a heading angle estimation data, and obtains an environmental image data by the image capturing device to generate a second odometer data. In a first fusion stage, the processor fuses the heading angle estimation data and the first odometer data to generate first fusion data. In a second fusion stage, the processor fuses the first fusion data, the heading angle estimation data and the second odometer data to generate pose estimation data corresponding to the localization device.

Abstract: The present invention provides a control method of a processor, wherein the control method comprises the steps of: transmitting image data of a first frame to an integrated circuit, wherein the first frame corresponds to a first frame rate; determining a second frame rate of a second frame next to the first frame; determining if a difference between the second frame rate and the first frame rate belongs to a large scale frame rate adjustment or a small scale frame rate adjustment; if the difference between the second frame rate and the first frame rate belongs to the large scale frame rate adjustment, using a first mode to transmit image data of the second frame; and if the difference between the second frame rate and the first frame rate belongs to the small scale frame rate adjustment, using a second mode to transmit image data of the second frame.

Abstract: The present disclosure provides a method for two-phase partitioning production of a medium-chain fatty acid (MCFA) by dry anaerobic digestion. In the present disclosure, due to a slow heat transfer of the dry anaerobic digestion, a same dry anaerobic digestion device is naturally divided into two phases, and the MCFA is synthesized while producing electron acceptors and electron donors in the same dry anaerobic digestion device. Meanwhile, the dry anaerobic digestion device is provided with a high-efficiency decomposing microbial inoculant on an upper part and inoculated with sludge having a carbon chain extension function on a lower part. In this way, a material residence time is regulated, and cycles of hydrolytic acidification and carbon chain extension are shortened, thereby achieving the high-value conversion of agricultural waste while increasing a conversion rate of organic acids in the dry anaerobic digestion.

Abstract: Disclosed are a multi-pole radio frequency (RF) device, a method for controlling multi-pole RF device, and an RF therapeutic apparatus. The multi-pole RF device includes an RF power supply, a return electrode, a therapeutic electrode, a controller, a first switch switching circuit, and/or a second switch switching circuit. The controller controls the third input terminal and the fourth input terminal of the second switch switching circuit to be switchably connected to the third output terminal and the fourth output terminal. In the unipolar mode, the controller controls the first output terminal and the second output terminal to be electrically connected to the therapeutic electrode and the return electrode respectively. In the bipolar mode, the controller controls the first output terminal and the second output terminal to be connected to at least one of the plurality of electrode slices respectively.