Patents by Inventor Yi Liang

Yi Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240142237
    Abstract: A localization device and a localization method for a vehicle are provided. The localization device includes an inertia measurer, an encoder, an image capturing device, and a processor. The processor obtains an encoded data by the encoder to generate a first odometer data, obtains an inertial data by the inertia measurer to generate a heading angle estimation data, and obtains an environmental image data by the image capturing device to generate a second odometer data. In a first fusion stage, the processor fuses the heading angle estimation data and the first odometer data to generate first fusion data. In a second fusion stage, the processor fuses the first fusion data, the heading angle estimation data and the second odometer data to generate pose estimation data corresponding to the localization device.
    Type: Application
    Filed: January 5, 2023
    Publication date: May 2, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Jhong Chen, Pei-Jung Liang, Ren-Yi Huang
  • Publication number: 20240145691
    Abstract: The present invention is related to a novel positive electrode active material for lithium-ion battery. The positive electrode active material is expressed by the following formula: Li1.2NixMn0.8-x-yZnyO2, wherein x and y satisfy 0<x?0.8 and 0<y?0.1. In addition, the present invention provides a method of manufacturing the positive electrode active material. The present invention further provides a lithium-ion battery which uses said positive electrode active material.
    Type: Application
    Filed: March 14, 2023
    Publication date: May 2, 2024
    Inventors: CHUAN-PU LIU, YIN-WEI CHENG, SHIH-AN WANG, BO-LIANG PENG, CHUN-HUNG CHEN, JUN-HAN HUANG, YI-CHANG LI
  • Publication number: 20240145398
    Abstract: A carrier structure is provided, in which at least one positioning area is defined on a chip-placement area of a package substrate, and at least one alignment portion is disposed on the positioning area. Therefore, the precision of manufacturing the alignment portion is improved by disposing the positioning area on the chip-placement area, such that the carrier structure can provide a better alignment mechanism for the chip placement operation.
    Type: Application
    Filed: December 8, 2022
    Publication date: May 2, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Cheng-Liang HSU, Wan-Rou CHEN, Hsin-Yin CHANG, Tsung-Li LIN, Hsiu-Jung LI, Chiu-Lien LI, Fu-Quan XU, Yi-Wen LIU, Chih-Chieh SUN
  • Patent number: 11974071
    Abstract: The present invention provides a control method of a processor, wherein the control method comprises the steps of: transmitting image data of a first frame to an integrated circuit, wherein the first frame corresponds to a first frame rate; determining a second frame rate of a second frame next to the first frame; determining if a difference between the second frame rate and the first frame rate belongs to a large scale frame rate adjustment or a small scale frame rate adjustment; if the difference between the second frame rate and the first frame rate belongs to the large scale frame rate adjustment, using a first mode to transmit image data of the second frame; and if the difference between the second frame rate and the first frame rate belongs to the small scale frame rate adjustment, using a second mode to transmit image data of the second frame.
    Type: Grant
    Filed: August 21, 2022
    Date of Patent: April 30, 2024
    Assignee: MEDIATEK INC.
    Inventors: Kang-Yi Fan, Chin-Wen Liang, Chang-Chu Liu, Sheng-Hsiang Chang, You-Min Yeh
  • Publication number: 20240133918
    Abstract: In a method for obtaining the equivalent oxide thickness of a dielectric layer, a first semiconductor capacitor including a first silicon dioxide layer and a second semiconductor capacitor including a second silicon dioxide layer are provided and a modulation voltage is applied to the semiconductor capacitors to measure a first scanning capacitance microscopic signal and a second scanning capacitance microscopic signal. According to the equivalent oxide thicknesses of the silicon dioxide layers and the scanning capacitance microscopic signals, an impedance ratio is calculated. The modulation voltage is applied to a third semiconductor capacitor including a dielectric layer to measure a third scanning capacitance microscopic signal. Finally, the equivalent oxide thickness of the dielectric layer is obtained according to the equivalent oxide thickness of the first silicon dioxide layer, the first scanning capacitance microscopic signal, third scanning capacitance microscopic signal, and the impedance ratio.
    Type: Application
    Filed: April 12, 2023
    Publication date: April 25, 2024
    Inventors: MAO-NAN CHANG, CHI-LUN LIU, HSUEH-LIANG CHOU, YI-SHAN WU, CHIAO-JUNG LIN, YU-HSUN HSUEH
  • Publication number: 20240131350
    Abstract: Disclosed are a multi-pole radio frequency (RF) device, a method for controlling multi-pole RF device, and an RF therapeutic apparatus. The multi-pole RF device includes an RF power supply, a return electrode, a therapeutic electrode, a controller, a first switch switching circuit, and/or a second switch switching circuit. The controller controls the third input terminal and the fourth input terminal of the second switch switching circuit to be switchably connected to the third output terminal and the fourth output terminal. In the unipolar mode, the controller controls the first output terminal and the second output terminal to be electrically connected to the therapeutic electrode and the return electrode respectively. In the bipolar mode, the controller controls the first output terminal and the second output terminal to be connected to at least one of the plurality of electrode slices respectively.
    Type: Application
    Filed: December 29, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN PENINSULA MEDICAL GROUP
    Inventors: Yanan LI, Yongsheng LIANG, Xiaobing LEI, Yi DING
  • Publication number: 20240136463
    Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ?13.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 25, 2024
    Applicant: EPISTAR CORPORATION
    Inventors: Yi-Chieh LIN, Shiuan-Leh LIN, Yung-Fu CHANG, Shih-Chang LEE, Chia-Liang HSU, Yi HSIAO, Wen-Luh LIAO, Hong-Chi SHIH, Mei-Chun LIU
  • Publication number: 20240132924
    Abstract: The present disclosure provides a method for two-phase partitioning production of a medium-chain fatty acid (MCFA) by dry anaerobic digestion. In the present disclosure, due to a slow heat transfer of the dry anaerobic digestion, a same dry anaerobic digestion device is naturally divided into two phases, and the MCFA is synthesized while producing electron acceptors and electron donors in the same dry anaerobic digestion device. Meanwhile, the dry anaerobic digestion device is provided with a high-efficiency decomposing microbial inoculant on an upper part and inoculated with sludge having a carbon chain extension function on a lower part. In this way, a material residence time is regulated, and cycles of hydrolytic acidification and carbon chain extension are shortened, thereby achieving the high-value conversion of agricultural waste while increasing a conversion rate of organic acids in the dry anaerobic digestion.
    Type: Application
    Filed: October 19, 2023
    Publication date: April 25, 2024
    Applicant: Institute of Environment and Sustainable Development in Agriculture, CAAS
    Inventors: Lixin ZHAO, Yi LIANG, Jiadong YU, Zonglu YAO, Juan LUO
  • Publication number: 20240136299
    Abstract: A package includes an interposer structure free of any active devices. The interposer structure includes an interconnect device; a dielectric film surrounding the interconnect device; and first metallization pattern bonded to the interconnect device. The package further includes a first device die bonded to an opposing side of the first metallization pattern as the interconnect device and a second device die bonded to a same side of the first metallization pattern as the first device die. The interconnect device electrically connects the first device die to the second device die.
    Type: Application
    Filed: January 2, 2024
    Publication date: April 25, 2024
    Inventors: Wei-Yu Chen, Chun-Chih Chuang, Kuan-Lin Ho, Yu-Min Liang, Jiun Yi Wu
  • Publication number: 20240127186
    Abstract: An interaction method and apparatus and an electronic device. The method comprises: displaying a first application interface, wherein the first application interface comprises an interface of a first application; and creating a second application account in the first application interface, wherein the second application account is used for logging in a second application. Therefore, a new interaction mode is provided.
    Type: Application
    Filed: December 21, 2023
    Publication date: April 18, 2024
    Inventors: Xiaoping ZHANG, Yunsheng HAO, Jialu WANG, Yi WEI, Pengzhan XU, Guichao REN, Boyu ZHOU, Zitian GUO, Yuxiang LI, Jieli LIANG, Xiaofei GAO, Daozhi LIN, Hong ZOU, Wentao LIU, Zheng CHEN, Shanshan LING
  • Patent number: 11959958
    Abstract: A method includes providing a detector disposed above a semiconductor structure; identifying a portion of the semiconductor structure at a temperature substantially greater than a predetermined threshold by the detector; rotating the stage; and deriving a position of the portion of the semiconductor structure based upon the rotation of the stage.
    Type: Grant
    Filed: February 17, 2021
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yi Min Liu, Chien-Yi Chen, Yian-Liang Kuo
  • Publication number: 20240115616
    Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 11, 2024
    Inventors: Po-Cheng Lin, Pi-Chun Huang, Zih-Han Hong, Ming-Hsi Chuang, Yi-Chun Lin, Chia-Hsin Lee, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
  • Patent number: 11955378
    Abstract: A bonding method of package components and a bonding apparatus are provided. The method includes: providing at least one first package component and a second package component, wherein the at least one first package component has first electrical connectors and a first dielectric layer at a bonding surface of the at least one first package component, and the second package component has second electrical connectors and a second dielectric layer at a bonding surface of the second package component; bringing the at least one first package component and the second package component in contact, such that the first electrical connectors approximate or contact the second electrical connectors; and selectively heating the first electrical connectors and the second electrical connectors by electromagnetic induction, in order to bond the first electrical connectors with the second electrical connectors.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang
  • Publication number: 20240113731
    Abstract: A ghost key preventing circuit includes plural driving lines, plural sensing lines, plural key switches, plural bias resistors and a controller. The plural driving lines and the plural sensing lines are collaboratively formed as a matrix circuit. The plural key switches are included in the matrix circuit. The plural bias resistors are connected with the corresponding sensing lines. When the key switch of a specified switch circuit is turned on, a divided voltage is generated and outputted from the specified switch circuit. The controller judges whether the key switch of the specified switch circuit is normally turned on or the key switch is a ghost key according to the divided voltage.
    Type: Application
    Filed: January 5, 2023
    Publication date: April 4, 2024
    Inventors: Chih-Chen Chang, Yi-Liang Chen, Yu-Ting Lo
  • Patent number: 11947217
    Abstract: A backlight module including a light guide plate, a light source, a diffuse reflector and a light-splitting film is provided. The light guide plate has a light incident surface, and a light-emitting surface and a bottom surface which are respectively connected to the light incident surface and opposite to each other. The light source is disposed on one side of the light incident surface of the light guide plate. The diffuse reflector is disposed on one side of the bottom surface of the light guide plate. The light-splitting film is disposed between the light guide plate and the diffuse reflector. The light-splitting film has a substrate and a plurality of first optical microstructures disposed on one side of the substrate. An extending direction of the first optical microstructures intersects with the light incident surface of the light guide plate. A display apparatus using the backlight module is also provided.
    Type: Grant
    Filed: October 23, 2022
    Date of Patent: April 2, 2024
    Assignee: Coretronic Corporation
    Inventors: Tzeng-Ke Shiau, Yi-Cheng Lin, Chia-Liang Kang
  • Publication number: 20240105389
    Abstract: A wound capacitor package structure and a method of manufacturing the same are provided. The wound capacitor package structure includes a wound assembly, a conductive assembly, a package casing and a protruding sealing element. The conductive assembly includes a first conductive pin and a second conductive pin. The package casing is configured to receive the wound assembly. The protruding sealing element is arranged inside and cooperates with the package casing. The package casing is configured to receive the wound assembly. The protruding sealing element is disposed inside the package casing and cooperating with the package casing. The package casing has a surrounding concave position-limiting portion recessed inward, and a surrounding convex end portion protruding from the surrounding concave position-limiting portion.
    Type: Application
    Filed: December 13, 2022
    Publication date: March 28, 2024
    Inventors: MING-TSUNG LIANG, HSUAN-YI LIN
  • Patent number: 11939679
    Abstract: The invention discloses a method for preparing an anticorrosive surface layer of a metal material in a marine environment by laser, which belongs to the technical field of laser processing. First, the laser cladding method is used to prepare a cladding surface layer on the surface of the metal material that is not easy to undergo chemical substitution reaction with the chlorides (NaCl, MgCl2 , CaCl2 etc.) in the seawater. Then, on the surface of the cladding surface layer, ultrafast laser processing is used to form a surface layer with a wetting angle (and water) greater than 90 degrees and with hydrophobic characteristics.
    Type: Grant
    Filed: August 12, 2020
    Date of Patent: March 26, 2024
    Assignee: GUANGDONG OCEAN UNIVERSITY
    Inventors: Wenqing Shi, Fenju An, Jiang Huang, Yuping Xie, Zhanxia Wu, Zhigang Liang, Jinming Zhan, Jinyu Huang, Yi Ba
  • Patent number: 11943373
    Abstract: An identity certificate may be issued to a blockchain node. The issuance may include issuing a first identity certificate to a first terminal and receiving a second identity certificate issuance request that is from the first terminal. A second identity certificate may be issued to the first terminal, and a third identity certificate issuance request is received from the second terminal. A third identity certificate is issued to the second terminal, so that the second terminal forwards the third identity certificate to the third terminal.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: March 26, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Mao Cai Li, Zong You Wang, Kai Ban Zhou, Chang Qing Yang, Hu Lan, Li Kong, Jin Song Zhang, Yi Fang Shi, Geng Liang Zhu, Qu Cheng Liu, Qiu Ping Chen
  • Patent number: 11940338
    Abstract: An electric-carrier power-supply device for use in an electric carrier is provided. The electric-carrier power-supply device includes a piezoresistive sensor, a battery interface, and a power-management unit (PMU). The battery interface is connected to an on-board battery and receives power from the on-board battery. The PMU controls power to a motor of the electric carrier. A piezoresistive strain gage is disposed between a contact area between the battery interface and the on-board battery, and is used to detect a pressure value of the contact area. The piezoresistive sensor receives the pressure value detected by the piezoresistive strain gage, and converts the pressure value into a resistance value. The piezoresistive sensor determines whether the resistance value is within a safe resistance value range to generate a resistance-value-determination signal. The PMU determines whether to provide power to the motor is according to the resistance-value-determination signal.
    Type: Grant
    Filed: August 25, 2022
    Date of Patent: March 26, 2024
    Assignee: WISTRON CORP.
    Inventors: Chen Yi Liang, Yung Chen Chang
  • Patent number: 11942420
    Abstract: A semiconductor device includes a first gate structure extending along a first lateral direction. The semiconductor device includes a first interconnect structure, disposed above the first gate structure, that extends along a second lateral direction perpendicular to the first lateral direction. The first interconnect structure includes a first portion and a second portion electrically isolated from each other by a first dielectric structure. The semiconductor device includes a second interconnect structure, disposed between the first gate structure and the first interconnect structure, that electrically couples the first gate structure to the first portion of the first interconnect structure. The second interconnect structure includes a recessed portion that is substantially aligned with the first gate structure and the dielectric structure along a vertical direction.
    Type: Grant
    Filed: June 8, 2022
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Guo-Huei Wu, Hui-Zhong Zhuang, Chih-Liang Chen, Cheng-Chi Chuang, Shang-Wen Chang, Yi-Hsun Chiu