Abstract: The present invention discloses a portable electronic device and a control method thereof. The portable electronic device includes a main body, a proximity sensor, a first speaker, a first microphone, an orientation sensor, and a processor. The main body includes first and the second sides opposing to each other. The proximity sensor, the first speaker, and the first microphone are disposed in the first side region. The orientation sensor is configured to determine an orientation of the main body. When the orientation represents that the second side is higher than the first side, the processor disables the proximity sensor and the first speaker, and it enables the first microphone to detect the received sound volume as the basis of a proximity sensing function.

Abstract: A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer upon a surface of a non-conductive substrate. A circuit pattern can be created within the metallic base layer based upon a circuit design. The metallic base layer comprising the circuit pattern can be physically separated from the remainder of the metallic base layer on the non-conductive substrate. The region of the non-conductive substrate surface that encloses the circuit pattern can be called the plating region. The remainder of the non-conductive substrate surface can be called the non-plating region. A first metal layer can be added upon the metallic base layer. A second metal layer can be added upon the first metal layer of the plating region. The second metal layer can be electrically conductive and restricted from forming on the first metal layer of the non-plating region.

Abstract: The present invention discloses a lateral double diffused metal oxide semiconductor (LDMOS) device and a manufacturing method thereof. The LDMOS device includes: drift region, an isolation oxide region, a first oxide region, a second oxide region, a gate, a body region, a source, and a drain. The isolation oxide region, the first oxide region, and the second oxide region have an isolation thickness, a first thickness, and a second thickness respectively, wherein the second thickness is less than the first thickness. The present invention can reduce a conduction resistance without decreasing a breakdown voltage of the LDMOS device by the first oxidation region and the second oxidation region.

Abstract: A light guiding plate includes a light guiding main body, a first light guiding unit and a second light guiding unit. The light guiding main body has a first surface, a second surface opposite to the first surface and a light inlet face connecting between the first and second surfaces. The first light guiding unit includes first and second light guiding structures disposed on the first surface. The first and second light guiding structures are parallel aligned, each second light guiding structure has a plurality of first light guiding bodies that is individually separating and connecting the immediately abreast first light structures, and the arrangement density of the plurality of first light guiding bodies decreases toward the light inlet face. The second light guiding unit includes a plurality of third light guiding structures disposed on the second surface. The third light guiding structures are parallel arranged.

Abstract: A circuit substrate includes: an insulative substrate formed with a pattern of a recess, the recess being defined by a recess-defining wall that has a bottom wall surface and a surrounding wall surface extending upwardly from the bottom wall surface; a patterned metallic layer structure including at least a patterned active metal layer disposed within the recess, formed on the bottom wall surface of the recess-defining wall, and spaced apart from the surrounding wall surface of the recess-defining wall, the patterned active metal layer containing an active metal capable of initiating electroless plating; and a primary metal layer plated on the patterned metallic layer structure.

Abstract: A portable electronic device including a display device, an acceleration sensor and a processing unit is provided. The display device has a display surface. The acceleration sensor has a plurality of detecting sensor arrays for detecting a three-dimensional acceleration, and a shift angle smaller than 90 degrees is formed between at least one of the detecting sensor arrays and the display surface. The processing unit is configured to calculate a tilt angle according to the three-dimensional acceleration.

Abstract: A package structure having at least an MEMS element is provided, including a chip having electrical connecting pads and the MEMS element; a lid disposed on the chip to cover the MEMS element and having a metal layer provided thereon; first sub-bonding wires electrically connecting to the electrical connecting pads; second sub-bonding wires electrically connecting to the metal layer; an encapsulant disposed on the chip, wherein the top ends of the first and second sub-bonding wires are exposed from the encapsulant; and metallic traces disposed on the encapsulant and electrically connecting to the first sub-bonding wires. The package structure advantageously features reduced size, relatively low costs, diverse bump locations, and an enhanced EMI shielding effect.

Abstract: A communication management method for a mobile communication device is provided and includes the steps of connecting first and second wireless communication units respectively to first and second service networks according to first and second information respectively provided by first and second Subscriber Identity Modules (SIMs); using first wireless communication unit to establish first call connection with remote communication device and afterward comparing qualities of first and second signals respectively received from first and second service networks; when quality of second signal is superior to quality of first signal, using second wireless communication unit to dial first SIM to establish second call connection with first wireless communication unit and afterward automatically establishing first multi-call connection among first and second wireless communication units and remote communication device; and then automatically establishing third call connection between second wireless communication unit

Abstract: A replacement method for scan cell of an integrated circuit (IC) is provided. A gate-level netlist of the IC is obtained. A place-and-route process is performed on the gate-level netlist to obtain a first netlist. A clock tree synthesis process is performed on the first netlist to obtain a second netlist. Static timing analysis is performed to analyze a plurality of first scan cells of the second netlist in normal mode and scan mode. The first scan cell is replaced with a second scan cell according to the static timing analysis that indicates the replaced first scan cell has a specific time margin in the scan mode. A first skew of the normal mode and a second skew of the scan mode are adjusted symmetrically in the first scan cell. The first skew and the second skew are adjusted asymmetrically in the second scan cell.

Abstract: A circuit-and-heat-dissipation assembly includes: a heat sink including a heat absorbing base and a heat dissipating element, the heat absorbing base having a circuit-forming surface and an element-forming surface, the heat dissipating element protruding from the element-forming surface for dissipating heat conducted from the heat absorbing base into an ambient environment; an insulator layer formed on the circuit-forming surface; and a patterned circuit formed on the insulator layer.

Abstract: A method and system for monitoring creep in an object are provided. The creep monitoring system includes a creep sensor assembly that includes at least one image pattern pair disposed on a surface of the object. The creep monitoring method includes receiving information from the creep sensor assembly regarding an observed creep and an offset associated with the object, correcting the observed creep using the information regarding the offset and outputting the corrected information relative to the creep.

Abstract: A method for fabricating a flexible electrical device is provided. The method includes providing a first substrate, providing a second substrate opposed to the first substrate, wherein one of the first and second substrates includes a polyimide polymer of Formula (I) wherein B is a polycyclic aliphatic group, A is an aromatic group containing at least one ether bond, A? is an aromatic or aliphatic group, and 1?n/m?4, directly fabricating a thin film transistor (TFT) on one of the first and second substrates which includes the polyimide polymer of Formula (I), and disposing a medium layer between the first substrate and the second substrate.

Abstract: A fixing apparatus comprises a base, a locking structure, an operating member, a first elastic member and a second elastic member. The base has an opening. The locking structure is movably disposed at the opening along a second direction. The operating member is movably disposed at the second surface along a first direction perpendicular to the second direction. The first elastic member is connected with the operating member and the base. The second elastic member is connected with the locking structure and the base. When the operating member moves along the first direction and compresses the first elastic member, the locking structure moves along the second direction by a resilient force of the second elastic member and exposes the opening. When the operating member moves along an opposite direction of the first direction, the locking structure moves along an opposite direction of the second direction and covers the opening.

Abstract: A wafer level package having a pressure sensor and a fabrication method thereof are provided. A wafer having the pressure sensor is bonded to a lid, and electrical connecting pads are formed on the wafer. After the lid is cut, wire-bonding and packaging processes are performed. Ends of bonding wires are exposed and serve as an electrical connecting path. A bottom opening is formed on a bottom surface of the wafer, in order to form a pressure sensor path.

Abstract: A communication management method for a mobile communication device is provided and includes the steps of connecting first and second wireless communication units respectively to first and second service networks according to first and second information respectively provided by first and second Subscriber Identity Modules (SIMs); using first wireless communication unit to establish first call connection with remote communication device and afterward comparing qualities of first and second signals respectively received from first and second service networks; when quality of second signal is superior to quality of first signal, using second wireless communication unit to dial first SIM to establish second call connection with first wireless communication unit and afterward automatically establishing first multi-call connection among first and second wireless communication units and remote communication device; and then automatically establishing third call connection between second wireless communication unit

Abstract: A portable electronic device including a display device, an acceleration sensor and a processing unit is provided. The display device has a display surface. The acceleration sensor has a plurality of detecting sensor arrays for detecting a three-dimensional acceleration, and a shift angle smaller than 90 degrees is formed between at least one of the detecting sensor arrays and the display surface. The processing unit is configured to calculate a tilt angle according to the three-dimensional acceleration.

Abstract: A semiconductor package is disclosed, which includes: a carrier having at least an opening; a plurality of conductive traces formed on the carrier and in the opening; a first semiconductor element disposed in the opening and electrically connected to the conductive traces; a second semiconductor element disposed on the first semiconductor element in the opening; and a redistribution layer structure formed on the carrier and the second semiconductor element for electrically connecting the conductive traces and the second semiconductor element. Since the semiconductor elements are embedded and therefore positioned in the opening of the carrier, the present invention eliminates the need to perform a molding process before forming the redistribution layer structure and prevents the semiconductor elements from displacement.

Abstract: A radio-frequency (RF) processing circuit used in a wireless communication device is disclosed. The RF processing circuit comprises an RF front-end circuit, coupled to a first antenna, a second antenna, a first wireless communication module and a second wireless communication module, for switching couplings between the first antenna and the second antenna, and the first wireless communication module and the second wireless communication module according to a control signal; and a control unit, for generating the control signal to the RF front-end circuit according to operation frequency bands and operation conditions of the first wireless communication module and the second wireless communication module.

Abstract: A wafer level package having a pressure sensor and a fabrication method thereof are provided. A wafer having the pressure sensor is bonded to a lid, and electrical connecting pads are formed on the wafer. After the lid is cut, wire-bonding and packaging processes are performed. Ends of bonding wires are exposed and serve as an electrical connecting path. A bottom opening is formed on a bottom surface of the wafer, in order to form a pressure sensor path.