Abstract: A package includes a device die, a molding material molding at least a portion of the device die therein, and a through-via substantially penetrating through the molding material. The package further includes a dielectric layer contacting the through-via and the molding material, and a die attach film attached to a backside of the device die. The die attach film includes a portion extending in the dielectric layer.

Abstract: A computer program product for taking a corrective action upon determination of an existence of a corrupted text segment within a set of web pages. Determination includes: determining a language affinity indicator corresponding to text segments within the set of web pages; generating an indexing repository based on a set of text artefacts within the text segments; creating an occurrence table for the set of text artefacts; and determining compliance of the text artefacts and text segments based on the single language grouping on which the set of text segments are based.

Abstract: A computer-implemented method for taking a corrective action upon determination of an existence of a corrupted text segment within a set of web pages. Determination includes: determining a language affinity indicator corresponding to text segments within the set of web pages; generating an indexing repository based on a set of text artefacts within the text segments; creating an occurrence table for the set of text artefacts; and determining compliance of the text artefacts and text segments based on the single language grouping on which the set of text segments are based.

Abstract: A biomedical signal sensing circuit including a first and a second modulation unit, an amplifying unit, a first and a second demodulation unit is provided. The first modulation unit performs a first modulation operation to a first biomedical signal according to a first signal to generate a first modulation signal. The second modulation unit performs a second modulation operation to a second biomedical signal according to a second signal to generate a second modulation signal. The amplifying unit amplifies the first and second modulation signals, and adds the amplified first and second modulation signals to generate a third modulation signal. The first demodulation unit performs a first demodulation operation to the third modulation signal according to the first signal to generate a first sensing signal. The second demodulation unit performs a second demodulation operation to the third modulation signal according to the second signal to generate a second sensing signal.

Abstract: A computer identifies, within a portion of code, a code element associated with a label. The computer identifies an x-path corresponding to a value associated with the label. The computer transmits a request to translate the value. The computer receives a translated version of the value associated with the label. The computer utilizes the identified x-path to locate the value associated with the label within the portion of code. The computer updates the portion of code by replacing the value associated with the label with the translated version of the value.

Abstract: A computer-implemented method for taking a corrective action upon determination of an existence of a corrupted text segment within a set of web pages. Determination includes: determining a language affinity indicator corresponding to text segments within the set of web pages; generating an indexing repository based on a set of text artefacts within the text segments; creating an occurrence table for the set of text artefacts; and determining compliance of the text artefacts and text segments based on the single language grouping on which the set of text segments are based.

Abstract: A computer-implemented method and system launches an application with a preferred user interface (UI) language on a device. The method and system receive a voice command from a user to open an application on a device having a computer. The voice command is compared to a stored command language in an audio file device. The system and method initiates opening the application, in response to determining that the voice command matches the stored command language. The application is identified based on the voice command. The system and method determines a preferred language for the software application based on a language file stored on the computer readable medium and the language file being associated with the stored audio file. The method and system opens the application in response to the voice command, and sets the preferred language for a user interface (UI) of the device in response to the determined preferred language.

Abstract: A computer-implemented method includes identifying a text segment including one or more text artefacts and determining a language-specific occurrence database associated with the text segment. The computer-implemented method further includes, for each of said one or more text artefacts, determining a language-specific occurrence value based on the language-specific occurrence database and determining a language-specific compliance value based on each language-specific occurrence value. A corresponding computer program product and computer system are also disclosed.

Abstract: A method includes molding a polymer onto a package component. The step of molding includes a first molding stage performed at a first temperature, and a second molding stage performed at a second temperature different from the first temperature.

Abstract: A package includes a device die, a molding material molding at least a portion of the device die therein, and a through-via substantially penetrating through the molding material. The package further includes a dielectric layer contacting the through-via and the molding material, and a die attach film attached to a backside of the device die. The die attach film includes a portion extending in the dielectric layer.

Abstract: A package includes a device die, a molding material molding at least a portion of the device die therein, and a through-via substantially penetrating through the molding material. The package further includes a dielectric layer contacting the through-via and the molding material, and a die attach film attached to a backside of the device die. The die attach film includes a portion extending in the dielectric layer.

Abstract: A package includes a device die, a molding material molding at least a portion of the device die therein, and a through-via substantially penetrating through the molding material. The package further includes a dielectric layer contacting the through-via and the molding material, and a die attach film attached to a backside of the device die. The die attach film includes a portion extending in the dielectric layer.

Abstract: A wafer level package includes a semiconductor die bonded on a supporting wafer. The semiconductor die has at least a step recess at its substrate. An underfill layer is formed between the semiconductor die and the supporting wafer. Moreover, the height of the underfill layer is limited by the step recess. During a fabrication process of the wafer level package, the step recess helps to reduce the stress on the wafer level package.

Abstract: A bad pixel correction method for an image is provided. The bad pixel correction method includes the steps of determining whether each of pixels of a predetermined block in the image is a bad pixel sequentially; when a current pixel of the block is determined to be bad and a temperature value is higher than a threshold, re-determining that at least one previously determined pixel in the predetermined block to be bad; and correcting the current pixel and the previously determined pixel, wherein the previously determined pixel is adjacent to the current pixel.

Abstract: A biomedical signal sensing circuit including a first and a second modulation unit, an amplifying unit, a first and a second demodulation unit is provided. The first modulation unit performs a first modulation operation to a first biomedical signal according to a first signal to generate a first modulation signal. The second modulation unit performs a second modulation operation to a second biomedical signal according to a second signal to generate a second modulation signal. The amplifying unit amplifies the first and second modulation signals, and adds the amplified first and second modulation signals to generate a third modulation signal. The first demodulation unit performs a first demodulation operation to the third modulation signal according to the first signal to generate a first sensing signal. The second demodulation unit performs a second demodulation operation to the third modulation signal according to the second signal to generate a second sensing signal.

Abstract: An image processing module is provided. A de-mosaic unit in the image processing module includes an edge direction detection unit and a multi-pixel directional interpolation unit. The edge direction detection unit is used to determine a first color row luminance difference according to a plurality of first color pixels of a pixel row of raw data, and determine a first color column luminance difference according to a plurality of first color pixels of a pixel column of raw data. The multi-pixels directional interpolation unit is used to determine pixel luminance of a third color array according to the first color column luminance difference, the first color row luminance difference, the third color pixels adjacent to a first color pixel and the third color pixels adjacent to a second color pixel.

Abstract: An image processing module is provided. A de-mosaic unit in the image processing module includes an edge direction detection unit and a multi-pixel directional interpolation unit. The edge direction detection unit is used to determine a first color row luminance difference according to a plurality of first color pixels of a pixel row of raw data, and determine a first color column luminance difference according to a plurality of first color pixels of a pixel column of raw data. The multi-pixels directional interpolation unit is used to determine pixel luminance of a third color array according to the first color column luminance difference, the first color row luminance difference, the third color pixels adjacent to a first color pixel and the third color pixels adjacent to a second color pixel.

Abstract: A bad pixel correction method for an image is provided.

Abstract: A wafer level package includes a semiconductor die bonded on a supporting wafer. The semiconductor die has at least a step recess at its substrate. An underfill layer is formed between the semiconductor die and the supporting wafer. Moreover, the height of the underfill layer is limited by the step recess. During a fabrication process of the wafer level package, the step recess helps to reduce the stress on the wafer level package.

Abstract: A signal demodulation module is disclosed. The signal demodulation module includes an injection-locked oscillator, an envelope detector and a data slicer. The injection-locked oscillator has a central oscillating frequency equal to a frequency of a digital modulation signal received, and outputs a phase-locked oscillating signal which is in phase to the digital modulation signal. When input phase of the digital modulation signal changes, output phase of the injection-locked oscillator changes synchronously. The envelope detector is used for detecting an envelope line of the phase-locked oscillating signal and outputting an envelope signal accordingly. The data slicer is used for receiving the envelop signal and outputting a first digital signal according to a reference voltage and the envelop signal.