Abstract: A protective cover for an acoustic wave device and a fabrication method thereof, for protecting an acoustic wave device having a resonant area on a surface of a substrate during a packaging operation so as to avoid molding compound flowing onto the resonant area of the acoustic wave device, wherein at least one electrical device is provided on the surface of the substrate and the at least one electrical device includes a temperature sensor. The acoustic wave device protection structure comprising: a metal covering layer, having a concave surface and a bottom rim, the bottom rim connected to the acoustic wave device and forming at least one opening between the bottom rim and the acoustic wave device, and the concave surface covering over the resonant area to form a cavity between the concave surface and the resonant area.

Abstract: An interactive education device comprises a first module and a second module. One side surface of the first module has a plurality of shaped areas. Each of the shaped areas has a first shape and arranged at a first predetermined position. The second module has a plurality of shaped blocks. Each of the shaped blocks has a second shape. The shaped blocks are respectively hollowed out a form of a written or printed character. The form of the written or printed character of each shaped block is different. The second shape is corresponding to the first shape. A tutee is assigned to put each of the shaped blocks at the corresponding shaped area based on the form of the written or printed character and the predetermined position assigned by a tutor.

Abstract: A layout method for compound semiconductor integrated circuits, comprising following steps of: forming a first metal layer within a first circuit layout area which intersects with a second circuit layout area at an intersection area on a compound semiconductor substrate; defining an adjacent crossover area including said intersection area and a peripheral adjacent area thereof; a first dielectric area located within said adjacent crossover area and intersected with at least part of said intersection area; forming a first dielectric block within said first dielectric area or forming said first dielectric block within said first dielectric area and a second dielectric block outside said first dielectric area, the thickness of said second dielectric block is no greater than and the thickness of at least part of said second dielectric block is smaller than the thickness of said first dielectric block; forming a second metal layer within said second circuit layout area.

Abstract: A protective cover for an acoustic wave device and a fabrication method thereof, for protecting an acoustic wave device having a resonant area during a packaging operation so as to avoid molding compound flowing onto the resonant area of the acoustic wave device. The fabrication method comprises: defining a sacrificial area on the acoustic wave device; forming a sacrificial layer on the sacrificial area; covering a metal covering layer on the sacrificial layer and connecting a bottom rim of the metal covering layer to the acoustic wave device and forming an opening between the bottom rim of the metal covering layer and the acoustic wave device; and removing the sacrificial layer to form a cavity between the metal covering layer and the resonant area by using a chemical solution, wherein the chemical solution enters from the opening between the metal covering layer and the acoustic wave device.

Abstract: The present invention relates to a chemical toner composition and a method for preparing the same. The chemical toner composition includes: a resin emulsion; a pigment dispersion; a wax dispersion; and a dispersible polymer coagulant, wherein the dispersible polymer coagulant is a copolymer comprising unsaturated ester monomers and amino-containing monomers. Accordingly, the present invention uses a novel dispersible polymer coagulant to prepare uniform toner particles with excellent roundness and improved flowability and to reduce moisture absorption.

Abstract: The present invention relates to a chemical toner composition and a method for preparing the same. The chemical toner composition includes: a resin emulsion; a pigment dispersion; a wax dispersion; and a dispersible polymer coagulant, wherein the dispersible polymer coagulant is a copolymer comprising unsaturated ester monomers and amino-containing monomers. Accordingly, the present invention uses a novel dispersible polymer coagulant to prepare uniform toner particles with excellent roundness and improved flowability and to reduce moisture absorption.

Abstract: The present invention relates to a chemical toner composition and a method for preparing the same. The chemical toner composition includes: a resin emulsion; a pigment dispersion; a wax dispersion; and a dispersible polymer coagulant, wherein the dispersible polymer coagulant is a copolymer comprising unsaturated ester monomers and amino-containing monomers. Accordingly, the present invention uses a novel dispersible polymer coagulant to prepare uniform toner particles with excellent roundness and improved flowability and to reduce moisture absorption.

Abstract: A method for regulating air mattress pressure includes setting an initial first pressure; maintaining the first pressure stable with respect to an air mattress; setting a subsequent second pressure, wherein the second pressure is smaller than the first pressure; maintaining the second pressure stable with respect to the air mattress; computing a time interval for transferring from the first pressure to a stable condition of the second pressure; determining load and optimum pressure level of the air mattress through a database on the basis of the time interval; and charging air into the air mattress to the optimum pressure.

Abstract: A window-type BGA semiconductor package is revealed, primarily comprising a substrate with a wire-bonding slot, a chip disposed on a top surface of the substrate, and a plurality of bonding wires passing through the wire-bonding slot. A plurality of plating line stubs are formed on a bottom surface of the substrate, connect the bonding fingers on the substrate and extend to the wire-bonding slot. The bonding wires electrically connect the bonding pads of the chip to the corresponding bonding fingers of the substrate. The plating line stubs are compliant to the wire-bonding paths of the bonding wires correspondingly connected at the bonding fingers, such as parallel to the overlapped arrangement, to avoid electrical short between the plating line stubs and the bonding wires with no corresponding relationship of electrical connections.

Abstract: A low profile storage device is disclosed to include a first interface having a plurality of contact terminals movably exposed to the outside for connection to a computer, an interface controller coupled to the first interface to execute signal conversion and protocol operation of the first interface, a memory for storing data temporarily, a memory controller respectively coupled to the interface controller and the memory to transfer data from the memory to the computer and to receive data from the computer and store the data in the memory.

Abstract: The present invention relates to a chemical toner composition and a method for preparing the same. The chemical toner composition includes: a resin emulsion; a pigment dispersion; a wax dispersion; and a dispersible polymer coagulant, wherein the dispersible polymer coagulant is a copolymer comprising unsaturated ester monomers and amino-containing monomers. Accordingly, the present invention uses a novel dispersible polymer coagulant to prepare uniform toner particles with excellent roundness and improved flowability and to reduce moisture absorption.

Abstract: A business-card sized storage device which is a thin metal housing built-in with a flash memory module.

Abstract: A window-type BGA semiconductor package is revealed, primarily comprising a substrate with a wire-bonding slot, a chip disposed on a top surface of the substrate, and a plurality of bonding wires passing through the wire-bonding slot. A plurality of plating line stubs are formed on a bottom surface of the substrate, connect the bonding fingers on the substrate and extend to the wire-bonding slot. The bonding wires electrically connect the bonding pads of the chip to the corresponding bonding fingers of the substrate. The plating line stubs are compliant to the wire-bonding paths of the bonding wires correspondingly connected at the bonding fingers, such as parallel to the overlapped arrangement, to avoid electrical short between the plating line stubs and the bonding wires with no corresponding relationship of electrical connections.

Abstract: A semiconductor package is revealed with a special designed substrate. The substrate has a plurality of fingers, a dummy metal pattern, and at least a peripheral slot penetrating through the substrate. The dummy metal pattern is aligned to two opposing sides of the peripheral slot and is electrically isolated from the fingers. A chip is disposed on the substrate and is electrically connected to the fingers. An encapsulant is completely filled the peripheral slot. The peripheral slot can enhance the mold flow and eliminate the mold flash. The shape of the dummy metal pattern aligned to the peripheral slot is used to offer stiffening edges to prevent the substrate from warpage and from breakage at peripheries, to enhance the thermal stress resistance due to thermal cycles, and to avoid damages to the chip.

Abstract: A chip package and a lead frame used in the chip package are disclosed. The lead frame includes a plurality of first side leads and a plurality of second side leads where the first side leads have a plurality of first bent leads extending from a first edge and the second side leads have a plurality of second bent leads extending from a second edge. The inner ends of the first bent leads and the inner ends of the second bent leads are facing to a third edge between the first and second edges and are connected to the lead frame. Therefore, the lengths of the first side leads are equal and symmetrical to the ones of the second side leads without any suspended long leads for chip attachment. The chip package is most suitable for packaging chips with bonding pads on one single side.

Abstract: A business card sized storage device comprises: a housing having an upper and lower covers, from whose edges extend downward to form a sidewall, respectively, and in turn establish an internal space; a circuit board with circuit layout with one of its surface disposed with a control module and a plurality of flash memories; a frame formed by joining a plurality of side trims which encompass the circuit board therein and whose tops and bottoms are applied with glue to join the upper and lower covers such that the two covers may be joined face-to-face; and a connector whose one end is disposed with a plug and the other end is connected with a wire which is passed through the housing and connected with the circuit board to establish an electrical connection.

Abstract: A low profile card reading device is disclosed to include a first interface having a plurality of contact terminals movably exposed to the outside for connection to a computer, an interface controller coupled to the first interface to execute signal conversion and protocol operation of the first interface, a memory card slot for the insertion of a memory card, a card reading device controller respectively coupled to the interface controller and the memory card slot to transfer data from the memory card in the memory card slot to the computer and to store data from the computer to the memory card in the memory card slot.

Abstract: A low profile storage device is disclosed to include a first interface having a plurality of contact terminals movably exposed to the outside for connection to a computer, an interface controller coupled to the first interface to execute signal conversion and protocol operation of the first interface, a memory for storing data temporarily, a memory controller respectively coupled to the interface controller and the memory to transfer data from the memory to the computer and to receive data from the computer and store the data in the memory.