Abstract: A power monitor comprises a current/voltage transformer, an electric energy meter connected in series with the current/voltage transformer, and at least one current regulating element connected between the current/voltage transformer and the electric energy meter. The current/voltage transformer connects the electric energy meter to a load to monitor the electric energy consumed by the load by the electric energy meter. When a current flowing from the current/voltage transformer to the electric energy meter is greater than or equal to a threshold current, the at least one current regulating element reduces the current to less than a rated maximum current of the electric energy meter.

Abstract: A vision inspection system includes a sorting platform having an upper surface supporting parts for inspection. An inspection station is positioned adjacent the sorting platform including an imaging device to image the parts in a field of view. A vision inspection controller receives images from the imaging device. The vision inspection controller includes an image histogram tool to pre-process the images to improve contrast of the images by redistributing lightness values of the images based on adaptive histogram equalization processing to generate enhanced images. The vision inspection controller processes the enhanced images based on an image analysis model to determine inspection results for each of the parts. The vision inspection controller has an artificial intelligence learning module operated to customize and configure the image analysis model based on the enhanced images.

Abstract: A control device used for holding an electronic device having a display is provided. The control device includes two control handles, a connection structure, a support structure, a moving mechanism, and a movable module. The two control handles are connected to each other through the connection structure. The support structure is connected to the connection structure. The moving mechanism is connected to the support structure. The movable module includes a carrier platform and two holding assemblies. The carrier platform is connected to the support structure through the moving mechanism. The two holding assemblies are connected to the carrier platform, and the two holding assemblies are configured to cooperatively hold the electronic device that is disposed on the carrier platform. The carrier platform can be operated to move forward or backward relative to the two control handles.

Abstract: A semiconductor structure, comprising a redistribution layer (RDL) including a dielectric layer and a conductive trace within the dielectric layer; a first conductive member disposed over the RDL and electrically connected with the conductive trace; a second conductive member disposed over the RDL and electrically connected with the conductive trace; a first die disposed over the RDL; a second die disposed over the first die, the first conductive member and the second conductive member; and a connector disposed between the second die and the second conductive member to electrically connect the second die with the conductive trace, wherein the first conductive member is electrically isolated from the second die.

Abstract: Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.

Abstract: A multifunctional table includes a table body, a carrier member, and a holder. The table body includes a board and a support member connected to each other. The board has a table top and a groove. The carrier member is connected to the table body and includes a first slideway. The holder includes a slidable attaching portion and a holding portion connected to each other. The holding portion includes a first holding surface. The first holding surface corresponds to the groove when the slidable attaching portion is slidably attached to the first slideway in a first attached state. A holder includes a slidable attaching portion and a holding portion connected to each other. The holding portion includes a first holding surface and a second holding surface opposite to each other. The first holding surface and the second holding surface are asymmetrical about a central x axis of the holder.

Abstract: An optical element and a method for manufacturing the optical element are described. The optical element includes a transparent substrate, an optical layer, and an adhesive layer. The optical layer is located on a surface of the transparent substrate. The optical layer has a first surface and a second surface, which are opposite to each other. The first surface is set with various diffracting optical structures. A refractive index of the optical layer is equal to or greater than 1.4. The adhesive layer is sandwiched between the surface of the transparent substrate and the second surface of the optical layer.

Abstract: An image projector includes a light source capable of switchable emitting different patterns of light; and a beam shaper that shapes a light beam emitted by the light source, thereby generating a shaped pattern of light to be projected onto an object in a scene.

Abstract: An embodiment is a package including a package substrate and a package component bonded to the package substrate, the package component including an interposer, an optical die bonded to the interposer, the optical die including an optical coupler, an integrated circuit die bonded to the interposer adjacent the optical die, a lens adapter adhered to the optical die with a first optical glue, a mirror adhered to the lens adapter with a second optical glue, the mirror being aligned with the optical coupler of the optical die, and an optical fiber on the lens adapter, a first end of the optical fiber facing the mirror, the optical fiber being configured such that an optical data path extends from the first end of the optical fiber through the mirror, the second optical glue, the lens adapter, and the first optical glue to the optical coupler of the optical die.

Abstract: A product index mechanism for a product inspection system includes a material strip driving wheel and an index structure driving wheel. The material strip driving wheel engages with a material strip carrying a plurality of products to be inspected by an inspection device of the product inspection system. The driving wheel drives the material strip to move. The index structure driving wheel rotates synchronously with the material strip driving wheel and includes a plurality of product index structures thereon. As a product on the material strip is moved by the material strip driving wheel to an inspection position of the inspection device, one product index structure on the index structure driving wheel is rotated to a trigger position corresponding to a trigger of the inspection system. Activation of the trigger transmits a trigger signal to the inspection device to inspect the product.

Abstract: A method for forming an isolation structure includes following operations. A trench is formed in a semiconductor substrate. A first insulating layer covering a bottom and sidewalls of the trench is formed. A charge-trapping layer is formed on the first insulating layer. The trench is filled with a second insulating layer. The charge-trapping layer include a material different from those of the first insulating layer and the second insulating layer.

Abstract: Provided is a light source system, including: an excitation light source emitting excitation light; a wavelength conversion device having conversion and reflective regions located in different planes and time-sequentially located in optical path of the excitation light, the conversion region configured for converting at least part of the excitation light into excited light, and the reflective region configured for reflecting the excitation light; collection lens assembly configured to guide light from the conversion region to propagate along first direction to obtain first light, and guide the excitation light from the reflective region to propagate along second direction to obtain second light; first guide device configured to guide the excited light in the first light to exit along first path; and second guide device configured to guide the second light to propagate along second path. The first guide device combines the excited light and the second light to obtain source light.

Abstract: A method for generating virtual reality images and used in a light field near-eye display includes steps of: shifting a display image according to at least one change vector of a plurality of eye movement parameters, and calculating a compensation mask according to a simulated image and superimposing the compensation mask on a target image to generate a superimposed target image, wherein brightness distributions of the simulated image and the compensation mask are opposite to each other. The light field near-eye display is also provided. In this way, the light field near-eye display for generating virtual reality images and the method thereof can achieve the purpose of improving the uniformity of the image and expanding the eye box size.

Abstract: A method for fabricating a substrate having an electrical interconnection structure is provided, which includes the steps of: providing a substrate body having a plurality of conductive pads and first and second passivation layers sequentially formed on the substrate body and exposing the conductive pads; forming a seed layer on the second passivation layer and the conductive pads; forming a first metal layer on each of the conductive pads, wherein the first metal layer is embedded in the first and second passivation layers without being protruded from the second passivation layer; and forming on the first metal layer a second metal layer protruded from the second passivation layer. As such, when the seed layer on the second passivation layer is removed by etching using an etchant, the etchant will not erode the first metal layer, thereby preventing an undercut structure from being formed underneath the second metal layer.

Abstract: A robotic labeling system includes a package locating system and a package identification station identifying a package orientation. The robotic labeling system includes a label application station having first and second label printers and first and second label applicators. The label printers are both capable of printing a shipping label and a customer specific label. The first label applicator applies a first label (either the shipping label or the customer specific label) to a first side of the package while the second label applicator applies a second label (other of the shipping label or the customer specific label) to a second side of the package different than the first side. The printing and application of the labels is based on the orientation of the package.

Abstract: Semiconductor devices and methods of manufacturing are presented in which inner spacers for nanostructures are manufactured. In embodiments a dielectric material is deposited for the inner spacer and then treated. The treatment may add material and cause an expansion in volume in order to close any seams that can interfere with subsequent processes.

Abstract: This disclosure provides for devices and methods for conduction assays for combinatorial libraries. The devices comprise a multiplicity of wells and a removable cap.

Abstract: A computer-implemented method for augmenting customer support is disclosed in which a granular taxonomy is formed to classify tickets based on customer issue topic. A dashboard and user interface of performance metrics may be generated for the topics in the taxonomy. Recommendations may also be generated to aid servicing customer support issues for topics in the taxonomy. This may include generating information to aid in determining topics for generating automated responses or generating recommended answers for particular topics. In some implementations, an archive of historic tickets is used to generate training data for a machine learning model to classify tickets.

Abstract: A semiconductor device that facilitates absorption of EM radiation thereon and a method manufacturing same. The device extends in at least one lateral aspect. An EM radiation-absorbing layer comprising a discontinuous layer of at least one particle structure comprising a deposited material is deposited on a first layer surface. The particle structures facilitate absorption of EM radiation incident thereon and may comprise a seed about which the deposited material may tend to coalesce, and/or comprise the deposited material co-deposited with a co-deposited dielectric material. The EM radiation-absorbing layer may be disposed on a supporting dielectric layer and/or be covered by a covering dielectric layer. A patterning coating having an initial sticking probability against deposition of the deposited and/or a seed material, on a surface of the patterning coating is less than the initial sticking probability against deposition of the deposited and/or seed material on the second layer surface.

Abstract: Provided is a semiconductor device including a substrate, an interconnect structure, a first passivation layer, a stress buffer layer, a pad structure, and a second passivation layer. The interconnect structure is disposed on the substrate. The first passivation layer and the stress buffer layer are disposed on the interconnect structure. The pad structure includes: a lower portion embedded in the first passivation layer and the stress buffer layer, and laterally wrapped by the first passivation layer and the stress buffer layer; and an upper portion on the lower portion. The upper portion has a periphery laterally offset outward from a periphery of the lower portion, so that a bottom surface of the upper portion contacts a top surface of the stress buffer layer. The second passivation layer is disposed on the stress buffer layer and laterally wraps the upper portion of the upper portion of the pad structure.