Abstract: A temperature control system and method for devices under test and an image sensor-testing apparatus having the system are provided. The temperature control method for devices under test mainly comprises the steps of regulating the temperatures of a plurality of devices under test (DUTs) to a specific temperature in a temperature control zone; transferring the plurality of devices under test to a test plate and placing them into a plurality of test slots respectively; and measuring the temperatures of the device under test by the temperature-sensing elements in the test slots, wherein when at least one temperature-sensing element of the temperature-sensing elements detects that the device under test in the test slot corresponding to said at least one temperature-sensing element fails to meet the specific temperature, a temperature control element corresponding to the test slot regulates the temperature of the device under test.

Abstract: The present invention relates to a chip transfer device capable of floatingly positioning a chip and a method for floatingly positioning a chip. When a chip is placed in a chip socket, a control unit controls an air pressure switching valve to allow at least one vent hole to be communicated with a positive air pressure source. An air flow from the positive air pressure source blows a lower surface of the chip through the vent hole, so that the at least one chip is air-floated. Accordingly, when the chip socket is communicated with the positive air pressure source, the air flow blows the lower surface of the chip in the chip socket through the vent hole, so that the chip is air-floated in the chip socket to reduce the error displacement of the chip offset.

Abstract: A shift register (SR) includes a voltage control circuit (110) and a bias compensation circuit (120). The voltage control circuit (110) is configured to control a voltage at a first node (Output) to be a first voltage or a second voltage. The bias compensation circuit (120) is configured to: when the voltage at the first node (Output) is the first voltage, transmit a first signal received by a first signal terminal (VDD-A) to a first signal output terminal (EM1), and transmit a second signal received by a second signal terminal (VDD-B) to a second signal output terminal (EM2); and in response to the voltage at the first node (Output) being the second voltage, transmit a signal received by a first voltage terminal (LVGL1) to the first signal output terminal (EM1) and the second signal output terminal (EM2).

Abstract: A liquid cooling system, a liquid cooling method, and an electronic device-testing apparatus having the system are disclosed. When an electronic device is accommodated in a chip slot of a test socket, a cooling liquid supply device supplies a cooling liquid to the chip slot through a fluid inlet portion, and the cooling liquid at least flows over parts of the upper and lower surfaces of the electronic device and then flows out from a fluid outlet portion. The chip slot of the test socket serves as the flow space for the cooling liquid so that the cooling liquid can flow over the upper and lower surfaces of the electronic device, and the electronic device can be immersed in the continuously flowing cooling liquid. The flowing cooling liquid can also take away foreign matter, avoiding the influence of the foreign matter on the test.

Abstract: The present invention relates to a temperature control system and a temperature control method for an electronic device-testing apparatus. The temperature control system mainly includes a test socket, a temperature-controlling fluid supply device and a temperature-controlling fluid recovery device. A temperature-controlling fluid is supplied to a chip slot of the test socket by the temperature-controlling fluid supply device and drawn from the chip slot by the temperature-controlling fluid recovery device. In the present invention, the temperature-controlling fluid is forced to flow through the chip slot loaded with an electronic device so as to forcibly exchange heat with the electronic device and components in the chip slot, thereby achieving the constant temperature test. After the test is completed, the temperature-controlling fluid can be effectively recovered so that the contamination of the electronic device or the testing apparatus can be avoided.

Abstract: The present invention relates to an aging test system and an aging test method for a thermal interface material and an electronic device testing apparatus having the system, wherein a controller controls a movable carrier to move to a high temperature generating device so that the thermal interface material on the movable carrier is brought into contact with the high temperature generating device; the controller further controls a temperature sensor to detect the temperature of the thermal interface material; the controller compares an output temperature datum of the high temperature generating device with a temperature measurement datum detected by the temperature sensor. Accordingly, the thermal conductivity of the thermal interface material can be obtained for immediately determining the quality and the performance degradation of the thermal interface material, which can be used as a reference for selection or replacement of the thermal interface material.

Abstract: The present invention relates to an apparatus for testing a package-on-package semiconductor device, mainly comprising a pick-and-place device, a test socket, an upper chip holder, and a main controller. When a first package device is to be tested, the main controller controls the pick-and-place device to load the first package device into the test socket and then controls the pick-and-place device to transfer the upper chip holder and bring the upper chip holder into electrical contact with the first package device on the test socket so that a second package device in the upper chip holder is electrically connected to the first package device for testing. Accordingly, the upper chip holder is an independent component. Only when a test is executed, the pick-and-place device transfers the upper chip holder onto the test socket so that the second package device is electrically connected to the first package device.

Abstract: The present invention relates to a multistory electronic device testing apparatus, which mainly comprises a feeding and binning device, a multi-axis transfer device, a chip-testing device and a main controller. The feeding and binning device includes an upper module and a lower module. The chip-testing device includes a plurality of testing units arranged vertically. The main controller not only controls the feeding, binning and testing operations, but also controls the multi-axis transfer device to transfer an electronic device to be tested or a tested electronic device between the feeding and binning device and the chip-testing device. Accordingly, the three-dimensional arrangement of the feeding and binning module and the testing device is realized, and the accommodating capacity and the testing capacity for the electronic devices to be tested and the tested electronic devices can be increased.

Abstract: The present invention relates to a temperature control system, a temperature control method and an image sensor-testing apparatus having the system. The temperature control method mainly comprises the steps of regulating the temperatures of a plurality of devices under test (DUTs) to a specific temperature in a temperature control zone; transferring the plurality of devices under test to a test plate and placing them into a plurality of test slots respectively; and measuring the temperatures of the device under test by the temperature-sensing elements in the test slots, wherein when at least one temperature-sensing element of the temperature-sensing elements detects that the device under test in the test slot corresponding to said at least one temperature-sensing element fails to meet the specific temperature, a temperature control element corresponding to the test slot regulates the temperature of the device under test.

Abstract: The present invention relates to an electronic device testing apparatus and a testing method thereof. When the test is completed, a pressing head picks up a tested electronic device from a test socket and places the tested electronic device on an output carrier, the output carrier moves out of a test zone, and an input carrier follows immediately after the output carrier and successively moves into the test zone at the same speed; after the pressing head picks up an electronic device to be tested from the input carrier, the input carrier moves out of the test zone, and the pressing head places the electronic device to be tested in the test socket. Accordingly, in the present invention, the operation of the pressing head is simplified, and the overall test efficiency is improved.

Abstract: The present disclosure provides a shift register unit and a driving method thereof, a gate driving circuit and a driving method thereof, and a display device. The shift register unit includes: a first shift register, a second shift register and a switch control circuit, signal input terminals of the first and second shift registers are coupled to a cascade signal input terminal through the switch control circuit, the switch control circuit is configured to allow a current between the signal input terminal of the first shift register and the cascade signal input terminal or not, and allow a current between the signal input terminal of the second shift register and the cascade signal input terminal or not; the first shift register and the second shift register are configured such that at least one of them operates upon receiving a cascade signal provided by the cascade signal input terminal.

Abstract: A position calibration system and method are disclosed, in which a control unit is provided to control a positioner sensing module to scan a circular positioner provided on a positioning substrate in a first direction and a second direction so as to acquire midpoints of two scanned line segments and acquire an intersection of lines extending from the two center points in a direction perpendicular to the first and the second directions as a calibration reference point, which correspond to a centroid (a center) of the circular positioner. The calibration reference point functions as a reference point for positioning the positioning substrate with respect to the positioner sensing module and is stored in a memory unit. The calibration reference point can be used as a positioning point during installation of a machine and can also be used for calibration of a position of the machine.

Abstract: The present invention relates to a multistory electronic device testing apparatus, which mainly comprises a feeding and binning device, a multi-axis transfer device, a chip-testing device and a main controller. The feeding and binning device includes an upper module and a lower module. The chip-testing device includes a plurality of testing units arranged vertically. The main controller not only controls the feeding, binning and testing operations, but also controls the multi-axis transfer device to transfer an electronic device to be tested or a tested electronic device between the feeding and binning device and the chip-testing device. Accordingly, the three-dimensional arrangement of the feeding and binning module and the testing device is realized, and the accommodating capacity and the testing capacity for the electronic devices to be tested and the tested electronic devices can be increased.

Abstract: A shift register (SR) includes a voltage control circuit (110) and a bias compensation circuit (120). The voltage control circuit (110) is configured to control a voltage at a first node (Output) to be a first voltage or a second voltage. The bias compensation circuit (120) is configured to: when the voltage at the first node (Output) is the first voltage, transmit a first signal received by a first signal terminal (VDD-A) to a first signal output terminal (EM1), and transmit a second signal received by a second signal terminal (VDD-B) to a second signal output terminal (EM2); and in response to the voltage at the first node (Output) being the second voltage, transmit a signal received by a first voltage terminal (LVGL1) to the first signal output terminal (EM1) and the second signal output terminal (EM2).

Abstract: The present invention relates to a chip transfer device capable of floatingly positioning a chip and a method for floatingly positioning a chip. When a chip is placed in a chip socket, a control unit controls an air pressure switching valve to allow at least one vent hole to be communicated with a positive air pressure source. An air flow from the positive air pressure source blows a lower surface of the chip through the vent hole, so that the at least one chip is air-floated. Accordingly, when the chip socket is communicated with the positive air pressure source, the air flow blows the lower surface of the chip in the chip socket through the vent hole, so that the chip is air-floated in the chip socket to reduce the error displacement of the chip offset.

Abstract: The present application discloses a pixel circuit and a driving method thereof, and a display device. The circuit includes: a first initialization sub-circuit, a data writing circuit, a light emitting control circuit, a capacitor circuit, a drive transistor, a compensation circuit, a light emitting element, and a holding circuit; the first initialization sub-circuit is connected to a second terminal of the capacitor circuit and a gate of the drive transistor; the data writing circuit and the holding circuit are connected to a first terminal of the capacitor circuit; the light emitting control circuit is connected to a first electrode of the light emitting element and a second electrode of the drive transistor; a first electrode of the drive transistor is connected to the first power supply; a second electrode of the light emitting element is connected to a second power supply.

Abstract: The invention relates to a sliding test device for electronic components, which mainly comprises a base, a sliding frame and a pressing member, wherein an electronic component to be tested is placed in a chip receiving module of the base, and the sliding frame is slidably moved with respect to the base under sliding engagement between a first sliding guide and a second sliding guide so that a pressing block of the pressing member is aligned with the electronic component presses the electronic component. According to the present invention, the pressing member presses the electronic component and exerts a sufficient contact force on the electronic component, and a reaction force caused by the contact force and the elastic restoring force of probes is internally balanced in the device.

Abstract: Disclosed are a display panel and a display device. The display panel includes M rows and N columns of pixel units. The display panel is divided into R regions along a column direction, and an i-th region includes: (1+M(i?1)/R)-th row to a (Mi/R)-th row of pixel units. The display panel further includes M shift registers, M light emitting drivers, R light emitting control scan staring signal terminals, R scan start signal terminals for controlling time length and R scan start signal terminals for controlling current. An i-th row of pixel units is connected with an i-th shift register and an i-th light emitting driver, a light emitting driver connected to a first row of pixel units in the i-th region is connected with an i-th scan start signal terminal for controlling light emission.

Abstract: The present disclosure provides a shift register unit and a driving method thereof, a gate driving circuit and a driving method thereof, and a display device. The shift register unit includes: a first shift register, a second shift register and a switch control circuit, signal input terminals of the first and second shift registers are coupled to a cascade signal input terminal through the switch control circuit, the switch control circuit is configured to allow a current between the signal input terminal of the first shift register and the cascade signal input terminal or not, and allow a current between the signal input terminal of the second shift register and the cascade signal input terminal or not; the first shift register and the second shift register are configured such that at least one of them operates upon receiving a cascade signal provided by the cascade signal input terminal.

Abstract: The present invention relates to a locking mechanism for a press head, and an electronic device testing apparatus comprising the same, wherein a slider and a locking pin are disposed on the press head and a test socket substrate, respectively. When the press head is moved and engaged with the test socket substrate, an actuator drives the slider to secure the locking pin, so as to secure the press head and the test socket substrate and prevent the press head and the test socket substrate from being separated from each other. The mechanism is simple in construction, easy to install and maintain, reliable, and can be integrated into the support arms, and occupies a relatively small space. Energy is consumed only when the actuator is actuated to effect locking or unlocking. That is, only when the slider is driven and moved, energy is consumed. No extra energy is needed to persistently press down or drive the locking mechanism.