Abstract: A heat sink includes a base adapted for absorbing heat from a heat-generating component, and a plurality of parallel fins having channels defined therebetween. Each of the fins includes a main body standing on the base. A row of protruding portions and openings is alternately arranged on the main body along a direction from a lateral side to an opposite lateral side of the heat sink. The protruding portions disturb and deflect an airflow flowing in the channels from the lateral side to the opposite side of the heat sink. The openings intercommunicate the channels with each other so that the airflow can flow from one of the channels to the other of the channels.

Abstract: A heat dissipation device for dissipating heat from an electronic element includes a heat spreader (12) for contacting with the electronic element, a conducting member (30) having a lower base plate (32) thermally contacting with the heat spreader and an upper base plate (34) with a plurality of first fins (36) extending downwardly from the upper base plate towards the lower base plate and a connecting portion (33) interconnecting the lower and upper base plate. A plurality of second fins (38) is mounted on the conducting member. A plurality of heat pipes (40) thermally connects the heat spreader and the conducting member and the second fins to transfer heat from the heat spreader to the conducting member and the second fins. A fan (20) is mounted adjacent to air passages of the first and second fins for generating a forced airflow through the air passages.

Abstract: A heat dissipating device (8) for cooling a number of electronic devices. The heat dissipating device includes a heat sink (7), a fan (6) mounted to a side of the heat sink and a fan duct (5). The heat sink includes a heat spreader (70), a cover (74) and fins (72) disposed between the heat spreader and the cover. The fan duct includes a mounting plate (50), a faceplate (52) extending downwardly from and perpendicular to the mounting plate, and baffle walls (506, 508) extending downwardly from the mounting plate. The mounting plate defines locating holes (540) for permitting screws (82) to pass through the locating holes and to engage with threaded holes (740) defined in the cover. An airflow generated by the fan flows through the fins and an outlet (524) defined between the baffle walls and the heat sink.

Abstract: A heat pipe type heat dissipation device for an electronic component comprises a base, a bended heat pipe with an evaporating portion connected to the base and at least one condensing portion extending from the evaporating portion, and at least two heat sinks thermally combined together and sandwiching the condensing portion of the heat pipe therebetween. A turning angle of more than 90 degrees and less than 180 degrees, preferably ranging from 120 degrees to 150 degrees, is defined between the evaporating portion and the condensing portion of the heat pipe. The heat sinks each have a heat spreader and a plurality of fins extending from a lateral face of the heat spreader. The condensing portion of the heat pipe is sandwiched between the heat spreaders of the heat sinks.

Abstract: A radiator includes a flat base (10), a pair of heat pipes (20) and a plurality of fins (30) on the base. The base defines a pair of grooves (12) through a top portion thereof. Each heat pipe includes parallel and symmetrical first and second sections (22, 24). The first sections are soldered to the base in the grooves. Each fin defines a notch (32) at a bottom portion thereof and a pair of holes (36) at opposite sides of the notch. Flanges (35) extend perpendicularly from the notches of the fins, cooperatively defining a streamline airflow guiding surface. Collars (37) extend perpendicularly from the holes of the fins, for receiving the second sections of the heat pipes.

Abstract: A heat dissipation device includes a heat spreader (100) for contacting a heat-generating component, a heat sink (200) mounted on the heat spreader, a fan (300) mounted on the heat sink, a heat-dissipating component (400), and a heat pipe (500) thermally connecting the heat spreader, the heat sink and the heat-dissipating component together. The heat sink comprises a core (210) having an axis substantially perpendicular to the heat spreader, and a plurality of fins (220) outwardly and radially extending from the core.

Abstract: A heat dissipation device for dissipating heat from an electronic device comprises a base, a heat dissipation member provided with two heat-dissipating plate groups intercrossed with each other and defining a plurality of air passages. At least a heat pipe connects the base with the heat dissipation member to transfer heat from the base to the heat dissipation member. A first heat sink and a second heat sink respectively contact with lateral sides of the heat dissipation member. The heat pipe is partly sandwiched between the heat dissipation member and the first and second heat sinks.

Abstract: A heat dissipation device includes a heat sink, a retention module and a clip. The retention module includes a plurality of locking portions. The clip includes a main piece, an operating piece pivotally connecting with the main piece, and a buckling piece pivotally connecting with the operating piece. The main piece includes a pressing beam resting on the heat sink and a clamping portion engaging with a corresponding locking portion of the retention module. By operating the operating piece, the heat dissipation device has two positions, at a first of which a clamping portion of the buckling piece engages with a corresponding locking portion of the retention module and the pressing beam of the main piece presses the heat sink toward the retention module; at a second of the two positions, the clamping portion of the buckling piece disengages from the retention module.

Abstract: A fastener for mounting a heat sink on a chip mounted on a printed circuit board includes a cylindrical spring member and a locking member. The locking member includes a pair of action portions extending through the spring member, an elastic insertion portion formed at the bottom of the action portions and located beneath the spring member, and a pair of spaced hooking portions formed from the action portions and engaged with the spring member.

Abstract: A heat dissipating device for cooling a number of electronic devices, includes a heat sink assembly (10) and a fan (20) mounted to a side of the heat sink assembly. The heat sink assembly includes a heat spreader (12), a plurality of fins (14), and heat pipes thermally connecting the heat spreader and the fins. The fins form a plurality of channels (140) therebetween, and include a guiding fin (15). The guiding fin includes a body (150) spaced from the heat spreader and an inclined sidewall (152) bent from the body. An airflow generated by the fan has a portion flowing through the channels of the fins and another portion flowing between the body and the heat spreader for blowing a second heat generating electronic device by guiding of the sidewall of the guiding fin.

Abstract: A heat dissipating device (8) for cooling a number of electronic devices. The heat dissipating device includes a heat sink (7), a fan (6) mounted to a side of the heat sink and a fan duct (5). The heat sink includes a heat spreader (70), a cover (74) and fins (72) disposed between the heat spreader and the cover. The fan duct includes a mounting plate (50), a faceplate (52) extending downwardly from and perpendicular to the mounting plate, and baffle walls (506, 508) extending downwardly from the mounting plate. The mounting plate defines locating holes (540) for permitting screws (82) to pass through the locating holes and to engage with threaded holes (740) defined in the cover. An airflow generated by the fan flows through the fins and an outlet (524) defined between the baffle walls and the heat sink.

Abstract: A heat dissipation device includes a heat sink (10), a fan (20) disposed on top of the heat sink, a fan duct (30) arranged on the fan and a fan guard (40) sandwiched between the fan and the fan duct. The fan defines a through hole (26) at each corner and includes a plurality of positioning blocks (28) extending from each side edge thereof. The fan duct includes a plurality of connecting portions (32) extending from a circumference of the fan duct near the fan. Each connecting portion includes a post fitted in the through hole and a hook engaging with the positioning block.

Abstract: A heat pipe type heat dissipation device for an electronic component comprises a base, a heat dissipation member and two U-shaped heat pipes connecting the heat dissipation member with the base. The heat pipes each have an evaporation section connected to the base and two condensation sections perpendicularly extending from opposite ends of the evaporation section. The heat dissipation member comprises a cylindrical heat transfer wall constructed around and separated from an axis thereof perpendicular to the base, which defines a through opening. A plurality of fins extends in the through opening from an inner face of the heat transfer wall toward the axis so as to define a plurality of air channels between the fins which extend from one open end of the heat transfer wall to the other.

Abstract: A heat dissipation device includes a base (10), a first heat sink (20) disposed on the base (10), a second heat sink (30) attached on top of the first heat sink and a first heat pipe (40) connecting the base and the first heat sink and a pair of second heat pipes (50) connecting the base and the second heat sink.

Abstract: A mounting device for a heat sink (200) includes a pair of pivot members (10), two joining members (30), and two pairs of spring members (20). Each pivot member includes a clipping portion (11) for clasping the electric unit (300). The joining members pivotably connect with the pivot members. Each joining member includes a pressing portion (310) for resiliently abutting against the heat sink toward the electric unit. The spring members each includes two end catches (21), (22) secured with the joining member and a corresponding member and capable of providing resilient torsions to drive the clipping portions to engage with the electric unit when the clipping portions rotate to one position away from the electric unit.

Abstract: A heat dissipation device includes a base, a plurality of first fins, a plate, a plurality of second fins and two heat pipes. Each heat pipe includes a heat-receiving portion sandwiched between the base and the first fins, a heat-exchange portion sandwiched between the plate and the first fins, a connecting portion connecting the heat-receiving portion and the heat-exchange portion, a heat-discharging portion extending through the plate and inserted into the second fins. At least one of the heat pipes defines two different planes which intercross at the heat-exchange portion of the at least one of the heat pipes.

Abstract: A heat dissipation device includes a fin member (16), a fan (30), a fan holder (40) and at least one heat pipe (20). The fan holder includes a support plate (42) which is sandwiched between the fin member and the fan, and ears (46) perpendicularly extending from the support plate. The heat pipe includes a condensating section (26). The condensating section extends across the fin member near the support plate and is gripped by the ears.

Abstract: A mounting device for a heat sink includes a basis and a pair of operating bodies. Two pair of supporting members are provided on opposite sides of the basis. The operating body includes a pole connecting the supporting members, a pivot member pivotably attached to the pole, and at least a spring member encircling the pole. The pivot member includes a pressing portion adapted for pressing the heat sink. One end of the spring member is fixed on one of the supporting members, and the other end of the spring member is secured with the pivot member. The pivot member is pivotable from a first position to a second position under action of a force and returns back to the first position from the second position under action of the spring member after withdrawing the force.

Abstract: A fastener for mounting a heat sink on a chip mounted on a printed circuit board includes a cylindrical spring member and a locking member. The locking member includes a pair of action portions extending through the spring member, an elastic insertion portion formed at the bottom of the action portions and located beneath the spring member, and a pair of spaced hooking portions formed from the action portions and engaged with the spring member.

Abstract: A mounting device for a heat sink (200) includes a pair of pivot members (10), two jointing members (30), and two pairs of spring members (20). Each pivot member includes a clipping portion (11) for clasping the electric unit (300). The jointing members pivotably connect with the pivot members. Each jointing member includes a pressing portion (310) for resiliently abutting against the heat sink toward the electric unit. The spring members each includes two end catches (21), (22) secured with the jointing member and a corresponding member and capable of providing resilient torsions to drive the clipping portions to engage with the electric unit when the clipping portions rotate to one position away from the electric unit.