Abstract: A heat dissipation device cooling an electronic device comprises a conductive plate, a heat spreader received in the conductive plate and contacting the electronic device, a heat pipe connecting the conductive plate and the heat spreader, and an elastic member mounted on the conductive plate and pushing the heat spreader and the heat pipe in the heat spreader downwardly toward the electronic device.

Abstract: A heat sink assembly includes a base plate, a fin group and a heat pipe thermally connecting the base plate with the fin group. The fin group includes a plurality of fins. The heat pipe includes a straight evaporating section contacting with the base plate, a first condensing section extending upwardly from an end of the evaporating section and through the fins, a second condensing section bent downwardly from a free end of the first condensing section and through the fins, and a third condensing section extending upwardly from an opposite end of the evaporating section and through the fins. Periphery walls of at least two of the first, second and third condensing sections substantially totally contact with the fins to increase a contact area between the heat pipe and the fins.

Abstract: A heat dissipation device for cooling an electronic device mounted on a printed circuited board, comprises a heat spreader contacting the electronic device, a fin assembly comprising a plurality of fins, a supporting bracket contacting the heat spreader and supporting the fin assembly, and a heat pipe extending through the fin assembly and the supporting bracket and attached to the heat spreader, wherein a lowermost fin of the fin assembly has a plurality of clasps extending near two opposite ends thereof and towards the supporting bracket. The clasps are bent to press against a bottom of the supporting bracket after the clasps extend through the supporting bracket.

Abstract: A heat sink assembly (100) for cooling a heat-generating electronic component, includes a base plate (32), a plurality of fins (50) mounted on the base plate and a heat pipe (20) thermally connecting the base plate and the fins. The fins are parallel to the base plate and include a bottom fin (40) supporting the fins on the base plate. The bottom fin includes a plurality of supporting tabs (422) engaging with the base plate and separating a body (42) of the bottom fin from the base plate. The bottom fin can be used not only for dissipating heat into a surrounding environment but also for reinforcing the whole strength of the heat sink assembly.

Abstract: A heat sink assembly includes a base, a fin group located at a top of the base, a heat pipe connecting the base with the fin group, a fan mounted on a side of the fin group and a supporting bracket mounted on the base and supporting the fan. The supporting bracket includes a mounting portion secured on the base and a pair of supporting arms extending from the mounting portion and fixed to the fan. Four screws extend through the fan to threadedly engage with the fin group. Lower two of the screws also extend through the supporting arms of the supporting bracket whereby the supporting bracket also connects with the fan.

Abstract: A heat dissipation device includes a heat sink (10), a fan (20) disposed on top of the heat sink, a fan duct (30) arranged on the fan and a fan guard (40) sandwiched between the fan and the fan duct. The fan defines a through hole (26) at each corner and includes a plurality of positioning blocks (28) extending from each side edge thereof. The fan duct includes a plurality of connecting portions (32) extending from a circumference of the fan duct near the fan. Each connecting portion includes a post fitted in the through hole and a hook engaging with the positioning block.

Abstract: A heat dissipation device comprises a heat spreader and heat pipe soldered thereon via a heat conducting material. The heat spreader defines a plurality of cavities in an inner side surface thereof, the heat conducting material is received in the cavities, and the heat pipe contacts and is soldered to the inner side surface of the heat spreader.

Abstract: A heat dissipation device adapted for dissipating heat from a heat-generating electronic element, includes a plurality of fins assembled together. Each of the fins has a rectangular body and four arch-shaped flanges extending from edges of the body to form four round corners in four corners of the body. Each main body of the fins defines a plurality of locking members thereon to engage with corresponding locking members of a corresponding front fin. The arch-shaped flanges in four respective corners of the fins cooperate with each other to form four arced faces in four corners of the assembled fins along an entire length of the assembled fins.

Abstract: A heat dissipation device includes a substrate, a fin assembly located on the substrate, a plurality of heat pipes connecting the substrate and the fin assembly, and a fan fixed on the substrate by a securing device. The securing device includes a holder fixed to the substrate and a plurality of elastic fasteners. The fasteners secure the fan onto the holder and each includes a sandwiched portion sandwiched between the fan and the holder to segregate the fan from the holder.

Abstract: A heat dissipation device includes a substrate, a fin assembly located on the substrate, a plurality of heat pipes connecting the substrate and the fin assembly, and a fan fixed on the substrate by a clip. The fin assembly includes a first fin unit, a second fin unit, and a third fin unit. The third fin unit is located on the substrate, the second fin unit is located on the third fin unit, and the first fin unit is located on the first fin unit. A receiving space is defined in the second and third fin unit. The fan is received in the receiving space and spaced apart from the fin assembly.

Abstract: A heat dissipation device includes a fin assembly, a base, a heat pipe soldered with the base, and a heat spreader sandwiched between the heat pipe and the fin assembly. The fin assembly has a bottom face. The base has a bottom surface and a top surface. The heat pipe comprises an evaporation portion thermally engaging with the top surface of the base plate and a curved portion extending from the evaporation portion and projecting beyond the base plate. The heat spreader has a first face engaging with the bottom face of the fin assembly and a second face thermally engaging with the condensation portion of the heat pipe. The heat spreader has a profile on the bottom face of the fin assembly, which is in compliance with at least a portion of the heat pipe.

Abstract: A locking device for securing a temperature sensor on a heat sink, includes a support seat and a catch fixed to the heat sink and respectively located at two opposite sides of the sensor, and a tab connecting with the support seat and the catch and pressing the sensor against the heat sink downwardly. The support seat includes a bent sheet secured on the heat sink and a pair of rings. The catch includes a bent flake secured on the heat sink and a barb extending downwardly from the flake. An end of the tab is bent to form a hem pivotably connected to the support seat at a position between the rings. An opposite end of the tab defines an opening, which engages the barb therein to thereby lock with the catch.

Abstract: A heat dissipation device includes a heat sink, a retention module and a rotatable fastener for securing the heat sink to the retention module. The retention module includes two supporting ribs and a positioning block above one of the supporting ribs. The rotatable fastener is rotatably received in the retention module and includes an actuating portion and a pressing portion fastened to the actuating portion. The heat sink rests on the supporting ribs of the retention module with an end thereof being pressed by the positioning block, and an opposite end thereof being pressed by the pressing portion. The rotatable fastener can be rotated to an unlocked position wherein the pressing portion is moved away from the opposite end of the heat sink, so that the heat sink is removable from the retention module.

Abstract: A heat dissipation device includes a base for contacting with a heat-generating electronic component, a fin assembly, a heat pipe connecting with the base and the fin assembly, and a holder connecting with the base and the fin assembly and supporting the heat pipe. The fin assembly includes a plurality of fins far away from the base. The heat pipe includes an evaporation portion thermally engaging with the base, a condensation portion connecting with the fin assembly and a connecting portion connecting with the evaporation portion and the condensation portion. The holder has a profile similar to the connecting portion of the heat pipe.

Abstract: A protective device (10) comprises a cap (100) and a strap (120) connecting with the cap (100). The cap (100) defines a cavity (102) which is adapted for accommodating thermal interface material (300) spread on a bottom surface (204) of a heat sink (200). At least three sides of the heat sink (200) are encircled by the strap (120), thereby the cap (100) is firmly attached to the heat sink (200) via the strap (120).

Abstract: A heat dissipation device includes a base, a fin group mounted on a top surface of the base, and a plurality of fasteners secured on the base. Each fastener includes a bolt extending through the base, and an elastic sleeve engaging with the bolt under the base. The sleeve defines a hole and the hole has a configuration such that the sleeve securely clasp the bolt. The bolt extends through the base and engages in the hole of the sleeve.

Abstract: A thermal module includes a heat spreader (50) for contacting with a heat-generating electronic device mounted on a printed circuit board, a heat sink (60), a heat pipe (70) thermally connecting the heat spreader and the heat sink. A frame (80) is detachably mounted on the heat spreader, for fixing the heat spreader to the printed circuit board so that the heat spreader can thermally contact with the heat-generating device on the printed circuit board. The heat spreader has a simple polygonal configuration. The frame is formed by stamping a metal sheet or plastics injection molding.

Abstract: A blind (10) for a projector includes a bracket (20) mounted to the projector, and a folded fin (30) fixed on the bracket and covering a hot air vent of the projector. The folded fin includes a plurality of parallel fins (32) and a plurality of upper and lower tabs (34, 36) interconnecting the fins. Each of the fins defines an angle of 135 degrees with a plane defined by the lower tabs. Furthermore, a projection of each of the fins on the plane defined by the lower tabs overlaps a part of a corresponding adjacent fin. Thus, the blind can prevent a light leakage from the projector, while allow a heated airflow to be expelled out of the projector simultaneously.

Abstract: A heat dissipation device for dissipating heat from heat-generating components on a printed circuit board includes a cover for covering the printed circuit board and a radiator mounted on the cover. The cover defines a plurality of holes corresponding to the heat-generating components on the printed circuit board. The radiator includes a plurality of contacting portions extending through the holes of the cover for contacting the heat-generating components, respectively. The cover and the radiator are made of different materials by different manufacturing techniques, i.e. aluminum die-casting and aluminum extrusion.