Abstract: The present invention provides methods and systems for testing and inspection of a display panel. The methods involve the application of voltages to rollers or testing conductive films. By applying a potential difference to the appropriate rollers or testing conductive films, different optical states of a display panel can be displayed for inspection.

Abstract: The present invention relates to a backplane design for display panels and processes for their manufacture. The invention provides cost-effective ways to manufacture a display panel because the manufacture does not involve the use of a patterned ITO substrate, flexible printed circuit board or rigid circuit board. In addition, a roll-to-roll process can be employed to manufacture the display panel.

Abstract: The present invention relates to a direct drive display having a multi-layer backplane and a process for manufacturing such a display.

Abstract: A process for forming a patterned thin film structure on a substrate is disclosed. A pattern is printed with a material, such as a masking coating or an ink, on the substrate, the pattern being such that, in one embodiment, the desired thin film structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structures.

Abstract: The invention is directed to an assembly for electroplating comprising an electroplating bath and non-conductive plates. The invention is also directed to an assembly for electroplating comprising an electroplating bath, elements with electrically adjustable resistance, and ampere-hour meters. The invention is further directed to methods for monitoring, controlling and adjusting the thickness distribution of an electroplated material on an object. The object can be of any shape as long as it can electrically charged.

Abstract: A process for forming a patterned thin film structure on a substrate or in-mold decoration film is disclosed. A pattern is printed with a material, such as a masking coating or ink, on the substrate, the pattern being such that, in one embodiment, the desired structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structure.

Abstract: The invention is directed to compositions of display cell structure and electrode protecting layers for improving the performance of display devices. The composition comprises a polar oligomeric or polymeric material having a glass transition temperature below about 100° C., and the resulting display cells or electrode protecting layer have an average crosslinking density of below about 1 crosslink point per 80 Dalton molecular weight.

Abstract: The invention is directed to an embossing assembly comprising an embossing sleeve having a three-dimensional pattern formed thereon, an expandable insert; and a drum over which said sleeve and said expandable insert are mounted. The present invention is also directed to a method for preparing an embossing drum or an embossing sleeve. The present invention is further directed to a method for controlling the thickness of a plating material over the surface of a drum or sleeve in an electroplating process.

Abstract: A process for forming a patterned thin film structure on a substrate or in-mold decoration film is disclosed. A pattern is printed with a material, such as a masking coating or ink, on the substrate, the pattern being such that, in one embodiment, the desired structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structure.

Abstract: The present invention relates to design and processes for the manufacture of backplane for segment displays.

Abstract: The present invention relates to a backplane design for display panels and processes for their manufacture.

Abstract: A single-element magnetoresistive (MR) read head with reduced susceptibility to noise is disclosed. In particular, the present invention addresses the problem of noise generated thermally through contact with the recording medium. The present invention solves this problem by keeping the temperature of the read head at a level that minimizes the noise level. According to a preferred embodiment of the present invention, the shielding material used in the read head is recessed with respect to the magnetic-medium-bearing surface. In an alternative embodiment of the present invention, a thin coating of metal on the read head surface is applied. In yet another embodiment, the read element is operated with a low bias current so as to minimize the thermal effect of power consumption due to electrical resistance. In still another embodiment, the read element makes use of insulating material that is both an electrical insulator and a high quality thermal insulator.

Abstract: The present invention relates to a direct drive display having a multi-layer backplane and a process for manufacturing such a display.

Abstract: A matrix driven electrophoretic display with a multi-layer back plane is disclosed. The display comprises a top electrode layer, a display cell layer, and a multi-layer back plane. In one embodiment, the multi-layer back plane comprises an electrode formed on the top surface of the top substrate of the multi-layer back plane, a conductive via structure through the substrate, and a conductive trace connected electrically to the via structure at the bottom surface of the first substrate, whereby an electrical connection may be made from the electrode to a structure or component not located immediately beneath the electrode in the multi-layer back plane. In other embodiments, the multi-layer back plane may comprise additional layers and via holes, as needed to connect the electrode with the appropriate switching elements and/or driver elements, as applicable. Such switching and driver elements, integrated with multi-layer back plane.

Abstract: A method and apparatus including gluing vias in the closure surface and/or the recording module surface to increase bonding strength of the closure to the recording module. The surface of the recording module has a nonplanar topography along a gap side surface which creates localized air space in the gap. When adhesive is introduced between the closure and the recording module, the adhesive flows into these air spaces to bond the surfaces. The invention utilizes gluing vias in the surfaces of the closure and/or the recording module to increase flow of the adhesive and improve bonding strength.

Abstract: A process for forming a patterned thin film structure on a substrate is disclosed. A pattern is printed with a material, such as a masking coating or an ink, on the substrate, the pattern being such that, in one embodiment, the desired thin film structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structures.

Abstract: A process for forming a patterned thin film structure on a substrate or in-mold decoration film is disclosed. A pattern is printed with a material, such as a masking coating or ink, on the substrate, the pattern being such that, in one embodiment, the desired structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structure.

Abstract: The tape head of the present invention has a substrate and a closure separated by a gap. The tape head is of the type having a flat closure module. The gap layers disposed in the gap include a recording track layer and a patterned gap layer. The recording track layer has a nonplanar topography along said gap that is defined by at least one of a read track and a write track. The patterned gap layer is disposed over substantially an entire surface of the gap side surface of the closure. The patterned gap layer is etched so as to selectively define a topography along said gap that inversely corresponds to the nonplanar topography of the recording track layer. As a result, the patterned gap layer fills any localized air space that would otherwise exist in the gap due to the nonplanar topography of the recording track layer. By filling the localized air space in the gap, microchipping is reduced and/or eliminated in the tape head of the present invention.

Abstract: A multitrack coupled element read head and a method for manufacturing such a read head are provided. The multitrack coupled element read head includes multiple coupled magnetoresistive read elements in a spaced relationship, and a support structure between a pair of coupled read elements, the support structure also being a magnetoresistive material. The read head also includes a closure material bonded on the plurality of coupled read elements and the support structure, where the support structure provides for substantially even pressure on the pair of coupled read elements such that shorting therein is eliminated.

Abstract: A method and apparatus including gluing vias in the closure surface and/or the recording module surface to increase bonding strength of the closure to the recording module. The surface of the recording module has a nonplanar topography along a gap side surface which creates localized air space in the gap. When adhesive is introduced between the closure and the recording module, the adhesive flows into these air spaces to bond the surfaces. The invention utilizes gluing vias in the surfaces of the closure and/or the recording module to increase flow of the adhesive and improve bonding strength.