Abstract: A test key structure includes a substrate; a first metal pad disposed on the substrate; a second metal pad disposed in proximity to the first metal pad on the substrate; a gap between the first metal pad and the second metal pad; a first contact disposed on the first metal pad; and a second contact disposed on the second metal pad.

Abstract: A device for recognizing wafer identification number with automatically turning on and off recognizing function comprises a base, a support frame, a light source, a plurality of image capturing units, an image recognition unit and a control unit. The base comprises a wafer boat placing portion and a first switch disposed on the wafer boat placing portion. The light source and the image capturing units are disposed on the support frame. The control unit is electrically connected to the first switch, the light source, the image capturing units and the image recognition unit. As such, the device for recognizing wafer identification number with automatically turning on and off recognizing function can automatically turn on and off the light source, the image capturing units, and the image recognition unit, therefore the operation is very easy and convenience.

Abstract: A method, a computer-readable medium, and an apparatus for transport service are provided. The apparatus may receive a plurality of transport service transactions associated with a point of interest entity. For each transport service transaction, the apparatus may determine a transport service location at which the transport service transaction is executed. The apparatus may cluster the transport service locations determined for the plurality of transport service transactions. The apparatus may determine one or more candidate transport service locations for the point of interest entity based on the clustering. The apparatus may provide the one or more candidate transport service locations to a client or a service provider associated with a transport service transaction that is to be executed at the point of interest entity.

Abstract: An electronic device is provided. The electronic device includes a substrate, a panel, an optical modulation layer, and a control unit. The panel includes a first region, a second region, and a third region between the first region and the second region. The optical modulation layer is disposed corresponding to the panel. The control unit is electrically connected to the panel. The control unit inputs a bright region voltage to the first region and the second region, and inputs a dark region voltage to the third region during a plurality of operation periods. The bright region voltage differs from the dark region voltage during any of the operation periods.

Abstract: A semiconductor transistor structure includes a substrate with a first conductivity type, a fin structure grown on the substrate, and a gate on the fin structure. The fin structure includes a first epitaxial layer having a second conductivity type opposite to the first conductivity type, a second epitaxial layer on the first epitaxial layer, and a third epitaxial layer having the second conductivity type on the second epitaxial layer.

Abstract: Aspects concern a server computer for verifying a location of a user device including a memory interface connected to a memory device that stores a database including verification and gathering questions, wherein each question of the verification and gathering questions is associated with a location, the database including an answer to each verification question and not including an answer to each gathering question; and a processing unit configured to: receive location data representing the location of the user device; select a verification question and a gathering question associated with the location of the user device; transmit the verification question and the gathering question to the user device and receive an answer to each of the verification and gathering question from the user device; if the answer provided by the user device to the verification question corresponds to the answer included in the database, verify the location of the user device.

Abstract: Laser-marked packaged surface acoustic wave devices are provided. The laser-marked packaged surface acoustic wave device may include a package structure encapsulating a surface acoustic wave device on a first side of a piezoelectric substrate. The opposite side of the piezoelectric substrate can be directly marked using a laser. The laser may be a deep ultraviolet laser. By directly marking the piezoelectric substrate itself, the use of a separate marking film can be avoided, making the packaged surface acoustic wave device thinner. When the laser has a wavelength readily absorbed by the piezoelectric substrate, a relatively shallow marking may be made in the piezoelectric substrate. The markings can extend less than 1 micrometer into the piezoelectric substrate, so as not to affect the structural integrity of the piezoelectric substrate or the operation of the packaged surface acoustic wave device.

Abstract: A method of removing a hard mask layer includes providing a gate. A hard mask layer covers and contacts a top surface of the gate. Two spacer structures respectively contacts two sides of the gate. Two first spacers are respectively disposed on the two spacer structures. Later, a wet etching process is performed to remove the hard mask layer and the first spacers and keep the spacer structures. An etchant is utilized in the wet etching process. A selective etching ratio of the silicon nitride to silicon oxide of the etchant is more than 90. The etchant includes Si(OH)4. A concentration of Si(OH)4. is greater than or equal to 3.95 ppm and smaller than or equal to 10 ppm.

Abstract: The invention provides an ion source structure of an ion implanter, which comprises an arc chamber, a filament in the arc chamber, and a cathode in the arc chamber, wherein the cathode has an upper surface and a lower surface, and at least one of the upper surface and the lower surface is non-planar.

Abstract: A method for wafer image equalization includes obtaining a wafer image, converting the wafer image into bitmap data, generating a grayscale distribution of RGB pixels according to the bitmap data, generating a grayscale cumulative probability distribution of the RGB pixels according to the grayscale distribution, generating a mapping function according to the grayscale cumulative probability distribution of the RGB pixels, converting the grayscale distribution of the RGB pixels by the mapping function into an equalized grayscale distribution of the RGB pixels, and generating an equalized wafer image according to the equalized grayscale distribution of the RGB pixels.

Abstract: The present invention provides a semiconductor device and a method of fabricating the same, which includes a substrate, a gate structure, and a dielectric layer. The gate structure is disposed on the substrate and includes an inverted trapezoidal shape. The dielectric layer is disposed on the substrate, and the gate structure is disposed within the dielectric layer. The gate structure includes a metal gate structure or a polysilicon gate structure.

Abstract: The invention provides a photoresist coating method, which comprises the following steps: providing a wafer with a pattern on the wafer, placing the wafer on a spinner, injecting a photoresist on a central region of the wafer from a nozzle, and carrying out a spin coating step, the spin coating step comprises: turning on the spinner to rotate the spinner to a first rotation speed, and raising the first rotation speed to a second rotation speed, and performing a plurality of brakes during the process of maintaining the second rotation speed, so that the second rotation speed instantly drops to a third rotation speed, and then rises to the second rotation speed again.

Abstract: A method of detecting wafer defects based on singularly valuable decomposition is provided in the present invention, including steps of input a wafer image, performing a preprocess to the wafer image through histogram equalization to obtain a preprocessed image, performing singularly valuable decomposition to the preprocessed image, performing defect magnification to the decomposed wafer image, reconstruct the magnified wafer image to obtain a defect saliency image, denoising the defect saliency image, and detecting defects in the denoised wafer image.

Abstract: A lithography film stack applied to an immersion lithography process includes a photoresist, a wavelength adjusting layer and a top coating layer. The photoresist is disposed on a substrate. The wavelength adjusting layer is disposed on the photoresist. The top coating layer is disposed on the wavelength adjusting layer. A refractive index of the wavelength adjusting layer is greater than a refractive index of the top coating layer and a refractive index of an immersion fluid of the immersion lithography process.

Abstract: A machine monitoring system includes a plurality of first machines and a control module. The first machines are for a first process. The control module is connected with the first machines. The control module is configured to: define each of the first machines as a high-risk first machine or a low-risk first machine according to a first risk score of each of the first machines; designate one of the first machines being defined as the high-risk first machine as a selected high-risk first machine; assign an object to be processed by the first process through the selected high-risk first machine to obtain a processed object; and determine whether to continue or stop to use the selected high-risk first machine according to a test result of the processed object.

Abstract: A method for preparing high-purity nickel-based superalloy includes the steps of: performing electron beam smelting on small cylinders in a first water-cooled copper crucible after preheating an electron gun, and converging the beam to the edge of one side of the ingot; turning on the electron gun again after completely solidifying the ingot, the electron beam spot uniformly and slowly scanning a surface of the ingot from a side opposite to a final beam converging area of the ingot to the final beam converging area of the ingot to ensure that the alloy at a position scanned by the electron beam spot is completely melted, and stopping scanning once scanning to the final converging area of the ingot; casting the molten alloy in the first water-cooled copper crucible to the second water-cooled copper crucible; taking out the refined nickel-base superalloy after cooling down the electron beam melting furnace.

Abstract: The invention provides an ion source structure of an ion implanter, which comprises an arc chamber, a filament in the arc chamber, and a cathode in the arc chamber, wherein the cathode has an upper surface and a lower surface, and at least one of the upper surface and the lower surface is non-planar.

Abstract: A semiconductor transistor structure includes a substrate with a first conductivity type, a fin structure grown on the substrate, and a gate on the fin structure. The fin structure includes a first epitaxial layer having a second conductivity type opposite to the first conductivity type, a second epitaxial layer on the first epitaxial layer, and a third epitaxial layer having the second conductivity type on the second epitaxial layer.

Abstract: A method for detecting defects on a wafer including the steps of obtaining a reference image of a chip pattern formed on a reference wafer, using a computer algorithm to analyze the reference image to produce a division map for the chip pattern; setting respective thresholds for divisions of the division map, obtaining a comparison data between a test image of the chip pattern formed on a test wafer and the reference image, using the division map and the thresholds to examine the comparison data to identify a defect in the test image.

Abstract: A method, a computer-readable medium, and an apparatus for transport service are provided. The apparatus may receive a plurality of transport service transactions associated with a point of interest entity. For each transport service transaction, the apparatus may determine a transport service location at which the transport service transaction is executed. The apparatus may cluster the transport service locations determined for the plurality of transport service transactions. The apparatus may determine one or more candidate transport service locations for the point of interest entity based on the clustering. The apparatus may provide the one or more candidate transport service locations to a client or a service provider associated with a transport service transaction that is to be executed at the point of interest entity.