Abstract: This disclosure provides a method of manufacturing an electrode sheet of a lithium-ion liquid battery. An electrode powder is formed from an active material by a dry mixing process. A current collecting metal sheet is disposed in a mold. The electrode powder is introduced into a cavity of the mold on opposite sides of the current collecting metal sheet. A thermal compression process using the mold is performed to form a first and a second electrode layer from the electrode powder, where the two electrode layers are respectively attached to a first and a second surface of the current collecting metal sheet. When a positive electrode sheet is manufactured, densities of the electrode layers are in a range of 1.6 g/cm3 to 3.4 g/cm3. When a negative electrode sheet is manufactured, densities of the electrode layers are in a range of 1.2 g/cm3 to 2.1 g/cm3.

Abstract: A lighting device and a cove lighting module are provided. The lighting device includes a shell body, at least one light emitting diode element, and at least one light guide plate. The light emitting diode element and the light guide plate are disposed in the shell body. The light guide plate is disposed adjacent to the light emitting diode element to enable light emitted by the light emitting diode element to enter the light guide plate through a light incident surface of the light guide plate and to exit from the light guide plate through a light emitting surface of the light guide plate. The cove lighting module includes a light-receiving object and the lighting device, wherein the light-receiving object has an opaque surface. In the cove lighting module, the light exiting from the light guide plate is directly emitted to the opaque surface of the light-receiving object.

Abstract: The present disclosure involves a lighting apparatus. The lighting apparatus includes a thermally-conductive substrate. The thermally-conductive substrate may include a substrate. The lighting apparatus also includes a printed circuit board (PCB). The PCB is located besides the thermally-conductive substrate. The PCB and the thermally-conductive substrate have different material compositions. The lighting apparatus also includes a photonic device located over the thermally-conductive substrate. The photonic device may include a light-emitting diode (LED) die. The photonic device is thermally coupled to the thermally-conductive substrate. The photonic device is electrically coupled to the printed circuit board. The lighting apparatus also includes a thermal dissipation structure. The thermal dissipation structure is thermally coupled to the thermally-conductive substrate.

Abstract: A liquid crystal display is described, which includes a backlight module and a liquid crystal display panel. The backlight module includes a light guide plate and a plurality of blue light-emitting diodes adjacent to the light guide plate. The liquid crystal display panel is disposed above the backlight module. The liquid crystal display panel includes a first transparent substrate, a first electrode, a liquid crystal layer, a phosphor powder layer, a color filter, a second electrode and a second transparent substrate stacked above the light guide plate in sequence. The phosphor powder layer includes a plurality of green phosphor powder regions and red phosphor powder regions. The color filter is adjacent to the phosphor powder layer. The color filter includes a plurality of green color filter regions and red color filter regions respectively and correspondingly located, on the green phosphor powder regions and the red phosphor powder regions.

Abstract: An embodiment of the disclosure includes a LED module. A substrate is provided. A light sensor is positioned in the substrate. A LED chip is attached to the substrate. The LED chip has a first side and a second side. The second side is covered by an opaque layer with an opening. The opening is substantially aligned with the light sensor. The light sensor receives a light output emitting from the LED chip through the opening.

Abstract: An embodiment of the disclosure includes a LED module. A substrate is provided. A light sensor is positioned in the substrate. A LED chip is attached to the substrate. The LED chip has a first side and a second side. The second side is covered by an opaque layer with an opening. The opening is substantially aligned with the light sensor. The light sensor receives a light output emitting from the LED chip through the opening.

Abstract: An illumination module is provided, and includes a case, a light-transmitting window and a light source module. The case includes a top plate having an opening. The light-transmitting window covers the opening of the top plate. The light source module includes a light guide element, a first reflective sheet, a second reflective sheet, at least one light source and a fluorescence member. The light guide element includes a light incident surface, a light-exiting surface, a first reflective surface and a second reflective surface. The first reflective sheet and the second reflective sheet are disposed on the first reflective surface and the second reflective surface respectively. A light-emitting surface of the light source faces the light incident surface of the light guide element. At least one section of the fluorescence member faces the light-exiting surface of the light guide element.

Abstract: A light source module is provided. The light source module includes a light guide element, at least one light source and a fluorescence member. The light guide element includes a light incident surface and a light-exiting surface. The light-exiting surface is opposite to the light incident surface. A light-emitting surface of the at least one light source faces the light incident surface of the light guide element. At least one section of the fluorescence member faces the light-exiting surface of the light guide element.

Abstract: A lighting device and a cove lighting module are provided. The lighting device includes a shell body, at least one light emitting diode element, and at least one light guide plate. The light emitting diode element and the light guide plate are disposed in the shell body. The light guide plate is disposed adjacent to the light emitting diode element to enable light emitted by the light emitting diode element to enter the light guide plate through a light incident surface of the light guide plate and to exit from the light guide plate through a light emitting surface of the light guide plate. The cove lighting module includes a light-receiving object and the lighting device, wherein the light-receiving object has an opaque surface. In the cove lighting module, the light exiting from the light guide plate is directly emitted to the opaque surface of the light-receiving object.

Abstract: The present disclosure involves a lighting apparatus. The lighting apparatus includes a thermally-conductive substrate. The thermally-conductive substrate may include a substrate. The lighting apparatus also includes a printed circuit board (PCB). The PCB is located besides the thermally-conductive substrate. The PCB and the thermally-conductive substrate have different material compositions. The lighting apparatus also includes a photonic device located over the thermally-conductive substrate. The photonic device may include a light-emitting diode (LED) die. The photonic device is thermally coupled to the thermally-conductive substrate. The photonic device is electrically coupled to the printed circuit board. The lighting apparatus also includes a thermal dissipation structure. The thermal dissipation structure is thermally coupled to the thermally-conductive substrate.

Abstract: An embodiment of the disclosure includes a LED module. A substrate is provided. A light sensor is positioned in the substrate. A LED chip is attached to the substrate. The LED chip has a first side and a second side. The second side is covered by an opaque layer with an opening. The opening is substantially aligned with the light sensor. The light sensor receives a light output emitting from the LED chip through the opening.

Abstract: A side view light emitting diode (LED) package structure includes a package housing, a side view LED chip and a thermal conductive member. The side view LED chip is enclosed by the package housing and an emitting direction of the side view LED chip is perpendicular to a thickness direction of a substrate. The thermal conductive member connected with the side view LED chip is disposed inside the package housing and a portion of which extends out of a dissipation opening of the package housing to be exposed so that heat of the side view LED chip is dissipated.

Abstract: The present disclosure provides an ultra high voltage (UHV) light emitting diode (LED) device. According to one embodiment, the device includes a substrate, a plurality of LED junctions disposed above the substrate and coupled to one another, and a control component including a plurality of switches embedded within the substrate and coupled to the plurality of LED junctions to control routing of current across the plurality of LED junctions.

Abstract: A light-emitting diode backlight module includes a base and a light source disposed on the base. The light source comprises a substrate, a heat sink and an LED chip. The base has a heat conductor. The heat sink of the light source is coupled between the substrate of the light source and the heat conductor of the base. The heat sink has a first part which is adjacent a first side of the substrate and a second part which is adjacent a second side of the substrate. The heat sink is in contact with the heat conductor. The LED chip is disposed on the first part of the heat sink and emits light laterally.

Abstract: An embodiment of the disclosure includes a LED module. A substrate is provided. A light sensor is positioned in the substrate. A LED chip is attached to the substrate. The LED chip has a first side and a second side. The second side is covered by an opaque layer with an opening. The opening is substantially aligned with the light sensor. The light sensor receives a light output emitting from the LED chip through the opening.

Abstract: A light emitting diode packaging structure includes a package body, a red LED chip, a blue LED chip, a green LED chip, a package material and a yellow phosphor. Three LED chips are disposed within an accommodating room of the body package and covered by the package material. The yellow phosphor is uniformly mixed with the package material. A white light is formed by a mix of three types of light from the LED chips. Additionally, a yellow light which is generated from the excitement of the yellow phosphor with the blue light is mixed with a part of the blue light to further form the white light.

Abstract: A light-emitting diode backlight module includes a base and a light source disposed on the base. The light source comprises a substrate, a heat sink and an LED chip. The base has a heat conductor. The heat sink of the light source is coupled between the substrate of the light source and the heat conductor of the base. The heat sink has a first part which is adjacent a first side of the substrate and a second part which is adjacent a second side of the substrate. The heat sink is in contact with the heat conductor. The LED chip is disposed on the first part of the heat sink and emits light laterally.

Abstract: A phosphor coating process for a light-emitting device is described. A light-emitting diode chip is bonded on a substrate. A light-sensitive layer is formed over the light-emitting diode and the substrate. The light-sensitive layer is patterned by a photolithography process to expose an area of the light-emitting diode chip, on which desires a phosphor coating. A phosphor-adhesive material is filled on the area of the light-emitting diode chip.

Abstract: A lateral light-emitting diode backlight module includes a base, a circuit board, and at least a light emitting diode wherein the base having a heat conductor, the circuit board having a conductive pad formed on a surface thereof, and the circuit board disposed on the heat conductor and connected to the heat conductor. Each light emitting diode comprising a substrate, a heat sink fastened to the substrate and connected to the heat conductor, an LED chip disposed on the heat sink and emits light laterally, and a pin mounted on the substrate and extended to the conductive pad of the circuit board.

Abstract: A light emitting diode device includes a substrate, a light emitting diode chip, a plurality of wires, a plurality of lead frames, an insulating body, an encapsulant and a lens. The light emitting diode chip is electrically connected with a lead frame and the substrate. The substrate is electrically connected with another lead frame. Hence, the length of the wires can be decreased, and the reliability of the light emitting diode device can be improved.