Patents by Inventor Yi-Wang JHAN

Yi-Wang JHAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220020639
    Abstract: The invention provides a contact plug structure. The contact plug structure comprises a substrate and a dielectric layer, and a first contact hole located in the dielectric layer and penetrating into the substrate, the first contact hole has a first through hole portion located in the dielectric layer and a first groove located in the substrate, and the first through hole portion is communicated with the first groove, the maximum width of the first groove is larger than that of the first through hole portion in the direction parallel to the substrate surface. A barrier layer at least partially covering the sidewall of the first groove. A conductive pad layer is located on the bottom surface of the first groove. The conductive core layer is arranged on the conductive pad layer, and the barrier layer wraps the conductive pad layer and the conductive core layer.
    Type: Application
    Filed: April 20, 2021
    Publication date: January 20, 2022
    Inventors: An-Chi Liu, Yi-Wang Jhan
  • Publication number: 20210407936
    Abstract: A semiconductor structure and a method of fabricating therefor are disclosed. A second contact pad (500) is arranged lateral to a first contact pad (420) in an interconnect structure (400). As a result, during fabrication of the interconnect structure (400), the first contact pad (420) will not be present alone in a large bland area, due to the presence of the second contact pad (500). Thus, a pattern feature for the first contact pad (420) will not be over-resolved, increasing formation accuracy of the first contact pad (420) and thus guaranteeing good electrical transmission performance of the resulting interconnect structure (400).
    Type: Application
    Filed: March 17, 2020
    Publication date: December 30, 2021
    Inventors: Yi-Wang JHAN, Yung-Tai HUANG, Xin YOU, Xiaopei FANG, Yu-Cheng TUNG
  • Publication number: 20210272961
    Abstract: A contact structure, contact pad layout and structure, mask combination and manufacturing method thereof is provided in the present invention. Through the connection of tops of at least two contact plugs in the boundary of core region, an integrated contact with larger cross-sectional area is formed in the boundary of core region. Accordingly, the process of forming electronic components on the contact structure in the boundary of core region may be provided with sufficient process window to increase the size of electronic components in the boundary, lower contact resistance, and the electronic component with increased size in the boundary buffer the density difference of circuit patterns between the core region and the peripheral region, thereby improving optical proximity effect and ensuring the uniformity of electronic components on the contact plugs inside the boundary of core region, and avoiding the collapse of electronic components on the contact plug in the boundary.
    Type: Application
    Filed: May 14, 2021
    Publication date: September 2, 2021
    Inventors: Yu-Cheng TUNG, Yi-Wang JHAN, Yung-Tai HUANG, Xiaopei FANG, Shaoyi WU, Yi-Lei TSENG