Patents by Inventor Yi Wang

Yi Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12149365
    Abstract: A method for transmitting uplink control information is provided. The method includes receiving a Physical Downlink Shared Channel (PDSCH), determining Physical Uplink Control Channel (PUCCH) resources for feeding back Hybrid Automatic repeat Request Acknowledgement (HARQ-ACK) information of the PDSCH, and transmitting a HARQ-ACK of the PDSCH on the PUCCH resources according to at least one of HARQ-ACK timing information, the time domain duration of scheduling unit in a downlink bandwidth part and an uplink bandwidth part, or PUCCH resource indication information. The embodiments of the application further propose a corresponding user equipment and a corresponding computer storage medium.
    Type: Grant
    Filed: July 17, 2023
    Date of Patent: November 19, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yi Wang, Jingxing Fu, Feifei Sun
  • Publication number: 20240379670
    Abstract: A semiconductor device includes a substrate with a high voltage region and a low voltage region. A first deep trench isolation is disposed within the high voltage region. The first deep trench isolation includes a first deep trench and a first insulating layer filling the first deep trench. The first deep trench includes a first sidewall and a second sidewall facing the first sidewall. The first sidewall is formed by a first plane and a second plane. The edge of the first plane connects to the edge of the second plane. The slope of the first plane is different from the slope of the second plane.
    Type: Application
    Filed: June 6, 2023
    Publication date: November 14, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Ya-Ting Hu, Chih-Yi Wang, Yao-Jhan Wang, Wei-Che Chen, Kun-Szu Tseng, Yun-Yang He, Wen-Liang Huang, Lung-En Kuo, Po-Tsang Chen, Po-Chang Lin, Ying-Hsien Chen
  • Publication number: 20240379584
    Abstract: A semiconductor package includes a first die having a first substrate, an interconnect structure overlying the first substrate and having multiple metal layers with vias connecting the multiple metal layers, a seal ring structure overlying the first substrate and along a periphery of the first substrate, the seal ring structure having multiple metal layers with vias connecting the multiple metal layers, the seal ring structure having a topmost metal layer, the topmost metal layer being the metal layer of the seal ring structure that is furthest from the first substrate, the topmost metal layer of the seal ring structure having an inner metal structure and an outer metal structure, and a polymer layer over the seal ring structure, the polymer layer having an outermost edge that is over and aligned with a top surface of the outer metal structure of the seal ring structure.
    Type: Application
    Filed: July 22, 2024
    Publication date: November 14, 2024
    Inventors: Chih-Hsiang Tseng, Yu-Feng Chen, Cheng Jen Lin, Wen-Hsiung Lu, Ming-Da Cheng, Kuo-Ching Hsu, Hong-Seng Shue, Ming-Hong Cha, Chao-Yi Wang, Mirng-Ji Lii
  • Publication number: 20240375364
    Abstract: The invention provides a mechanical drum suspension pull turn-up molding structure.
    Type: Application
    Filed: January 6, 2022
    Publication date: November 14, 2024
    Inventors: BINGZHENG GUAN, XINGRUI LI, YIHANG YU, YI WANG, MENG HU, JIFENG ZHANG, YU YANG
  • Publication number: 20240380487
    Abstract: A ground-high altitude platform-satellite (G-H-S) laser communication system and method based on anisotropic non-Kolmogorov turbulence are provided, and the system includes a ground transmitting terminal, a HAP, a satellite terminal, a ground-HAP uplink and an HAP-satellite uplink. When laser beams are transmitted upwards from the ground transmitting terminal and through the HAP, the laser beams are affected light intensity scintillation, beam drift, and angle of arrival fluctuation, and are transmitted through vacuum channels and received by receiving antenna of the satellite terminal. The HAP is located at stratosphere, and an anisotropic non-Kolmogorov turbulence model is suitable for analyzing turbulence effect in stratosphere. Thus, the anisotropic non-Kolmogorov turbulence model is used to research transmission characteristics of the laser beams.
    Type: Application
    Filed: May 8, 2024
    Publication date: November 14, 2024
    Inventors: Yi Wang, Xingyue Guo, Dexian Yan
  • Patent number: 12140937
    Abstract: A method for improving a cycle time of a process of a product is provided. The method includes: collecting process profile data from a plurality of tool groups running the process, and calculating values of a plurality of key-performance-indicators (KPIs) of each tool group including calculating a standard deviation of an output of a stage of a bottleneck tool group of the tool groups; feeding the values of the KPIs and a work-in-progress (WIP) of each tool group into a neural network model in order to output an impact on the WIP for each KPI of each tool group by the neural network model; selecting a set of major KPIs of each tool group from the KPIs according to the impact of each tool group; and controlling the tool groups according to the impact of the set of major KPIs of each tool group in order to reduce a total WIP.
    Type: Grant
    Filed: June 18, 2023
    Date of Patent: November 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Yi Wang, Chao-Ming Cheng
  • Patent number: 12143131
    Abstract: This application provides a tuning component, including: a plurality of pins, where the plurality of pins include a first pin, a second pin, a third pin, and a fourth pin; a reactance element, where the reactance element is connected between the first pin and the second pin; a switch assembly, disposed between the third pin and the fourth pin; a first internal branch, where one end of the first internal branch is connected to the third pin; and a second internal branch, where one end of the second internal branch is connected to the fourth pin, where the other end of the first internal branch is connected to the other end of the second internal branch to form an integrated end, and the integrated end is connected to the first pin. This application further provides an antenna apparatus and a terminal device, to help reduce headroom requirement of antenna.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: November 12, 2024
    Assignee: Honor Device Co., Ltd.
    Inventors: Qiao Sun, Kun Li, Silei Huyan, Yi Wang, Jinglei Zhang, Yuzhan Li
  • Patent number: 12142235
    Abstract: An apparatus including a pixel electrode circuit is provided. The pixel electrode circuit includes a first switch, a second switch, a first-type transistor, a first second-type transistor, and a second second-type transistor. The first switch and the second switch are respectively controlled by a first control signal and a second control signal. The first-type transistor includes a gate electrically connected to a first node, a first terminal connected to a first power supply voltage, and a second terminal connected to a third node. The first second-type transistor includes a gate electrically connected to a second node, a first terminal connected to a second power supply voltage, and a second terminal connected to the third node. The second second-type transistor includes a gate electrically connected to the second node, a first terminal being grounded, and a second terminal providing an output voltage.
    Type: Grant
    Filed: October 6, 2023
    Date of Patent: November 12, 2024
    Assignee: CYTESI INC.
    Inventors: Tung-Yu Wu, Chung-Yi Wang, Tang-Hung Po
  • Patent number: 12144003
    Abstract: The present disclosure provides a user equipment and a method for performing data transmission. The method includes receiving at least one of downlink control information (DCI) or higher layer signaling from a base station; determining a transmission format of the data transmission based on at least one of the DCI or the higher layer signaling; and performing the data transmission based on the determined transmission format. The present disclosure also provides a base station and a method for performing data transmission.
    Type: Grant
    Filed: December 9, 2022
    Date of Patent: November 12, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Feifei Sun, Yi Wang, Jingxing Fu
  • Publication number: 20240369918
    Abstract: In a method of manufacturing a photo mask, an etching mask layer having circuit patterns is formed over a target layer of the photo mask to be etched. The photo mask includes a backside conductive layer. The target layer is etched by plasma etching, while preventing active species of plasma from attacking the backside conductive layer.
    Type: Application
    Filed: July 12, 2024
    Publication date: November 7, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsin-Chang LEE, Pei-Cheng HSU, Ta-Cheng LIEN, Tzu Yi WANG
  • Publication number: 20240372273
    Abstract: This application provides an antenna system related to the field of terminal technologies. The system includes: a radio frequency chip, a controller, and a plurality of antennas, where the radio frequency chip is connected to the plurality of antennas: a first antenna, a second antenna, . . . , and an Nth antenna by a power amplifier and switches, where the first antenna is a to-be-improved antenna, an ith antenna is an auxiliary antenna; and the controller determines that a frequency band in which an antenna of the wireless communication device operates belongs to a preset to-be-improved frequency band of the first antenna; determines whether the ith antenna operates; and sets a load status of a radio frequency input end of the ith antenna and adjusts a switch or Tuner state on the ith antenna side when the ith antenna does not operate.
    Type: Application
    Filed: December 21, 2022
    Publication date: November 7, 2024
    Applicant: Honor Device Co., Ltd.
    Inventors: Yi WANG, Yuan XU, Ziyan ZHANG, Kunpeng WEI
  • Publication number: 20240373439
    Abstract: Embodiments of the disclosure provide a communication method, a communication apparatus, an electronic device and a computer-readable storage medium, and belong to the technical field of wireless communication. The method may comprise steps of: receiving configuration information, the configuration information being used for configuring at least two serving cells for transmitting uplink control information (UCI): receiving downlink control information (DCI) used for scheduling physical downlink shared channels (PDSCHs); determining, according to the DCI, physical uplink control channel (PUCCH) resources for transmitting UCI of PDSCHs, wherein, when PUCCH resources indicated by at least two DCIs are PUCCH resources of at least two serving cells overlapped in time domain, PUCCH resources indicated by a specified DCI in the at least two DCIs are determined as PUCCH resources for transmitting UCI of PDSCHs scheduled by the at least two DCIs.
    Type: Application
    Filed: July 22, 2022
    Publication date: November 7, 2024
    Inventors: Jingxing FU, Feifei SUN, Yi WANG
  • Publication number: 20240366470
    Abstract: Acupuncture needles may be used for piercing tissue with less trauma than may occur when employing larger gauge needles. However, because acupuncture needles are fabricated and packaged differently than are larger gauge needles, acupuncture needles may be less compatible with certain manufacturing processes. Needle assemblies compatible with manufacturing processes may comprise a continuous support material having a plurality of apertures defined therein, and a first injection molded coupler that surrounds a proximal portion of an acupuncture needle and connects the acupuncture needle to a first location upon the continuous support material, such that the acupuncture needle is held in a pre-determined orientation with respect to a longitudinal axis of the first injection molded coupler. The acupuncture needles in adjacent apertures may also be spaced apart substantially uniformly.
    Type: Application
    Filed: May 21, 2024
    Publication date: November 7, 2024
    Inventors: Hyun Cho, Yi Wang
  • Patent number: 12136519
    Abstract: A low inductance capacitor with annular distributed cores is provided, which relates to the technical field of capacitors, and includes a lower bus bar, capacitor cores and an upper bus bar. Currents accessed from lower connection terminals flow to a closed end of the lower bus bar along copper bar connecting plates, and flow to the upper bus bar through the capacitor cores, and then flow out from upper connection terminals to form a loop. And positions of the copper bar connecting plates are in one-to-one correspondence with positions of the capacitor cores, and flow directions of the currents are opposite.
    Type: Grant
    Filed: June 28, 2024
    Date of Patent: November 5, 2024
    Assignee: SHANGHAI UNIVERSITY OF ENGINEERING SCIENCE
    Inventors: Hui Guo, Yi Wang, Yansong Wang, Tao Yuan, Ningning Liu, Pei Sun, Xinhua Guo, Chi Xu, Shuang Huang, Xipei Ma, Chao Yang, Minghui Ma, Lifeng Ma
  • Patent number: 12134620
    Abstract: Compounds having activity as inhibitors of G12C mutant KRAS protein are provided. The compounds have the following structure (I): or a pharmaceutically acceptable salt, stereoisomer, isotopic form or prodrug thereof, wherein R1, L1, L2, L3, A1, A2, A3, A4, G1, G2, E, W, X, Y, Z, m, and n are as defined herein. Methods associated with preparation and use of such compounds, pharmaceutical compositions comprising such compounds and methods to modulate the activity of G12C mutant KRAS protein for treatment of disorders, such as cancer, are also provided.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: November 5, 2024
    Assignee: ARAXES PHARMA LLC
    Inventors: Liansheng Li, Jun Feng, Tao Wu, Yuan Liu, Yi Wang, Alana K. Borum, Pingda Ren, Yi Liu
  • Patent number: 12134557
    Abstract: A method includes bonding a supporting substrate to a semiconductor substrate of a wafer. A bonding layer is between, and is bonded to both of, the supporting substrate and the semiconductor substrate. A first etching process is performed to etch the supporting substrate and to form an opening, which penetrates through the supporting substrate and stops on the bonding layer. The opening has substantially straight edges. The bonding layer is then etched. A second etching process is performed to extend the opening down into the semiconductor substrate. A bottom portion of the opening is curved.
    Type: Grant
    Filed: May 18, 2021
    Date of Patent: November 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jhao-Yi Wang, Chin-Yu Ku, Wen-Hsiung Lu, Lung-Kai Mao, Ming-Da Cheng
  • Publication number: 20240358703
    Abstract: The present disclosure provides methods for treating hematological malignancies and Ewing's sarcoma using menin inhibitors. Compositions for use in these methods are also provided.
    Type: Application
    Filed: January 19, 2024
    Publication date: October 31, 2024
    Inventors: Francis BURROWS, Linda V. KESSLER, Liansheng LI, Pingda REN, Yi WANG, Tao WU, Jingchuan ZHANG
  • Publication number: 20240359044
    Abstract: A processing apparatus for removing dioxin in fly ash from domestic waste incineration by using a ball mill includes a grinder as well as a feeding body and a discharging body that are separately arranged at both ends of the grinder. In the present disclosure, an induction coil is electrified by arranging a heating body to generate an alternating magnetic field such that eddies generate on an inner wall of a grinding cylinder in the induction coil, the grinding cylinder is heated by the energy of these eddies, making a grinding ball thermally desorb and decompose a harmful component, that is, dioxin in the fly ash through a high temperature when grinding the fly ash from the domestic waste incineration since a temperature in the grinding cylinder reaches 300-500° C. during grinding.
    Type: Application
    Filed: April 9, 2024
    Publication date: October 31, 2024
    Applicant: Nanjing Institute of Environmental Sciences, MEE
    Inventors: Houhu ZHANG, Bing MA, Hao ZHOU, Xiaofei YAN, Guodong KANG, Yi WANG
  • Publication number: 20240364479
    Abstract: A user equipment (UE) configured for Hybrid Automatic Repeat Request Acknowledgement (HARQ-ACK) codebook determination in a fifth-generation (5G) new radio (NR) network may decode a downlink control information (DCI) format received from a generation Node B (gNB). When the DCI format triggers HARQ-ACK codebook retransmission, the UE may determine a HARQ-ACK codebook to be retransmitted based on a time-offset indicated in the DCI format. To determine the HARQ-ACK codebook to be retransmitted, the UE may determine an uplink (UL) slot that included an initial transmission of the HARQ-ACK codebook based on subtracting the time-offset from the DL slot that included the DCI. The UE may also encode a physical uplink control channel (PUCCH) to include the HARQ-ACK codebook determined to be retransmitted in a UL slot based on a slot offset.
    Type: Application
    Filed: September 28, 2022
    Publication date: October 31, 2024
    Inventors: Yi Wang, Debdeep Chatterjee, Fatemeh Hamidi-Sepehr, Toufiqul Islam, Salvatore Talarico, Sergey Panteleev
  • Publication number: 20240363430
    Abstract: A method for fabricating a semiconductor device includes the steps of first providing a substrate having an active region as the substrate includes a medium-voltage (MV) region and a low-voltage (LV) region, forming a first divot adjacent to one side of the active region, forming a second divot adjacent to another side of the active region, forming a first liner in the first divot and the second divot and on the substrate of the MV region and LV region, forming a second liner on the first liner, and then removing the second liner, the first liner, and the substrate on the LV region for forming a fin-shaped structure.
    Type: Application
    Filed: May 31, 2023
    Publication date: October 31, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Yi Wang, Wei-Che Chen, Hung-Chun Lee, Yun-Yang He, Wei-Hao Chang, Chang-Yih Chen, Kun-Szu Tseng, Yao-Jhan Wang, Ying-Hsien Chen