Abstract: A semiconductor device is disclosed. The semiconductor device includes: a substrate having a cell region defined thereon, in which the cell region includes a first edge and a second edge extending along a first direction; and a plurality of patterns on the substrate extending along the first direction, in which the patterns includes a plurality of first patterns and a plurality of second patterns, and one of the first patterns closest to the first edge and one of the second patterns closest to the second edge are different.

Abstract: A method for fabricating a touch display device is provided. The method includes: forming a sensor on a substrate, and forming a sensing signal line electrically connected to the sensor. The method of forming the sensor includes: forming a semiconductor layer including a semiconductor pattern of the sensor on the substrate, forming a gate insulation layer on the semiconductor layer, forming a first conductor layer on the gate insulation layer, forming an interlayered insulation layer on the gate insulation layer, performing an annealing process, removing the interlayered insulation layer on a gate predetermined region after the annealing process is performed, removing the first conductor layer on the gate predetermined region, forming a gate in the gate predetermined region, and forming a second conductor layer including a source and a drain of the sensor respectively electrically connected to the semiconductor pattern of the sensor.

Abstract: A pixel structure includes a first insulating layer, a second metal layer, a second insulating layer, and a third metal layer. The second metal layer is disposed on the first insulating layer, and the second metal layer includes at least one first data line, at least one source, and at least one first drain, wherein the first data line is electrically connected to the source. The second insulating layer is disposed on the second metal layer, the second insulating layer includes at least one opening that is disposed corresponding to the first drain, and the area of the opening is greater than the area of the first drain. The third metal layer includes at least one second drain that is electrically connected to the first drain, the second drain is disposed corresponding to the opening and disposed on the first drain.

Abstract: A hand pump for pumping out fluid from a reservoir, comprising a pump body, a faucet, a driving mechanism and a sealing arrangement. The pump body has at a side a connector defining a receptacle radially extending into a cavity of the pump body. The driving mechanism includes an axle inserted in the receptacle of the connector, a sealing sleeve mounted around the axle, a coupling cap axially secured to the sealing sleeve, and a L-shaped handle. The handle having at one end inserted through the coupling cap and the axle, and at the other hand extending outside the coupling cap. Operation of the handle in cyclically up and down motion drives the axle to rotate, which causes a piston in the cavity to move upward and downward so as to suck the fluid into the faucet. The sealing arrangement has at least three O-rings disposed among the parts of the driving mechanism to provide an effective seal between the driving mechanism and the pump body.

Abstract: A method for fabricating semiconductor device is disclosed. First, a substrate is provided, in which the substrate includes a first metal gate and a second metal gate thereon, a first hard mask on the first metal gate and a second hard mask on the second metal gate, and a first interlayer dielectric (ILD) layer around the first metal gate and the second metal gate. Next, the first hard mask and the second hard mask are used as mask to remove part of the first ILD layer for forming a recess, and a patterned metal layer is formed in the recess, in which the top surface of the patterned metal layer is lower than the top surfaces of the first hard mask and the second hard mask.

Abstract: The present invention provides a semiconductor structure, comprising a substrate, a gate structure, a source/drain region and at least a dislocation. The gate structure is disposed on the substrate. The source/drain region is disposed in the substrate at two sides of the gate structure. The dislocation is located in the source/drain region, and is asymmetrical relating to a middle axis of the source/drain region.

Abstract: In a busbar assembly, a first busbar subassembly includes a first transmission unit having a first transmission busbar with a uniform width, and a first output unit having a first output busbar with a uniform width. One of the first transmission unit and the first output unit has a bent structure with a bend line perpendicular to a line of a lengthwise direction thereof. A second busbar subassembly includes a second transmission unit having a second transmission busbar with a uniform width, and a second output unit having a second output busbar with a uniform width. One of the second transmission unit and the second output unit has a bent structure with a bend line perpendicular to a line of a lengthwise direction thereof.

Abstract: A method for fabricating a semiconductor device is disclosed. A substrate having a conductive region is provided. A metal layer is deposited on the conductive region. The metal layer reacts with the conductive region to form a first metal silicide layer. A TiN layer is deposited on the metal layer. A SiN layer is deposited on the TiN layer. An annealing process is performed to convert the first metal silicide layer into a second metal silicide layer.

Abstract: A method of forming a semiconductor structure is provided. A substrate having a memory region is provided. A plurality of fin structures are provided and each fin structure stretching along a first direction. A plurality of gate structures are formed, and each gate structure stretches along a second direction. Next, a dielectric layer is formed on the gate structures. A first patterned mask layer is formed, wherein the first patterned mask layer has a plurality of first trenches stretching along the second direction. A second patterned mask layer on the first patterned mask layer, wherein the second patterned mask layer comprises a plurality of first patterns stretching along the first direction. Subsequently, the dielectric layer is patterned by using the first patterned mask layer and the second patterned mask layer as a mask to form a plurality of contact vias. The contact holes are filled with a conductive layer.

Abstract: A semiconductor device is disclosed. The semiconductor device includes: a substrate, a gate structure on the substrate, a spacer adjacent to the gate structure, an epitaxial layer in the substrate adjacent to two sides of the spacer, and a dislocation embedded within the epitaxial layer. Preferably, the top surface of the epitaxial layer is lower than the top surface of the substrate, and the top surface of the epitaxial layer has a V-shape.

Abstract: A fin-shaped structure includes a substrate having a first fin-shaped structure located in a first area and a second fin-shaped structure located in a second area, wherein the second fin-shaped structure includes a ladder-shaped cross-sectional profile part. The present invention also provides two methods of forming this fin-shaped structure. In one case, a substrate having a first fin-shaped structure and a second fin-shaped structure is provided. A treatment process is performed to modify an external surface of the top of the second fin-shaped structure, thereby forming a modified part. A removing process is performed to remove the modified part through a high removing selectivity to the first fin-shaped structure and the second fin-shaped structure, and the modified part, thereby the second fin-shaped structure having a ladder-shaped cross-sectional profile part is formed.

Abstract: A pre-processing circuit is used for pre-processing a data-line voltage representative of a data output of a memory device. The pre-processing circuit includes a pre-charging circuit and a clamping circuit. The pre-charging circuit pre-charges a data line to adjust the data-line voltage at the data line that is coupled to the memory device. The clamping circuit clamps the data-line voltage to generate a clamped data-line voltage when the data-line voltage is pre-charged to a level that enables a clamping function of the clamping circuit, wherein the clamped data-line voltage is lower than a supply voltage of the pre-processing circuit. The clamping circuit includes a feedback circuit that feeds back a control voltage according to the data-line voltage at the data line, and further reduces its direct current (DC) leakage when the data-line voltage is clamped, wherein the clamping function of the clamping circuit is controlled by the control voltage.

Abstract: A fin structure for a semiconductor device, such as a FinFET structure, has first and second semiconductor layers and an air gap between the layers. The second semiconductor layer includes a recessed portion, the air gap is located in the recessed portion, and the recessed portion has an upwardly-opening acute angle in the range from about 10° to about 55°. The air gap may prevent current leakage. A FinFET device may be manufactured by first recessing and then epitaxially re-growing a source/drain fin, with the regrowth starting over a tubular air gap.

Abstract: A method for manufacturing semiconductor devices having metal gate includes follow steps. A substrate including a plurality of isolation structures is provided. A first nFET device and a second nFET device are formed on the substrate. The first nFET device includes a first gate trench and the second nFET includes a second gate trench. A third bottom barrier layer is formed in the first gate trench and a third p-work function metal layer is formed in the second gate trench, simultaneously. The third bottom barrier layer and the third p-work function metal layer include a same material. An n-work function metal layer is formed in the first gate trench and the second gate trench. The n-work function metal layer in the first gate trench directly contacts the third bottom barrier layer, and the n-work function metal layer in the second gate trench directly contacts the third p-work function metal layer.

Abstract: A semiconductor device includes a substrate including a plurality of transistor devices formed thereon, at least an epitaxial structure formed in between the transistor devices, and a tri-layered structure formed on the epitaxial structure. The epitaxial structure includes a first semiconductor material and a second semiconductor material, and a lattice constant of the second semiconductor material is larger than a lattice constant of the first semiconductor material. The tri-layered structure includes an undoped epitaxial layer, a metal-semiconductor compound layer, and a doped epitaxial layer sandwiched in between the undoped epitaxial layer and the metal-semiconductor compound layer. The undoped epitaxial layer and the doped epitaxial layer include at least the second semiconductor material.

Abstract: A method for forming an epitaxial layer on a substrate is disclosed. The method includes the steps of: providing a substrate into a chamber; injecting a precursor and a carrier gas to form the epitaxial layer on the substrate at a starting pressure; and pumping down the starting pressure to a second pressure according to a gradient during a cool down process in the chamber.

Abstract: A fin-shaped structure includes a substrate having a first fin-shaped structure located in a first area and a second fin-shaped structure located in a second area, wherein the second fin-shaped structure includes a ladder-shaped cross-sectional profile part. The present invention also provides two methods of forming this fin-shaped structure. In one case, a substrate having a first fin-shaped structure and a second fin-shaped structure is provided. A treatment process is performed to modify an external surface of the top of the second fin-shaped structure, thereby forming a modified part. A removing process is performed to remove the modified part through a high removing selectivity to the first fin-shaped structure and the second fin-shaped structure, and the modified part, thereby the second fin-shaped structure having a ladder-shaped cross-sectional profile part is formed.

Abstract: A fin structure for a semiconductor device, such as a FinFET structure, has first and second semiconductor layers and an air gap between the layers. The air gap may prevent current leakage. A FinFET device may be manufactured by first recessing and then epitaxially re-growing a source/drain fin, with the regrowth starting over a tubular air gap.

Abstract: A method of forming a semiconductor device includes following steps. Firstly, a gate structure is formed on a substrate, and two source/drain regions are formed. Then, a contact etching stop layer (CESL) is formed to cover the source/drain regions, and a first interlayer dielectric (ILD) layer is formed on the CESL. Next, a replace metal gate process is performed to form a metal gate and a capping layer on the metal gate, and a second ILD layer is formed on the first ILD layer. Following these, a first opening is formed in the second and first ILD layers to partially expose the CESL, and a second opening is formed in the second ILD to expose the capping layer. Finally, the CESL and the capping layer are simultaneously removed.

Abstract: A dynamic random access memory (DRAM) device includes a substrate, plural buried gates and plural bit lines. The buried gates are disposed in the substrate along a first trench extending along a first direction. The bit lines are disposed over the buried gates and extending along a second direction across the first direction. Each of the bit lines includes a multi-composition barrier layer, wherein the multi-composition barrier layer includes WSixNy with x and y being greater than 0 and the multi-composition barrier layer is silicon-rich at a bottom portion thereof and is nitrogen-rich at a top portion thereof.