Abstract: A method for fabricating semiconductor device includes the steps of: forming a first magnetic tunneling junction (MTJ) on a substrate; forming a first liner on the MTJ; forming a second liner on the first liner; forming an inter-metal dielectric (IMD) layer on the MTJ, and forming a metal interconnection in the IMD layer, the second liner, and the first liner to electrically connect the MTJ. Preferably, the first liner and the second liner are made of different materials.

Abstract: A magnetoresistive random access memory (MRAM), including a bottom electrode layer on a substrate, a magnetic tunnel junction stack on the bottom electrode layer, and a top electrode layer on the magnetic tunnel junction stack, wherein the material of top electrode layer is titanium nitride, and the percentage of nitrogen in the titanium nitride gradually decreases from the top surface of top electrode layer to the bottom surface of top electrode layer.

Abstract: A magnetoresistive random access memory (MRAM), including a bottom electrode layer on a substrate, a magnetic tunnel junction stack on the bottom electrode layer, and a top electrode layer on the magnetic tunnel junction stack, wherein the material of top electrode layer is titanium nitride, and the percentage of nitrogen in the titanium nitride gradually decreases from the top surface of top electrode layer to the bottom surface of top electrode layer.

Abstract: A method for fabricating semiconductor device includes the steps of: forming a magnetic tunneling junction (MTJ) on a substrate; forming a first inter-metal dielectric (IMD) layer around the MTJ; forming an etch stop layer on the first IMD layer; forming a second IMD layer on the etch stop layer; forming a patterned hard mask on the second IMD layer; performing a first etching process to form a contact hole in the second IMD layer for exposing the etch stop layer; performing a second etching process to remove the patterned hard mask; performing a third etching process to remove the etch stop layer and the first IMD layer for exposing the MTJ; and forming a metal interconnection in the contact hole.

Abstract: A magnetoresistive random access memory (MRAM), including a bottom electrode layer on a substrate, a magnetic tunnel junction stack on the bottom electrode layer, and a top electrode layer on the magnetic tunnel junction stack, wherein the material of top electrode layer is titanium nitride, and the percentage of nitrogen in the titanium nitride gradually decreases from the top surface of top electrode layer to the bottom surface of top electrode layer.

Abstract: A semiconductor device includes: a magnetic tunneling junction (MTJ) on a substrate; a first inter-metal dielectric (IMD) layer around the MTJ; a metal interconnection on and directly contacting the MTJ; a second IMD layer on the first IMD layer and around the metal interconnection; and a metal oxide layer on the second IMD layer and around the metal interconnection.

Abstract: A method for fabricating semiconductor device includes the steps of: forming a first magnetic tunneling junction (MTJ) on a substrate; forming a first liner on the MTJ; forming a second liner on the first liner; forming an inter-metal dielectric (IMD) layer on the MTJ, and forming a metal interconnection in the IMD layer, the second liner, and the first liner to electrically connect the MTJ. Preferably, the first liner and the second liner are made of different materials.

Abstract: A semiconductor device includes: a magnetic tunneling junction (MTJ) on a substrate; a first inter-metal dielectric (IMD) layer around the MTJ; a metal interconnection on and directly contacting the MTJ; a second IMD layer on the first IMD layer and around the metal interconnection; and a metal oxide layer on the second IMD layer and around the metal interconnection.

Abstract: A magneto-resistive random access memory (MRAM) cell includes a substrate having a dielectric layer disposed thereon, a conductive via disposed in the dielectric layer, and a cylindrical stack disposed on the conductive via. The cylindrical stack includes a bottom electrode, a magnetic tunneling junction (MTJ) layer on the bottom electrode, and a top electrode on the MTJ layer. A spacer layer is disposed on a sidewall of the cylindrical stack. The top electrode protrudes from a top surface of the spacer layer.

Abstract: A magneto-resistive random access memory (MRAM) cell includes a substrate having a dielectric layer disposed thereon, a conductive via disposed in the dielectric layer, and a cylindrical stack disposed on the conductive via. The cylindrical stack includes a bottom electrode, a magnetic tunneling junction (MTJ) layer on the bottom electrode, and a top electrode on the MTJ layer. A spacer layer is disposed on a sidewall of the cylindrical stack. The top electrode protrudes from a top surface of the spacer layer.

Abstract: Systems, methods, devices, and computer readable media related to fraud detection. Fraud detection is achieved using a flexible scripting language and syntax that simplifies the generation of fraud detection rules. The rules are structured as conditional IF-THEN statements that include data objects referred to as Anchors and Add-Ons. The Anchors and Add-Ons used to generate the rules also correspond to a distinct data path for the retrieval data from any of a variety of data sources. The retrieval of data from the various data sources is optimized based on data dependencies within the rules. By knowing the data dependencies of each rule and utilizing parallelization of rule execution, the retrievals of data from the data sources is achieved efficiently so the rules can be executed quickly.

Abstract: Systems, methods, devices, and computer readable media related to fraud detection. Fraud detection is achieved using a flexible scripting language and syntax that simplifies the generation of fraud detection rules. The rules are structured as conditional IF-THEN statements that include data objects referred to as Anchors and Add-Ons. The Anchors and Add-Ons used to generate the rules also correspond to a distinct data path for the retrieval data from any of a variety of data sources. The generated rules with distinct data paths are then converted using a transpiler from the scripting language into native language source code (e.g., PHP, Java, etc.) for deployment in a particular environment. The rules are then executed in real-time in the environment to detect potential fraudulent activity.

Abstract: A backlight module and a display apparatus are provided. The backlight module comprises a back plate, a light source and at least one light-permeable element. The light source disposed on the back plate has at least one light emitting element. The light-permeable element covers the light emitting element, which comprises a light input surface and a light output surface disposed opposite the light input surface. The light input surface faces the light emitting element and has an apex away from the light emitting element. When viewed from a cross section crossing the apex and perpendicular to the back plate, the light input surface has a first curve and a second curve connected to the first curve. A connection point between the first curve and the second curve is an inflection point.

Abstract: A light emitting device comprising a light emitting element and a secondary optical element is disclosed. The secondary optical element has a light output surface, a light incident surface and a bottom surface. The bottom surface is extended from the light incident surface and connected to the light output surface. The light output surface comprises a planar portion, and a convex curved surface portion. The planar portion is in the center of the light output surface, and the convex curved surface portion is around the planar portion. The light incident surface is a concave curved surface comprising a first curved surface and a second curved surface, which form a concave opening for receiving the light emitting element. The first curved surface is in the center of the light incident surface, and the second curved surface is connected to the bottom surface.

Abstract: A multi-antenna module comprises a ground plane, a primary conductor, a secondary conductor and a plurality of coupling conductors, wherein the framework of the parallel primary radiation arm and secondary radiation arm can infinitely expand the number of antenna units in the same antenna structure. The capacitive coupling effect of parallel radiation arms and the inductance of the radiation arms themselves can effectively reduce the signal interference between antennae, whereby a plurality of antennae can be integrated to achieve antenna miniaturization. The primary conductor, the secondary conductor and the coupling conductors are all connected to the same ground plane, whereby the layout space is reduced, and the multi-antenna module is easy-to-assemble for various electronic devices.

Abstract: The present invention discloses a multi-antenna integration module, which comprises a first antenna, a second antenna and a common unit. The first antenna further comprises a first feeder cable, a first feeder member, a coupling unit, which has a first and second coupling members, and an extension conductor. The second antenna further comprises a second feeder cable, a radiation conductor and a coupling conductor. The common unit further comprises a common conductor which has a first and second conductor, a common short-circuit member and a common ground member. In the present invention, the design of the common unit integrates the radiation conductors, short-circuit members and ground members of different antenna systems into a single structure, whereby the isolation effect is promoted, and the signal interference among different antennae is decreased, and the space occupied by the antenna layout is reduced.

Abstract: An antenna module is provided. The antenna module comprises a first radiation conductor, a second radiation conductor, a short-circuit element (s/c element), a ground plane, a feed-in cable and a spurious radiation conductor. One terminal of the second radiation conductor is near the first radiation conductor with a gap. One terminal of the s/c element is connected to the second radiation conductor and the other side of the s/c element is connected to the ground plane. The feed-in cable comprises a centre conductor and an external conductor, wherein the centre conductor is connected to the first radiation conductor and the external conductor is connected to the ground plane. The spurious radiation conductor is connected to the second radiation conductor. The second radiation conductor comprises a spurious radiation plate, a first radiation piece and a second radiation piece within the two sides of the second radiation conductor.

Abstract: An annular antenna is composed of a ground plane, a short-circuit conductor, a radiation conductor and a parasitic conductor. The radiation conductor has a connection member and a feeder member. Two ends of the short-circuit member are respectively connected to the ground plane and connection member. The feeder member is close to the ground plane and has a notch. The short-circuit conductor and radiation conductor run along the ground plane defining an in-annular area. The radiation conductor has a first coupling edge beside the in-annular area. The parasitic conductor is inside the in-annular area with one end coupled to the ground plane and a second coupling edge along the first coupling edge. The first and second coupling edges have a gap therebetween. The radiation and parasitic conductors respectively excite low-frequency and high-frequency resonant modes. The annular antenna covers multiple frequency bands, has UWB features and simplified structure and favors mass-production.

Abstract: A multi-antenna module comprises a ground plane, a primary conductor, a secondary conductor and a plurality of coupling conductors, wherein the framework of the parallel primary radiation arm and secondary radiation arm can infinitely expand the number of antenna units in the same antenna structure. The capacitive coupling effect of parallel radiation arms and the inductance of the radiation arms themselves can effectively reduce the signal interference between antennae, whereby a plurality of antennae can be integrated to achieve antenna miniaturization. The primary conductor, the secondary conductor and the coupling conductors are all connected to the same ground plane, whereby the layout space is reduced, and the multi-antenna module is easy-to-assemble for various electronic devices.

Abstract: A coupling antenna has a ground plane, a main radiating assembly and a secondary radiating assembly. The main radiating assembly is mounted on the ground plane and has a substrate, a feeding-and-coupling assembly and a shorting member. The feeding-and-coupling assembly has a feeding member, a coupling member and an extension member. The second radiating assembly is mounted on the ground plane, is connected to the main radiating assembly and has a first radiating patch and a second radiating patch. With the extension member and the first and second radiating patches, operating bandwidth of the coupling antenna is improved.