Abstract: A method and related system operations includes, determining, for each respective frame of a frame sequence, a respective bounding box that surrounds a respective sub-image of the respective frame, determining a respective string and respective confidence values associated with the respective string based on the respective sub-image, updating the tracklet to comprise the respective bounding box based on the respective string and at least one string generated by the object recognition model for a previous frame, and updating a voting table by adding the respective confidence values to the voting table. The method also includes generating an aggregated string based on the voting table by, for a set of positions of the aggregated string, determining a character associated with a maximum confidence value indicated by the voting table and associating the aggregated string with the tracklet in a data structure.

Abstract: This application provides example electronic devices. One example electronic device includes a first display, a first sound-emitting area, a second sound-emitting area, and a second display. The first display includes a first display area and a second display area, and when the electronic device is in folded state, the first display area of the first display is opposite to the second display area of the first display. The first display area of the first display and the second display are stacked. The first display is disposed on a first surface of the electronic device, the second display is disposed on a second surface of the electronic device, the first surface is connected to the second surface through a bezel, the first sound-emitting area is provided on the first surface and/or the bezel, and the second sound-emitting area is provided on the second surface and/or the bezel.

Abstract: Embodiments described herein generally relate to semiconductor device fabrication. More specifically, embodiments of the present disclosure relate to methods of removing metal oxides during semiconductor device manufacturing. The method includes performing a first soak process on the semiconductor device structure, forming a metal fill material in at least one feature, and performing a second soak process on the semiconductor device structure. The semiconductor device structure includes at least one feature formed in a dielectric layer of the semiconductor device structure. The first soak process includes flowing a first precursor gas over the at least one feature. The metal fill material is formed by partially filling the at least one feature where a gap region forms between a sidewall of the at least one feature and the metal fill material. The second soak process includes flowing a second precursor gas over the at least one feature and the metal fill material.

Abstract: A method and apparatus for tungsten gap-fill in semiconductor devices are provided. The method includes performing a gradient oxidation process to oxidize exposed portions of a liner layer, wherein the gradient oxidation process preferentially oxidizes an overhang portion of the liner layer, which obstructs or blocks top openings of one or more features formed within a field region of a substrate. The method further includes performing an etchback process to remove or reduce the oxidized overhang portion of the liner layer, exposing the liner layer to a chemical vapor transport (CVT) process to remove metal oxide remaining from the gradient oxidation process and the etchback process, and performing a tungsten gap-fill process to fill or partially fill the one or more features.

Abstract: An adjuvant composition is shown and described herein. The adjuvant composition is suitable for use in conjunction with agrochemical compositions and for application to agricultural substrates. The adjuvant composition comprises: (i) an unsaturated oil and/or a transesterified unsaturated oil; (ii) a trisiloxane alkoxylate surfactant, (iii) a vinyl lactam polymer and optionally (iv) an alcohol. The compositions can function to enhance one or more properties such as, for example, rainfastness spreadability, emulsion stability, and/or reduction in the formation of driftable fines.

Abstract: According to one aspect, spatial action localization in the future (SALF) may include feeding a frame from a time step of a video clip through an encoder to generate a latent feature, feeding the latent feature and one or more latent features from one or more previous time steps of the video clip through a future feature predictor to generate a cumulative information for the time step, feeding the cumulative information through a decoder to generate a predicted action area and a predicted action classification associated with the predicted action area, and implementing an action based on the predicted action area and the predicted action classification. The encoder may include a 2D convolutional neural network (CNN) and/or a 3D-CNN. The future feature predictor may be based on an ordinary differential equation (ODE) function.

Abstract: Embodiments of the disclosure include a method of depositing a gap-fill material on a semiconductor substrate, comprising: forming a passivation layer on a surface of a contact structure by introducing a hydrogen gas and an oxygen gas and/or water from a remote plasma source to a processing chamber, and depositing a metal gap-fill material over a portion of the passivation layer to fill the feature formed in the surface of the semiconductor substrate. The contact structure includes a feature formed in a surface of the semiconductor substrate. The feature comprises an opening that is defined by a substrate, a lower dielectric material disposed over the substrate, and an upper dielectric material disposed over the lower dielectric material, and the passivation layer is formed over the substrate, the lower dielectric material, and the upper dielectric material.

Abstract: Embodiments described herein generally relate to methods for forming low resistivity contacts for semiconductor device formation. More particularly, embodiments provide methods for selective etching of materials used to form a portion of an electrical contact formed on semiconductor substrates. In some embodiments, a method includes providing a substrate including a gate material and an insulating material disposed at least partially around the gate material, the insulating material including a high-k dielectric. The substrate is exposed to a plasma including a gas that includes one or more of H2, Ar, Xe, Ne, and Kr. The method further includes etching the high-k dielectric by providing a chlorine-containing precursor while heating the substrate to a temperature of about 450° C. or less.

Abstract: Methods of manufacturing and processing semiconductor devices (i.e., electronic devices) are described. Embodiments of the disclosure advantageously provide methods to reduce the resistance of the work function layer of an electronic device, as well as using a low resistivity metal for filling the gate.

Abstract: A foldable display device includes a first frame, a second frame, a rotating shaft assembly, a flexible heat sink and a flexible circuit board. The flexible heat sink and the flexible circuit board passes through the rotating shaft assembly, and the rotating shaft assembly includes a shaft seat, a door plate, a first support plate, and a second support plate. Two opposite ends of the flexible heat sink are connected to the first frame and the second frame, and two opposite ends of a part of the flexible heat sink in the rotating shaft assembly are respectively fastened to a first fastening surface that is of the first support plate and that faces the shaft seat and a second fastening surface that is of the second support plate and that faces the shaft seat.

Abstract: A method is performed by a wireless client configured to communicate with wireless infrastructure equipment. The method comprises: upon connecting to the wireless infrastructure equipment without authenticating to the wireless infrastructure equipment, receiving from the wireless infrastructure equipment an individual probe protection key (IPPK) unique to the wireless client; storing the IPPK; sending to the wireless infrastructure equipment a probe request; receiving from the wireless infrastructure equipment a probe response that includes a message integrity check; validating the message integrity check using the IPPK; and accepting or rejecting the probe response depending on a result of validating.

Abstract: A furniture compression transportation and rapid assembly method based on a compressible support element, comprising the following steps: S1. place a support element with compression and rebound capabilities into a central cavity of a furniture base carrier; S2. vacuum-compress and then roll-pack to form a compressed and rolled state; S3. transport to the user's site; S4. after receiving the product, the user removes the support element; S5. place a functional component into the central cavity of the furniture base carrier after the support element is removed. The invention minimizes volume and ensures structural protection during the transportation phase by placing the compressible and resilient support element into the central cavity of the furniture base carrier, followed by vacuum compression and roll-packing. Once delivered, the user only needs to remove the support element and replace it with a functional component to form the finished furniture product.

Abstract: Provided is a bionic jumping and flying robot based on a jumping-flapping wing composite structure including a leg-foot type jumping module, a counterbeat flight module, a driving body and a tail wing module. The leg-foot type jumping module is connected to the driving body and configured for completing a jumping function. The counterbeat flight module is connected to the driving body and configured for providing flight lift and thrust. The tail wing module is connected to the driving body, and an installation angle of the tail wing module is adjustable.

Abstract: A method for online monitoring of gel strength changes during surimi thermal processing based on hyperspectral imaging includes following steps: raw hyperspectral data of surimi samples during a heating process is acquired, and gel strength of the surimi samples is measured; the raw hyperspectral data is preprocessed; a dataset is constructed based on preprocessed raw hyperspectral data and the gel strength; a partial least squares (PLS) model is trained and validated using the dataset to obtain a gel strength prediction model; and the gel strength prediction model is utilized to monitor changes in gel strength during surimi thermal processing.

Abstract: The general problem of pattern change discovery between high-dimensional data sets is addressed by considering the notion of the principal angles between the subspaces is introduced to measure the subspace difference between two high-dimensional data sets. Current methods either mainly focus on magnitude change detection of low-dimensional data sets or are under supervised frameworks. Principal angles bear a property to isolate subspace change from the magnitude change. To address the challenge of directly computing the principal angles, matrix factorization is used to serve as a statistical framework and develop the principle of the dominant subspace mapping to transfer the principal angle based detection to a matrix factorization problem. Matrix factorization can be naturally embedded into the likelihood ratio test based on the linear models. The method may be unsupervised and addresses the statistical significance of the pattern changes between high-dimensional data sets.

Abstract: Precursor delivery systems that can achieve increased dose profile control compared to current precursor delivery systems are described. Processing methods that include using the precursor delivery system to deposit a film are also described. The precursor delivery system comprises a first precursor outlet line and a second precursor outlet line, each of the first precursor outlet line and the second precursor outlet line configured to allow the precursor to be delivered from a pressure-controlled precursor reservoir to a processing chamber, wherein the first precursor outlet line is configured to deliver the precursor at a first flow rate and the second precursor outlet line is configured to deliver the precursor at a second flow rate.

Abstract: Robotic systems with variable gripping mechanisms, and related systems and methods are disclosed herein. In some embodiments, the robotic system includes a robotic arm and an object-gripping assembly coupled to the robotic arm. The object-gripping assembly can include a main body coupled to the robotic arm through an external connector on an upper surface of the main body and a vacuum operated gripping component coupled to a lower surface of the main body. The object-gripping assembly can also include a variable-width gripping component coupled to the main body. The variable-width gripping component is movable between a fully folded state, a plurality of extended states, and a clamping state to grip a variety of target objects of varying shapes, sizes, weights, and orientations.

Abstract: A computer system obtains an image of a scene captured by a camera and identifies a two-dimensional (2D) pose of the person in the image. The 2D pose includes a plurality of 2D joint positions in the image. The 2D pose is converted to a three-dimensional (3D) pose of the person including a plurality of 3D joint positions. The computer system determines a rotation angle of each joint relative to a T-pose of the person based on the plurality of 3D joint positions. The rotation angle of each joint is applied to a skeleton template of the avatar. The computer system renders the skeleton template of the avatar having the rotation angle for each joint.