Abstract: The technology relates to nonvolatile memory with a modified channel region interface, such as a raised source and drain or a recessed channel region.

Abstract: A vertical nonvolatile memory cell with a charge storage structure includes a charge control structure with three nodes. Example embodiments include the individual memory cell, an array of such memory cells, methods of operating the memory cell or array of memory cells, and methods of manufacturing the same.

Abstract: A gated diode nonvolatile memory cell with a charge storage structure includes a diode structure with an additional gate terminal and a diffusion barrier structure between the diode nodes. Example embodiments include the individual memory cell, an array of such memory cells, methods of operating the memory cell or array of memory cells, and methods of manufacturing the same.

Abstract: The technology relates to nonvolatile memory with a modified channel region interface, such as a raised source and drain or a recessed channel region.

Abstract: The technology relates to nonvolatile memory with a modified channel region interface, such as a raised source and drain or a recessed channel region.

Abstract: The technology relates to nonvolatile memory with a modified channel region such as a raised source and drain or a recessed channel region.

Abstract: The technology relates to nonvolatile memory with a modified channel region such as a raised source and drain or a recessed channel region.

Abstract: A gated diode nonvolatile memory cell with a charge storage structure includes a diode structure with an additional gate terminal. Example embodiments include the individual memory cell, an array of such memory cells, methods of operating the memory cell or array of memory cells, and methods of manufacturing the same.

Abstract: A gated diode nonvolatile memory cell with a charge storage structure includes a diode structure with an additional gate terminal. Example embodiments include the individual memory cell, an array of such memory cells, methods of operating the memory cell or array of memory cells, and methods of manufacturing the same.

Abstract: A method of reducing gate disturb in a charge-trapping layer memory cell by applying different Vpass voltages to different sides of a selected wordline. A higher Vpass voltage is used to pass higher source/drain voltage and a lower Vpass voltage is used to pass a lower source/drain voltage. By controlling the Vpass voltages on different sides of a selected wordline, it is possible to reduce a vertical field that is established in a gate region when the Vpass voltages are applied. A reduced vertical field results in suppressed gate disturb. The method also includes a novel bit-line biasing scheme that may further reduce the vertical field and thereby may further suppress gate disturb, particularly in an array of memory cells.

Abstract: A gated diode nonvolatile memory cell with a charge storage structure includes a diode structure with an additional gate terminal. Example embodiments include the individual memory cell, an array of such memory cells, methods of operating the memory cell or array of memory cells, and methods of manufacturing the same.

Abstract: Charge trapping memory cells are protected from over-erasing in response to an erase command. For example, in response to an erase command, one bias arrangement is applied to program charge trapping memory cells, and another bias arrangement is applied to erase the charge trapping memory cells, such that the charge trapping memory cells have a higher net electron charge in the erased state than in the programmed state. In another example, an integrated circuit with an array of charge trapping memory cells has logic which responds to an erase command by applying similar bias arrangements to the charge trapping memory cells. In a further example, such an integrated circuit is manufactured.

Abstract: Programming nonvolatile memory cells is affected by the program disturb effect which causes data accuracy issues with nonvolatile memory. Rather than masking the voltage conditions that cause the program disturb effect, voltages are applied to neighboring nonvolatile memory cells, which takes advantage of the program disturb effect to program multiple cells quickly.

Abstract: One embodiment of the present invention provides a system having a nonvolatile memory comprising a p type semiconductor substrate, an oxide layer over the p type semiconductor substrate, a nitride layer over the oxide layer, an additional oxide layer over the nitride layer, a gate over the additional oxide layer, two N+ junctions in the p type semiconductor layer, a source and drain respectively formed in the two N+ junctions, a first bit and a second bit in the nonvolatile memory, and accordingly at least two states of operation (i.e., erase and program) therefor. That is, one bit in the nonvolatile memory can either be in an erase state or program state. For erasing a bit, electrons are injected at the gate of the nonvolatile memory. For programming a bit, electric holes are injected or electrons are reduced for that bit.

Abstract: One embodiment of the present invention provides a system having a nonvolatile memory comprising a p type semiconductor substrate, an oxide layer over the p type semiconductor substrate, a nitride layer over the oxide layer, an additional oxide layer over the nitride layer, a gate over the additional oxide layer, two N+ junctions in the p type semiconductor layer, a source and drain respectively formed in the two N+ junctions, a first bit and a second bit in the nonvolatile memory, and accordingly at least two states of operation (i.e., erase and program) therefor. That is, one bit in the nonvolatile memory can either be in an erase state or program state. For erasing a bit, electrons are injected at the gate of the nonvolatile memory. For programming a bit, electric holes are injected or electrons are reduced for that bit.