Patents by Inventor Yiduo Zhang
Yiduo Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11474313Abstract: An optical fiber heat exchanger includes an outer body and an inner body inserted into the outer body. The inner body includes a plurality of guide walls to guide a cooling liquid through the optical fiber heat exchanger to exchange heat from an optical fiber inserted in the optical fiber heat exchanger, a first set of parallel straight channels, extending along an inlet portion of the inner body, formed by a first subset of the plurality of guide walls, a set of U-shaped channels, extending through a transition section of the inner body, formed by a second subset of the plurality of guide walls, and a second set of parallel straight channels, extending along an outlet portion of the inner body, formed by a third subset of the plurality of guide walls.Type: GrantFiled: March 23, 2021Date of Patent: October 18, 2022Assignee: Lumentum Operations LLCInventors: Yiduo Zhang, Gilberto Madrid, Titus Whitehead, Martin H. Muendel
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Patent number: 11237338Abstract: An optical device may comprise an optical element holder that holds an optical element in an internal portion of the optical element holder, wherein the optical element holder includes a protruding feature with a contact portion that holds the optical element in the internal portion of the optical element holder. The optical device may additionally comprise the optical element, wherein an edge of the optical element includes a chamfered portion that contacts the contact portion of the protruding feature of the optical element holder to allow the protruding feature of the optical element holder to hold the optical element in the internal portion of the optical element holder.Type: GrantFiled: May 27, 2020Date of Patent: February 1, 2022Assignee: Lumentum Operations LLCInventors: Yiduo Zhang, Bryan Paolini, Michael Lovelady, Titus Whitehead, Gilberto Madrid
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Publication number: 20210208349Abstract: An optical fiber heat exchanger includes an outer body and an inner body inserted into the outer body. The inner body includes a plurality of guide walls to guide a cooling liquid through the optical fiber heat exchanger to exchange heat from an optical fiber inserted in the optical fiber heat exchanger, a first set of parallel straight channels, extending along an inlet portion of the inner body, formed by a first subset of the plurality of guide walls, a set of U-shaped channels, extending through a transition section of the inner body, formed by a second subset of the plurality of guide walls, and a second set of parallel straight channels, extending along an outlet portion of the inner body, formed by a third subset of the plurality of guide walls.Type: ApplicationFiled: March 23, 2021Publication date: July 8, 2021Inventors: Yiduo ZHANG, Gilberto MADRID, Titus WHITEHEAD, Martin H. MUENDEL
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Publication number: 20210199896Abstract: An optical device may comprise an optical element holder that holds an optical element in an internal portion of the optical element holder, wherein the optical element holder includes a protruding feature with a contact portion that holds the optical element in the internal portion of the optical element holder. The optical device may additionally comprise the optical element, wherein an edge of the optical element includes a chamfered portion that contacts the contact portion of the protruding feature of the optical element holder to allow the protruding feature of the optical element holder to hold the optical element in the internal portion of the optical element holder.Type: ApplicationFiled: May 27, 2020Publication date: July 1, 2021Inventors: Yiduo ZHANG, Bryan PAOLINI, Michael LOVELADY, Titus WHITEHEAD, Gilberto MADRID
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Patent number: 10962727Abstract: An optical fiber heat exchanger includes an outer body and an inner body inserted into the outer body. The inner body includes a plurality of guide walls to guide a cooling liquid through the optical fiber heat exchanger to exchange heat from an optical fiber inserted in the optical fiber heat exchanger, a first set of parallel straight channels, extending along an inlet portion of the inner body, formed by a first subset of the plurality of guide walls, a set of U-shaped channels, extending through a transition section of the inner body, formed by a second subset of the plurality of guide walls, and a second set of parallel straight channels, extending along an outlet portion of the inner body, formed by a third subset of the plurality of guide walls.Type: GrantFiled: November 19, 2019Date of Patent: March 30, 2021Assignee: Lumentum Operations LLCInventors: Yiduo Zhang, Gilberto Madrid, Titus Whitehead, Martin H. Muendel
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Publication number: 20200326493Abstract: An optical fiber heat exchanger includes an outer body and an inner body inserted into the outer body. The inner body includes a plurality of guide walls to guide a cooling liquid through the optical fiber heat exchanger to exchange heat from an optical fiber inserted in the optical fiber heat exchanger, a first set of parallel straight channels, extending along an inlet portion of the inner body, formed by a first subset of the plurality of guide walls, a set of U-shaped channels, extending through a transition section of the inner body, formed by a second subset of the plurality of guide walls, and a second set of parallel straight channels, extending along an outlet portion of the inner body, formed by a third subset of the plurality of guide walls.Type: ApplicationFiled: November 19, 2019Publication date: October 15, 2020Inventors: Yiduo ZHANG, Gilberto MADRID, Titus WHITEHEAD, Martin H. MUENDEL
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Patent number: 9460757Abstract: A flexible printed circuit (FPC) may have reduced-tolerance electrical connection pads that comprise a connection portion and an adjacent window portion, where the position of a component that is mechanically and electrically connected to the FPC is limited by the geometry of the connection portion of the respective connection pads. The window portion includes an area void of conductive material and bounded by the connection portion on one side and may be bounded by peripheral portions on the other sides, where the peripheral portions are significantly narrower than the connection portion. A portion of the peripheral portions extending from the connection portion may be tucked under a portion of the FPC cover layer to prevent peeling of the peripheral portions.Type: GrantFiled: November 4, 2013Date of Patent: October 4, 2016Assignee: HGST Netherlands B.V.Inventors: Edgar Dennis Rothenberg, Yiduo Zhang
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Publication number: 20150124352Abstract: A flexible printed circuit (FPC) may have reduced-tolerance electrical connection pads that comprise a connection portion and an adjacent window portion, where the position of a component that is mechanically and electrically connected to the FPC is limited by the geometry of the connection portion of the respective connection pads. The window portion includes an area void of conductive material and bounded by the connection portion on one side and may be bounded by peripheral portions on the other sides, where the peripheral portions are significantly narrower than the connection portion. A portion of the peripheral portions extending from the connection portion may be tucked under a portion of the FPC cover layer to prevent peeling of the peripheral portions.Type: ApplicationFiled: November 4, 2013Publication date: May 7, 2015Applicant: HGST Netherlands B.V.Inventors: Edgar Dennis Rothenberg, Yiduo Zhang
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Patent number: 8675311Abstract: An interleaved conductor structure for electrically connecting the read/write electronics to a read/write head in a hard disk drive is provided. The interleaved conductor structure may allow for an increased characteristic-impedance range, greater interference shielding and a reduction of signal loss that is contributed by a lossy conductive substrate. The electrical traces may have different widths, be offset, or even wrap around each other at the via connections.Type: GrantFiled: December 22, 2010Date of Patent: March 18, 2014Assignee: HGST Netherlands B.V.Inventors: John T. Contreras, Nobumasa Nishiyama, Edgar D. Rothenberg, Rehan A. Zakai, Yiduo Zhang
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Patent number: 8598460Abstract: An interleaved conductor structure for electrically connecting the read/write electronics to a read/write head in a hard disk drive is provided. The interleaved conductor structure may allow for an increased characteristic-impedance range, greater interference shielding and a reduction of signal loss that is contributed by a lossy conductive substrate. The electrical traces may have different widths, be offset, or even wrap around each other at the via connections.Type: GrantFiled: December 22, 2010Date of Patent: December 3, 2013Assignee: HGST Netherlands B.V.Inventors: John T. Contreras, Nobumasa Nishiyama, Edgar D. Rothenberg, Rehan A. Zakai, Yiduo Zhang
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Patent number: 8520341Abstract: Swaging a suspension base plate to an actuator arm for a hard disk drive. A portion of material adjacent to a hole in the actuator arm is removed to create an opening to receive material. A flange of the suspension base plate is inserted into the hole in the actuator arm. The suspension base plate is swaged to the actuator arm, wherein the swaging causes material from the suspension base plate to flow into the opening.Type: GrantFiled: December 2, 2009Date of Patent: August 27, 2013Assignee: HGST Netherlands B.V.Inventors: Gregory Joseph Arnone, Zhong-Qing Gong, David John Loader, Yanchu Xu, Yiduo Zhang
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Publication number: 20130148231Abstract: A magnetic disk drive system that has a suspension assembly that includes a slider having a heating element and a suspension configured with a protective structure that protects the heating element. The heating element of the slider can extend through the suspension to extend from the suspension assembly from a side that is opposite the slider. The protective structure is configured to protect the heating element and to prevent the heating element from contacting the heating element of an adjacent suspension during an event such as a physical shock to the disk drive system.Type: ApplicationFiled: December 9, 2011Publication date: June 13, 2013Applicant: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Fu-Ying Huang, Lidu Huang, Yiduo Zhang
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Patent number: 8276256Abstract: A method of assembling a head stack assembly (HSA) includes securing a flex cable to an actuator including an actuator arm having a side slot with a slot end. A first head gimbal assembly (HGA) is attached to the actuator arm. The first HGA includes a first laminated flexure having a first flexure tail with a first raised region that includes an out-of-plane bend. The first raised region is squeezed while inserting the first flexure tail partially within the side slot with the first raised region adjacent the slot end. The first raised region is allowed to expand into contact with the side slot adjacent the slot end. The first flexure tail is electrically connected to the flex cable.Type: GrantFiled: October 20, 2011Date of Patent: October 2, 2012Assignee: Western Digital Technologies, Inc.Inventors: Yiduo Zhang, Tzong-Shii Pan, Yih-Jen D. Chen
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Patent number: 8274760Abstract: Disclosed herein are embodiments directed to a head gimbal assembly including a novel suspension assembly that includes a flexure tail with a first plurality of apertures in its structural layer. Each of the first plurality of apertures underlies a first trace but not a second trace. Each of a second plurality of apertures in the structural layer underlies a second trace but not the first trace. Each of the first plurality of apertures includes a corresponding region of maximum width, and each of the second plurality of apertures includes a corresponding region of maximum width, as measured in the width direction. None of the corresponding regions of maximum width of the first plurality of apertures is disposed in an overlapping position along the long axis as any of the corresponding regions of maximum width of the second plurality of apertures.Type: GrantFiled: May 15, 2012Date of Patent: September 25, 2012Assignee: Western Digital Technologies, Inc.Inventors: Yiduo Zhang, Tzong-Shii Pan, Yih-Jen D. Chen, William D. Huber
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Publication number: 20120160548Abstract: An interleaved conductor structure for electrically connecting the read/write electronics to a read/write head in a hard disk drive is provided. The interleaved conductor structure may allow for an increased characteristic-impedance range, greater interference shielding and a reduction of signal loss that is contributed by a lossy conductive substrate. The electrical traces may have different widths, be offset, or even wrap around each other at the via connections.Type: ApplicationFiled: December 22, 2010Publication date: June 28, 2012Inventors: JOHN T. CONTRERAS, Nobumasa Nishiyama, Edgar D. Rothenberg, Rehan A. Zakai, Yiduo Zhang
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Publication number: 20120160538Abstract: An interleaved conductor structure for electrically connecting the read/write electronics to a read/write head in a hard disk drive is provided. The interleaved conductor structure may allow for an increased characteristic-impedance range, greater interference shielding and a reduction of signal loss that is contributed by a lossy conductive substrate. The electrical traces may have different widths, be offset, or even wrap around each other at the via connections.Type: ApplicationFiled: December 22, 2010Publication date: June 28, 2012Inventors: John T. Contreras, Nobumasa Nishiyama, Edgar D. Rothenberg, Rehan A. Zakai, Yiduo Zhang
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Publication number: 20120162825Abstract: An interleaved conductor structure for electrically connecting the read/write electronics to a read/write head in a hard disk drive is provided. The interleaved conductor structure may allow for an increased characteristic-impedance range, greater interference shielding and a reduction of signal loss that is contributed by a lossy conductive substrate. The electrical traces may have different widths, be offset, or even wrap around each other at the via connections.Type: ApplicationFiled: December 22, 2010Publication date: June 28, 2012Inventors: JOHN T. CONTRERAS, Nobumasa Nishiyama, Edgar D. Rothenberg, Rehan A. Zakai, Yiduo Zhang
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Publication number: 20120140360Abstract: Approaches for integrated lead suspension that provides many benefits, such as enabling a dual stage actuator (DSA) to be used with a single layer flex with a reduced amount of crosstalk. An integrated lead suspension comprises a tail end having a plurality of conductive pads positioned thereat. The plurality of conductive pads includes a first and second dual stage actuator (DSA) pad. The first and second DSA pads are electrically coupled to a conductive member by way of conductive vias. The conductive member may be a stainless steel island. The first DSA pad conducts a signal to a first terminal at each of a plurality of dual stage actuators, while a second terminal at each of the plurality of dual stage actuators is connected to ground.Type: ApplicationFiled: December 7, 2010Publication date: June 7, 2012Inventors: John Contreras, Nobumasa Nishiyama, Bijan Rafizadeh, Eiji Soga, Hiroyasu Tsuchida, Yiduo Zhang
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Patent number: 8194354Abstract: A novel suspension assembly includes a flexure tail with a first plurality of apertures in its structural layer. Each of the first plurality of apertures underlies a first trace but not a second trace. Each of a second plurality of apertures in the structural layer underlies a second trace but not the first trace. Each of the first plurality of apertures includes a corresponding region of maximum width, and each of the second plurality of apertures includes a corresponding region of maximum width, as measured in the width direction. None of the corresponding regions of maximum width of the first plurality of apertures is disposed in an overlapping position along the long axis as any of the corresponding regions of maximum width of the second plurality of apertures.Type: GrantFiled: May 23, 2008Date of Patent: June 5, 2012Assignee: Western Digital Technologies, Inc.Inventors: Yiduo Zhang, Tzong-Shii Pan, Yih-Jen D. Chen, William D. Huber
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Patent number: 8064168Abstract: A novel head stack assembly (HSA), and method for HSA assembly, are disclosed and claimed. A first flexure tail has a long axis approximately parallel to a side of the actuator arm. The actuator arm includes a slot in the side having a slot end. The first flexure tail is disposed partially within the slot. The first flexure tail includes a first raised region in contact with the slot adjacent the slot end. The first raised region includes an out-of-plane bend with cross-sectional curvature along the long axis. The first raised region may be squeezed while inserting the first flexure tail partially within the side slot, with the first raised region adjacent the slot end, and then allowed to expand into contact with the slot adjacent the slot end.Type: GrantFiled: November 30, 2007Date of Patent: November 22, 2011Assignee: Western Digital Technologies, Inc.Inventors: Yiduo Zhang, Tzong-Shii Pan, Yih-Jen D. Chen