Patents by Inventor Yii-Chi LIN

Yii-Chi LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PROCESSING TOOL AND METHOD OF OPERATION
    Publication number: 20240379398
    Abstract: In some implementations, a control device may determine a spacing measurement in a first dimension between a wafer on a susceptor and a pre-heat ring of a semiconductor processing tool and/or a gapping measurement in a second dimension between the wafer and the pre-heat ring, using one or more images captured in situ during a process by at least one optical sensor. Accordingly, the control device may generate a command based on a setting associated with the process being performed by the semiconductor processing tool and the spacing measurement and/or the gapping measurement. The control device may provide the command to at least one motor to move the susceptor.
    Type: Application
    Filed: July 25, 2024
    Publication date: November 14, 2024
    Inventors: Yan-Chun LIU, Yii-Chi LIN, Shahaji B. MORE, Chih-Yu MA, Sheng-Jang LIU, Shih-Chieh CHANG, Ching-Lun LAI
  • SEMICONDUCTOR PROCESSING TOOL AND METHOD OF OPERATION
    Publication number: 20230143537
    Abstract: In some implementations, a control device may determine a spacing measurement in a first dimension between a wafer on a susceptor and a pre-heat ring of a semiconductor processing tool and/or a gapping measurement in a second dimension between the wafer and the pre-heat ring, using one or more images captured in situ during a process by at least one optical sensor. Accordingly, the control device may generate a command based on a setting associated with the process being performed by the semiconductor processing tool and the spacing measurement and/or the gapping measurement. The control device may provide the command to at least one motor to move the susceptor.
    Type: Application
    Filed: January 10, 2022
    Publication date: May 11, 2023
    Inventors: Yan-Chun LIU, Yii-Chi LIN, Shahaji B. MORE, Chih-Yu MA, Sheng-Jang LIU, Shih-Chieh CHANG, Ching-Lun LAI
  • Wafer supporting structure, and device and method for manufacturing semiconductor
    Patent number: 9721826
    Abstract: A wafer supporting structure in semiconductor manufacturing, and a device and a method for manufacturing semiconductor are provided. In accordance with some embodiments of the instant disclosure, a wafer supporting structure in semiconductor manufacturing includes a transparent ring and at least two arms. The arms are connected to the transparent ring.
    Type: Grant
    Filed: January 26, 2016
    Date of Patent: August 1, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Yu Ma, Yii-Chi Lin, Zheng-Yang Pan, Chia-Chiung Lo
  • WAFER SUPPORTING STRUCTURE, AND DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR
    Publication number: 20170213759
    Abstract: A wafer supporting structure in semiconductor manufacturing, and a device and a method for manufacturing semiconductor are provided. In accordance with some embodiments of the instant disclosure, a wafer supporting structure in semiconductor manufacturing includes a transparent ring and at least two arms. The arms are connected to the transparent ring.
    Type: Application
    Filed: January 26, 2016
    Publication date: July 27, 2017
    Inventors: Chih-Yu MA, Yii-Chi LIN, Zheng-Yang PAN, Chia-Chiung LO