Patents by Inventor Yin-Ju Chen
Yin-Ju Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230292446Abstract: A method for manufacturing a multilayer circuit board includes providing an inner circuit substrate defining a through hole, attaching a support plate to the inner circuit substrate to seal an opening of the through hole; placing an electronic module in the through hole; pressing a first substrate onto a surface of the inner circuit substrate; removing the support plate; pressing a second substrate onto another surface of the inner circuit substrate, the first substrate and the second substrate infilling the through hole and jointly encapsulating the electronic module; forming a first conductive wiring layer on a surface of the first substrate facing away from the first surface to obtain a first circuit substrate, and forming a second conductive wiring layer on a surface of the second substrate facing away from the second surface to obtain a second circuit substrate. A multilayer circuit board is also disclosed.Type: ApplicationFiled: May 23, 2023Publication date: September 14, 2023Inventors: LAN-TING CHAO, YIN-JU CHEN, ZHENG-TING JIAO
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Patent number: 11553602Abstract: A method for manufacturing a circuit board, includes: stacking a first peelable film on a second peelable film, and disposing fluffy carbon nanotubes between the first peelable film and the second peelable film, thereby obtaining a carbon nanotube layer; pressing the first peelable film, the carbon nanotube layer, and the second peelable film to compact the fluffy carbon nanotubes, thereby obtaining a thermal conductive layer; removing the first peelable film, and disposing a first adhesive layer, a first dielectric layer, and a first circuit layer on a side of the thermal conductive layer away from the second peelable film; removing the second peelable film, and disposing a second adhesive layer, a second dielectric layer, and a second circuit layer on a side of the thermal conductive layer away from the first adhesive layer; mounting an electronic component on the first circuit layer.Type: GrantFiled: June 22, 2021Date of Patent: January 10, 2023Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited., GARUDA TECHNOLOGY CO., LTD.Inventors: Yin-Ju Chen, Jing-Cyuan Yang, Yen-Chang Chu
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Publication number: 20220377913Abstract: A method for manufacturing a circuit board, includes: stacking a first peelable film on a second peelable film, and disposing fluffy carbon nanotubes between the first peelable film and the second peelable film, thereby obtaining a carbon nanotube layer; pressing the first peelable film, the carbon nanotube layer, and the second peelable film to compact the fluffy carbon nanotubes, thereby obtaining a thermal conductive layer; removing the first peelable film, and disposing a first adhesive layer, a first dielectric layer, and a first circuit layer on a side of the thermal conductive layer away from the second peelable film; removing the second peelable film, and disposing a second adhesive layer, a second dielectric layer, and a second circuit layer on a side of the thermal conductive layer away from the first adhesive layer; mounting an electronic component on the first circuit layer.Type: ApplicationFiled: June 22, 2021Publication date: November 24, 2022Inventors: YIN-JU CHEN, JING-CYUAN YANG, YEN-CHANG CHU
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Patent number: 10787635Abstract: A method for expanding circulating tumor cell in vitro includes preparing a cell culture tool having a multi-particle colloidal crystal layer, preparing a cell solution including circulating tumor cells, and contacting the cell solution with the multi-particle colloidal crystal layer, to attach the circulating tumor cells in the cell solution to the multi-particle colloidal crystal layer and rapidly expand by 20 times or more. The multi-particle colloidal crystal layer at least includes first particles having a particle size of 1000 to 5000 nm and second particles having a particle size of 20 to 400 nm. The culture medium in the cell solution at least includes a platelet lysate.Type: GrantFiled: July 9, 2018Date of Patent: September 29, 2020Assignee: Taipei Medical UniversityInventors: Peng-Yuan Wang, Yin-Ju Chen, Long-Sheng Lu, Thierry Burnouf
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Patent number: 10616992Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.Type: GrantFiled: December 20, 2017Date of Patent: April 7, 2020Assignee: UNIMICRON TECHNOLOGY CORP.Inventors: Yin-Ju Chen, Ming-Hao Wu, Cheng-Po Yu
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Publication number: 20190300832Abstract: A method for expanding circulating tumor cell in vitro includes preparing a cell culture tool having a multi-particle colloidal crystal layer, preparing a cell solution including circulating tumor cells, and contacting the cell solution with the multi-particle colloidal crystal layer, to attach the circulating tumor cells in the cell solution to the multi-particle colloidal crystal layer and rapidly expand by 20 times or more. The multi-particle colloidal crystal layer at least includes first particles having a particle size of 1000 to 5000 nm and second particles having a particle size of 20 to 400 nm. The culture medium in the cell solution at least includes a platelet lysate.Type: ApplicationFiled: July 9, 2018Publication date: October 3, 2019Inventors: Peng-Yuan Wang, Yin-Ju Chen, Long-Sheng Lu, Thierry Burnouf
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Publication number: 20180116056Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.Type: ApplicationFiled: December 20, 2017Publication date: April 26, 2018Inventors: Yin-Ju CHEN, Ming-Hao WU, Cheng-Po YU
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Patent number: 9883598Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.Type: GrantFiled: October 10, 2016Date of Patent: January 30, 2018Assignee: UNIMICRON TECHNOLOGY CORP.Inventors: Yin-Ju Chen, Ming-Hao Wu, Cheng-Po Yu
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Patent number: 9805875Abstract: A capacitor and a manufacturing method thereof are provided. The capacitor includes a porous substrate, an electrolyte composition, and a pair of electrodes. The porous substrate has a plurality of holes. The electrolyte composition is located in the holes of the porous substrate, and the electrolyte composition includes an electrolyte solution and a nano carbon material dispersed in the electrolyte solution. The electrodes are respectively located on two opposite surfaces of the porous substrate.Type: GrantFiled: May 6, 2015Date of Patent: October 31, 2017Assignee: Unimicron Technology Corp.Inventors: Yin-Ju Chen, Cheng-Po Yu
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Patent number: 9739963Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.Type: GrantFiled: May 12, 2016Date of Patent: August 22, 2017Assignee: Unimicron Technology Corp.Inventors: Yin-Ju Chen, Cheng-Po Yu, Pei-Chang Huang
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Publication number: 20170229248Abstract: A manufacturing method for a capacitor is provided. The method includes the following steps. A nano carbon material and an electrolyte solution are mixed to obtain an electrolyte composition. A porous substrate is immersed in the electrolyte composition. The electrodes are formed on two opposite surfaces of the porous substrate.Type: ApplicationFiled: April 25, 2017Publication date: August 10, 2017Applicant: Unimicron Technology Corp.Inventors: Yin-Ju Chen, Cheng-Po Yu
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Patent number: 9635757Abstract: A circuit board and a manufacturing method thereof are provided. The circuit board includes a dielectric substrate, a circuit pattern and a dielectric layer. The circuit pattern is disposed on the dielectric substrate. The dielectric layer is disposed on the dielectric substrate and covers the circuit pattern. The dielectric layer includes a dielectric matrix and a mesh-shaped fiber structure disposed in the dielectric matrix. There is no mesh-shaped fiber structure on a portion of the dielectric substrate exposed by the circuit pattern.Type: GrantFiled: August 11, 2016Date of Patent: April 25, 2017Assignee: Unimicron Technology Corp.Inventors: Yin-Ju Chen, Chi-Min Chang, Cheng-Po Yu
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Patent number: 9581774Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.Type: GrantFiled: May 26, 2016Date of Patent: February 28, 2017Assignee: Unimicron Technology Corp.Inventors: Yin-Ju Chen, Cheng-Po Yu, Pei-Chang Huang
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Publication number: 20170034925Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.Type: ApplicationFiled: October 10, 2016Publication date: February 2, 2017Inventors: Yin-Ju CHEN, Ming-Hao WU, Cheng-Po YU
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Publication number: 20160363974Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.Type: ApplicationFiled: August 25, 2016Publication date: December 15, 2016Inventors: Yin-Ju CHEN, Ming-Hao WU, Cheng-Po YU
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Patent number: 9514629Abstract: A vehicle door opening warning system including a control unit, a projection unit and a detection unit is provided. The control unit is disposed at a door of a vehicle. The projection unit is disposed at the door and is electrically coupled to the control unit. The detection unit is disposed outside of the vehicle and is electrically coupled to the control unit. When the detection unit detects a moving object existing within 5 to 30 meters of the vehicle, the detection unit produces a signal. The control unit receives the signal and controls the projection unit to project a warning message according to the signal. A vehicle door opening warning method is also provided.Type: GrantFiled: April 7, 2015Date of Patent: December 6, 2016Assignee: Unimicron Technology Corp.Inventors: Yin-Ju Chen, Cheng-Po Yu
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Publication number: 20160329154Abstract: A capacitor and a manufacturing method thereof are provided. The capacitor includes a porous substrate, an electrolyte composition, and a pair of electrodes. The porous substrate has a plurality of holes. The electrolyte composition is located in the holes of the porous substrate, and the electrolyte composition includes an electrolyte solution and a nano carbon material dispersed in the electrolyte solution. The electrodes are respectively located on two opposite surfaces of the porous substrate.Type: ApplicationFiled: May 6, 2015Publication date: November 10, 2016Inventors: Yin-Ju Chen, Cheng-Po Yu
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Patent number: 9491865Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.Type: GrantFiled: April 24, 2015Date of Patent: November 8, 2016Assignee: UNIMICRON TECHNOLOGY CORP.Inventors: Yin-Ju Chen, Ming-Hao Wu, Cheng-Po Yu
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Publication number: 20160316565Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.Type: ApplicationFiled: April 24, 2015Publication date: October 27, 2016Inventors: Yin-Ju CHEN, Ming-Hao WU, Cheng-Po YU
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Publication number: 20160300473Abstract: A vehicle door opening warning system including a control unit, a projection unit and a detection unit is provided. The control unit is disposed at a door of a vehicle. The projection unit is disposed at the door and is electrically coupled to the control unit. The detection unit is disposed outside of the vehicle and is electrically coupled to the control unit. When the detection unit detects a moving object existing within 5 to 30 meters of the vehicle, the detection unit produces a signal. The control unit receives the signal and controls the projection unit to project a warning message according to the signal. A vehicle door opening warning method is also provided.Type: ApplicationFiled: April 7, 2015Publication date: October 13, 2016Inventors: Yin-Ju Chen, Cheng-Po Yu