Patents by Inventor Yin-Tun Chou
Yin-Tun Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11955317Abstract: A radio frequency (RF) match assembly for a chemical vapor deposition processing chamber. The assembly includes a top electrically insulating column and a bottom electrically insulating column. The assembly further includes a one-piece RF match strap that has a head, a main body and a body extension. The main body of the one-piece RF match strap is configured to extend through the top electrically insulating column and the bottom electrically insulating column. A flexible chamber lid strap connects the processing chamber to the top of the one piece RF match strap.Type: GrantFiled: January 27, 2022Date of Patent: April 9, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Ming-Sze Chen, Yu Li Wang, Yin-Tun Chou, Yuan-Hsin Chi, Sheng-Yuan Lin
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Publication number: 20240087915Abstract: A bonding tool includes a gas supply line that may extend directly between valves associated with one or more gas supply tanks and a processing chamber such that gas supply line is uninterrupted without any intervening valves or other types of structures that might otherwise cause a pressure buildup in the gas supply line between the processing chamber and the valves associated with the one or more gas supply tanks. The pressure in the gas supply line may be maintained at or near the pressure in the processing chamber so that gas provided to the processing chamber through the gas supply line does not cause a pressure imbalance in the processing chamber, which might otherwise cause early or premature contact between semiconductor substrates that are to be bonded in the processing chamber.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Inventors: Yen-Hao HUANG, Chun-Yi CHEN, I-Shi WANG, Yin-Tun CHOU, Yuan-Hsin CHI, Sheng-Yuan LIN
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Patent number: 11862482Abstract: A bonding tool includes a gas supply line that may extend directly between valves associated with one or more gas supply tanks and a processing chamber such that gas supply line is uninterrupted without any intervening valves or other types of structures that might otherwise cause a pressure buildup in the gas supply line between the processing chamber and the valves associated with the one or more gas supply tanks. The pressure in the gas supply line may be maintained at or near the pressure in the processing chamber so that gas provided to the processing chamber through the gas supply line does not cause a pressure imbalance in the processing chamber, which might otherwise cause early or premature contact between semiconductor substrates that are to be bonded in the processing chamber.Type: GrantFiled: May 26, 2021Date of Patent: January 2, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yen-Hao Huang, Chun-Yi Chen, I-Shi Wang, Yin-Tun Chou, Yuan-Hsin Chi, Sheng-Yuan Lin
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Publication number: 20230383399Abstract: The present disclosure relates to exclusion rings for use in processing a semiconductor substrate in a processing chamber, such as a chemical vapor deposition chamber. The exclusion ring includes an alignment structure that cooperates with an alignment structure on a platen on which the exclusion ring will rest during processing of the wafer. The first alignment structure includes a guiding surface which promotes the reception of and positioning of the second alignment structure within the first alignment structure. Methods of utilizing the described exclusion rings are also described.Type: ApplicationFiled: August 8, 2023Publication date: November 30, 2023Inventors: Ming-Yi SHEN, Hsin-Lin WU, Yao-Fong DAI, Pei-Yuan TAI, Chin-Wei CHEN, Yin-Tun CHOU, Yuan-Hsin CHI, Sheng-Yuan LIN
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Publication number: 20230264949Abstract: A preclean process may be omitted from a eutectic bonding sequence. To remove oxide from one or more surfaces of a device wafer of a micro-electromechanical-system (MEMS) structure, a duration of an acid-based etch process in the eutectic bonding sequence may be increased relative to the duration of the acid-based etch process when the preclean process is performed. The increased duration of the acid-based etch process enables the acid-based etch process to remove the oxide from the one or more surfaces of the device wafer without the use of a preceding preclean process. This reduces the complexity and cycle time of the eutectic bonding sequence, reduces the risk of stiction between suspended mechanical components of the MEMS structure, and/or reduces the likelihood that the MEMS structure may be rendered defective or inoperable during manufacturing, which increases process yield.Type: ApplicationFiled: May 1, 2023Publication date: August 24, 2023Inventors: Hong-Ta KUO, I-Shi WANG, Tzu-Ping YANG, Hsing-Yu WANG, Shu-Han CHAO, Hsi-Cheng HSU, Yin-Tun CHOU, Yuan-Hsin CHI, Sheng-Yuan LIN
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Publication number: 20230207365Abstract: A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.Type: ApplicationFiled: March 6, 2023Publication date: June 29, 2023Inventors: Chih-Wei CHOU, Sheng-Yuan LIN, Yuan-Hsin CHI, Yin-Tun CHOU, Hung-Chih WANG, Yu-Chi LIU
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Patent number: 11655146Abstract: A preclean process may be omitted from a eutectic bonding sequence. To remove oxide from one or more surfaces of a device wafer of a micro-electromechanical-system (MEMS) structure, a duration of an acid-based etch process in the eutectic bonding sequence may be increased relative to the duration of the acid-based etch process when the preclean process is performed. The increased duration of the acid-based etch process enables the acid-based etch process to remove the oxide from the one or more surfaces of the device wafer without the use of a preceding preclean process. This reduces the complexity and cycle time of the eutectic bonding sequence, reduces the risk of stiction between suspended mechanical components of the MEMS structure, and/or reduces the likelihood that the MEMS structure may be rendered defective or inoperable during manufacturing, which increases process yield.Type: GrantFiled: November 13, 2020Date of Patent: May 23, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hong-Ta Kuo, I-Shi Wang, Tzu-Ping Yang, Hsing-Yu Wang, Shu-Han Chao, Hsi-Cheng Hsu, Yin-Tun Chou, Yuan-Hsin Chi, Sheng-Yuan Lin
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Patent number: 11600506Abstract: A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.Type: GrantFiled: July 22, 2021Date of Patent: March 7, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDInventors: Chih-Wei Chou, Sheng-Yuan Lin, Yuan-Hsin Chi, Yin-Tun Chou, Hung-Chih Wang, Yu-Chi Liu
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Publication number: 20230065818Abstract: An apparatus for performing a deposition process on a semiconductor wafer includes a chamber, a wafer holder, and a shielding structure. The chamber contains a reaction area, the wafer holder is disposed in the chamber to hold the semiconductor wafer, and the reaction area is above the semiconductor wafer. The shielding structure is disposed in the chamber and isolates an inner sidewall of the chamber from the reaction area. The shielding structure includes a base member, a first member, and a second member. The base member is disposed between the inner sidewall of the chamber and the wafer holder. The first member is disposed on the base member and is windowless. The second member is disposed on the base member and within the first member, and the second member includes a sidewall provided with a first window to transfer the semiconductor wafer.Type: ApplicationFiled: August 30, 2021Publication date: March 2, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Wei Chou, Sheng-Yuan Lin, Yuan-Hsin Chi, Yin-Tun Chou, Hung-Chih Wang, Yu-Chi Liu
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Publication number: 20230068139Abstract: A clamp ring including an inner periphery of increased diameter at locations where inwardly extending tabs are not located reduces the risk a workpiece that is placed in close proximity to the clamp ring or which contacts the clamp ring during processing will stick to the clamp ring.Type: ApplicationFiled: August 27, 2021Publication date: March 2, 2023Inventors: Chih-Wei CHOU, Yuan-Hsin CHI, Yin-Tun CHOU, Hung-Chih WANG, Yu-Chi LIU, Chih-Ming WANG
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Publication number: 20220406569Abstract: A radio frequency (RF) match assembly for a chemical vapor deposition processing chamber. The assembly includes a top electrically insulating column and a bottom electrically insulating column. The assembly further includes a one-piece RF match strap that has a head, a main body and a body extension. The main body of the one-piece RF match strap is configured to extend through the top electrically insulating column and the bottom electrically insulating column. A flexible chamber lid strap connects the processing chamber to the top of the one piece RF match strap.Type: ApplicationFiled: January 27, 2022Publication date: December 22, 2022Inventors: Ming-Sze Chen, Yu Li Wang, Yin-Tun Chou, Yuan-Hsin Chi, Sheng-Yuan Lin
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Publication number: 20220367405Abstract: Methods and systems for improving fusion bonding are disclosed. Plasma treatment is performed on a substrate prior to the fusion bonding, which leaves residual charge on the substrate to be fusion bonded. The residual charge is usually dissipated through an electrically conductive silicone cushion on a loading pin. In the methods, the amount of residual voltage on a test silicon wafer is measured. If the residual voltage is too high, this indicates the usable lifetime of the silicone cushion has passed, and the electrically conductive silicone cushion is replaced. This ensures the continued dissipation of residual charge during use in production, improving the quality of fusion bonds between substrates.Type: ApplicationFiled: February 8, 2022Publication date: November 17, 2022Inventors: Hong-Ta Kuo, Yen Hao Huang, I-Shi Wang, Ming-Yi Shen, Tzu-Ping Yang, Hsing-Yu Wang, Huang-Liang Lin, Yin-Tun Chou, Yuan-Hsin Chi, Sheng-Yuan Lin
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Publication number: 20220344191Abstract: A wafer pod transfer assembly is provided. The wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.Type: ApplicationFiled: July 22, 2021Publication date: October 27, 2022Inventors: Chih-Wei CHOU, Sheng-Yuan Lin, Yuan-Hsin Chi, Yin-Tun Chou, Hung-Chih Wang, Yu-Chi Liu
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Publication number: 20220301947Abstract: A deposition tool includes a power cable pedestal including a pedestal body with a first surface and a second surface and a guide hole that extends through the pedestal body from the first surface to the second surface, where at least a portion of a sidewall of the guide hole has a slanted surface, and where the pedestal body is formed from a first material with a melting point that is higher than a melting point of Polyoxymethylene (POM). The deposition tool includes a bushing arranged over the guide hole, where the bushing is formed from a second material with a melting point that is higher than the melting point of POM.Type: ApplicationFiled: June 11, 2021Publication date: September 22, 2022Inventors: Chih-Wei CHOU, Yuan-Hsin CHI, Sheng-Yuan LIN, Yin-Tun CHOU, Hung-Chih WANG, Yu-Chi LIU
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Publication number: 20220293436Abstract: A bonding tool includes a gas supply line that may extend directly between valves associated with one or more gas supply tanks and a processing chamber such that gas supply line is uninterrupted without any intervening valves or other types of structures that might otherwise cause a pressure buildup in the gas supply line between the processing chamber and the valves associated with the one or more gas supply tanks. The pressure in the gas supply line may be maintained at or near the pressure in the processing chamber so that gas provided to the processing chamber through the gas supply line does not cause a pressure imbalance in the processing chamber, which might otherwise cause early or premature contact between semiconductor substrates that are to be bonded in the processing chamber.Type: ApplicationFiled: May 26, 2021Publication date: September 15, 2022Inventors: Yen-Hao HUANG, Chun-Yi CHEN, I-Shi WANG, Yin-Tun CHOU, Yuan-Hsin CHI, Sheng-Yuan LIN
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Publication number: 20220275500Abstract: The present disclosure relates to exclusion rings for use in processing a semiconductor substrate in a processing chamber, such as a chemical vapor deposition chamber. The exclusion ring includes an alignment structure that cooperates with an alignment structure on a platen on which the exclusion ring will rest during processing of the wafer. The first alignment structure includes a guiding surface which promotes the reception of and positioning of the second alignment structure within the first alignment structure. Methods of utilizing the described exclusion rings are also described.Type: ApplicationFiled: February 26, 2021Publication date: September 1, 2022Inventors: Ming-Yi SHEN, Hsin-Lin WU, Yao-Fong DAI, Pei-Yuan TAI, Chin-Wei CHEN, Yin-Tun CHOU, Yuan-Hsin CHI, Sheng-Yuan LIN
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Publication number: 20220153574Abstract: A preclean process may be omitted from a eutectic bonding sequence. To remove oxide from one or more surfaces of a device wafer of a micro-electromechanical-system (MEMS) structure, a duration of an acid-based etch process in the eutectic bonding sequence may be increased relative to the duration of the acid-based etch process when the preclean process is performed. The increased duration of the acid-based etch process enables the acid-based etch process to remove the oxide from the one or more surfaces of the device wafer without the use of a preceding preclean process. This reduces the complexity and cycle time of the eutectic bonding sequence, reduces the risk of stiction between suspended mechanical components of the MEMS structure, and/or reduces the likelihood that the MEMS structure may be rendered defective or inoperable during manufacturing, which increases process yield.Type: ApplicationFiled: November 13, 2020Publication date: May 19, 2022Inventors: Hong-Ta KUO, I-Shi WANG, Tzu-Ping YANG, Hsing-Yu WANG, Shu-Han CHAO, Hsi-Cheng HSU, Yin-Tun CHOU, Yuan-Hsin CHI, Sheng-Yuan LIN
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Patent number: 11211354Abstract: In an embodiment, a system includes: a circular frame comprising a first side and a second side opposite the first side, wherein the circular frame comprises an aperture formed therethrough; an insert disposed within the aperture; a first wafer disposed over the insert; a second wafer disposed over the first wafer, wherein both the first wafer and the second wafer are configured for eutectic bonding when heated; two clamps disposed on the first side along the circular frame, wherein the two clamps are configured to contact the second wafer at respective clamp locations; and a plurality of pieces configured to secure the insert within the aperture, the plurality of pieces comprising both fixed and flexible pieces, the plurality of pieces comprising two fixed pieces disposed respectively adjacent to the clamp locations along the second side of the circular frame.Type: GrantFiled: November 28, 2018Date of Patent: December 28, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chih-Hang Chang, Richard Huang, I-shi Wang, Yin-Tun Chou, Jen-Hao Liu
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Patent number: 10957516Abstract: A multi-zone gas distribution plate (GDP) for high uniformity in plasma-based etching is provided. A housing defines a process chamber and comprises a gas inlet configured to receive a process gas. A GDP is arranged in the process chamber and is configured to distribute the process gas within the process chamber. The GDP comprises a plurality of holes extending through the GDP, and further comprises a plurality of zones into which the holes are grouped. The zones comprise a first zone and a second zone. Holes of the first zone share a first cross-sectional profile and holes of the second zone share a second cross-sectional profile different than the first cross-sectional profile. A method for designing the multi-zone GDP is also provided.Type: GrantFiled: June 5, 2018Date of Patent: March 23, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chin-Han Meng, Jr-Sheng Chen, Yin-Tun Chou, Chih-Hua Chan, Lin-Ching Huang, Yu-Pei Chiang
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Publication number: 20190164929Abstract: In an embodiment, a system includes: a circular frame comprising a first side and a second side opposite the first side, wherein the circular frame comprises an aperture formed therethrough; an insert disposed within the aperture; a first wafer disposed over the insert; a second wafer disposed over the first wafer, wherein both the first wafer and the second wafer are configured for eutectic bonding when heated; two clamps disposed on the first side along the circular frame, wherein the two clamps are configured to contact the second wafer at respective clamp locations; and a plurality of pieces configured to secure the insert within the aperture, the plurality of pieces comprising both fixed and flexible pieces, the plurality of pieces comprising two fixed pieces disposed respectively adjacent to the clamp locations along the second side of the circular frame.Type: ApplicationFiled: November 28, 2018Publication date: May 30, 2019Inventors: Chih-Hang Chang, Richard Huang, I-Shi Wang, Yin-Tun Chou, Jen-Hao Liu