Patents by Inventor Yin Yu

Yin Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200286605
    Abstract: A vital-sign detecting system includes radio-frequency (RF) tags disposed on detected subjects respectively, the RF tags respectively generating incident RF signals with different predetermined frequencies, and the incident RF signal projecting on a corresponding detected subject to generate a corresponding reflected RF signal; and at least one RF radar that demodulates the reflected RF signal to obtain vital sign of the corresponding detected subject, and identifies the detected subject according to associated frequency of the reflected RF signal.
    Type: Application
    Filed: May 9, 2019
    Publication date: September 10, 2020
    Inventors: Yao-Tsung Chang, Yin-Yu Chen, Chuan-Yen Kao, Sheng-Lun Chiou, Yao-Shun Tseng
  • Publication number: 20200281506
    Abstract: A vital-sign detecting system includes radio-frequency (RF) tags disposed on detected subjects respectively, one of the RF tags being turned on and generating an incident RF signal with a predetermined frequency, and the incident RF signal projecting on a corresponding detected subject to generate a corresponding reflected RF signal; and at least one radio-frequency identification (RFID) radar that turns on one of the RF tags, demodulates the reflected RF signal to obtain vital signal of the corresponding detected subject, and identifies the detected subject according to the turned-on RF tag.
    Type: Application
    Filed: May 9, 2019
    Publication date: September 10, 2020
    Inventors: Yao-Tsung Chang, Yin-Yu Chen, Chuan-Yen Kao, Yao-Shun Tseng, Sheng-Lun Chiou
  • Patent number: 10772220
    Abstract: A printed circuit board (PCB) has multiple layers, where select portions of inner layer circuitry, referred to as inner core circuitry, are covered by a coverlay material and the covered inner core circuitry is exposed from the remaining layers of the PCB. The PCB having covered inner core circuitry is formed using a dummy core plus coverlay process. The select inner core circuitry is part of an inner core. The inner core corresponding to the covered inner core circuitry forms a flexible PCB portion. The flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The inner core is common to both the flexible PCB portion and the remaining rigid PCB portion.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: September 8, 2020
    Assignee: Multek Technologies Limited
    Inventors: J L Zhou, Pui Yin Yu
  • Patent number: 10762986
    Abstract: A vital-sign detecting system includes radio-frequency (RF) tags disposed on detected subjects respectively, the RF tags respectively generating incident RF signals with different predetermined frequencies, and the incident RF signal projecting on a corresponding detected subject to generate a corresponding reflected RF signal; and at least one RF radar that demodulates the reflected RF signal to obtain vital sign of the corresponding detected subject, and identifies the detected subject according to associated frequency of the reflected RF signal.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: September 1, 2020
    Assignee: Wistron Corporation
    Inventors: Yao-Tsung Chang, Yin-Yu Chen, Chuan-Yen Kao, Sheng-Lun Chiou, Yao-Shun Tseng
  • Publication number: 20200196866
    Abstract: A non-contact vital-sign monitoring system having a radar disposed in vicinity of a monitored subject includes a data buffer storing output signals of the radar sampled in sequence during a predetermined period; a status classifier determining status of the monitored subject; and a vital-sign detector determining a vital sign of the monitored subject according to the output signals of stationary status.
    Type: Application
    Filed: February 20, 2019
    Publication date: June 25, 2020
    Inventors: Sheng-Lun Chiou, Yin-Yu Chen, Fang-Ming Wu, Ching-Han Chang
  • Patent number: 10619843
    Abstract: A heat dissipation fan structure capable of showing a pattern of light includes a circuit board, a light guide plate, a light-permeable element, and a vane assembly sequentially connected together. The circuit board is provided with a light emission unit. The vane assembly has a light-permeable wall made of a light-permeable material. The light emitted by the light emission unit is evenly diffused by the light guide plate, passes through the light-permeable element, and is rendered into a specific pattern (e.g., a decorative design and/or characters) by the light-permeable portion of the light-permeable element, wherein the light-permeable portion is shaped according to user needs. The light-permeable material of the light-permeable wall of the vane assembly allows the decorative design and/or characters of light to be seen externally. The heat dissipation fan structure, therefore, can show a pattern of light in addition to dissipating heat.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: April 14, 2020
    Assignee: DONGGUAN CITY HANSHUO PLASTIC CO., LTD.
    Inventors: Hong-Hua Xie, Xiao-Jian Yang, Hai-Yin Yu
  • Publication number: 20200107754
    Abstract: A cycling-posture analyzing system and method are provided. The cycling-posture analyzing system includes a plurality of motion sensors, a pressure sensor and an electronic device. The plurality of motion sensors are disposed on a human body and are configured to detect a plurality of pieces of motion information. The pressure sensor is disposed at a plantar aspect of the human body and is configured to detect pressure information. The electronic device is configured to receive the plurality of pieces of motion information from the plurality of motion sensors, receive the pressure information from the pressure sensor, and use the plurality of pieces of motion information and the pressure information to determine cycling-posture type information according to a cycling-posture identification model.
    Type: Application
    Filed: December 5, 2018
    Publication date: April 9, 2020
    Inventors: Tse-Yu Lin, Yin-Yu Chou, Shih-Yao Wei
  • Patent number: 10565461
    Abstract: A live facial recognition method and system includes capturing a visual image and obtaining temperature information of a person under recognition, and deriving facial features according to the visual image; comparing the facial features of the visual image with corresponding facial features of a facial feature database to obtain a difference therebetween; determining whether facial temperature conforms to a live facial recognition criterion according to the temperature information, if the difference is less than a predetermined threshold value.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: February 18, 2020
    Assignee: Wistron Corporation
    Inventors: Yao-Tsung Chang, Yin-Yu Chen
  • Publication number: 20200015365
    Abstract: A printed circuit board (PCB) has multiple layers, where select portions of inner layer circuitry, referred to as inner core circuitry, are covered by a coverlay material and the covered inner core circuitry is exposed from the remaining layers of the PCB. The PCB having covered inner core circuitry is formed using a dummy core plus coverlay process. The select inner core circuitry is part of an inner core. The inner core corresponding to the covered inner core circuitry forms a flexible PCB portion. The flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The inner core is common to both the flexible PCB portion and the remaining rigid PCB portion.
    Type: Application
    Filed: August 27, 2019
    Publication date: January 9, 2020
    Applicant: Multek Technologies Limited
    Inventors: JL Zhou, Pui Yin Yu
  • Patent number: 10321560
    Abstract: A printed circuit board (PCB) has multiple layers, where select portions of inner layer circuitry, referred to as inner core circuitry, are exposed from the remaining layers. The PCB having an exposed inner core circuitry is formed using a dummy core plus plating resist process. The select inner core circuitry is part of an inner core. The inner core corresponding to the exposed inner core circuitry forms a semi-flexible PCB portion. The semi-flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The inner core is common to both the semi-flexible PCB portion and the remaining rigid PCB portion.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: June 11, 2019
    Assignee: Multek Technologies Limited
    Inventors: Pui Yin Yu, Mark Zhang, Jiawen Chen
  • Patent number: 10292279
    Abstract: A disconnect cavity is formed within a PCB, where the disconnect cavity is electrically disconnected from a PCB landing layer. The disconnect cavity is formed using a plating resist process which does not require low flow prepreg nor selective copper etching. Plating resist is printed on a core structure selectively positioned within a PCB stack-up. The volume occupied by the plating resist forms a subsequently formed disconnect cavity. After lamination of the PCB stack-up, depth control milling, drilling and electroless copper plating are performed, followed by a plating resist stripping process to substantially remove the plating resist and all electroless copper plated to the plating resist, thereby forming the disconnect cavity. In a subsequent copper plating process, without electric connectivity copper cannot be plated to the side walls and bottom surface of the disconnect cavity, resulting in the disconnect cavity wall being electrically disconnected from the PCB landing layer.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: May 14, 2019
    Assignee: Multek Technologies Limited
    Inventors: Jiawen Chen, Pui Yin Yu
  • Publication number: 20190114495
    Abstract: A live facial recognition method and system includes capturing a visual image and obtaining temperature information of a person under recognition, and deriving facial features according to the visual image; comparing the facial features of the visual image with corresponding facial features of a facial feature database to obtain a difference therebetween; determining whether facial temperature conforms to a live facial recognition criterion according to the temperature information, if the difference is less than a predetermined threshold value.
    Type: Application
    Filed: December 11, 2017
    Publication date: April 18, 2019
    Inventors: Yao-Tsung Chang, Yin-Yu Chen
  • Patent number: 10217545
    Abstract: A cable structure includes isolation layers, a first signal wire, a second signal wire, a first ground wire, a second ground wire, a first conductor, and a second conductor. These signal and ground wires are parallel along a first direction and between the isolation layers. These signal wires are adjacent, and the ground wires are respectively at outer sides of these signal wires. The first conductor is on at least one of the isolation layers along a second direction orthogonal to the first direction and is electrically connected to the first and second ground wires. The second conductor is on an outer surface of at least one of the second isolation layers along the first direction and is electrically connected to the first conductor. The second conductor is symmetrical based on a central line between the first and second signal wires.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: February 26, 2019
    Assignee: WISTRON CORP.
    Inventors: Sheng-Lun Chiou, Yin-Yu Chen
  • Publication number: 20190032912
    Abstract: A heat dissipation fan structure capable of showing a pattern of light includes a circuit board, a light guide plate, a light-permeable element, and a vane assembly sequentially connected together. The circuit board is provided with a light emission unit. The vane assembly has a light-permeable wall made of a light-permeable material. The light emitted by the light emission unit is evenly diffused by the light guide plate, passes through the light-permeable element, and is rendered into a specific pattern (e.g., a decorative design and/or characters) by the light-permeable portion of the light-permeable element, wherein the light-permeable portion is shaped according to user needs. The light-permeable material of the light-permeable wall of the vane assembly allows the decorative design and/or characters of light to be seen externally. The heat dissipation fan structure, therefore, can show a pattern of light in addition to dissipating heat.
    Type: Application
    Filed: July 23, 2018
    Publication date: January 31, 2019
    Inventors: Hong-Hua XIE, Xiao-Jian YANG, Hai-Yin YU
  • Patent number: 9999134
    Abstract: A PCB having multiple stacked layers laminated together. The laminated stack includes regular flow prepreg and includes a recessed cavity, a bottom perimeter of which is formed by a photo definable, or photo imageable, polymer structure, such as a solder mask frame, and a protective film. The solder mask frame and protective film protect inner core circuitry at the bottom of the cavity during the fabrication process, as well as enable the use of regular flow prepreg in the laminated stack.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: June 12, 2018
    Assignee: Multek Technologies Limited
    Inventors: Mark Zhang, Kwan Pen, Pui Yin Yu
  • Patent number: 9992880
    Abstract: A printed circuit board (PCB) has multiple layers, where select portions of one or more conductive layers, referred to as core circuitry, form a semi-flexible PCB portion that is protected by an exposed prepreg layer. The semi-flexible PCB portion having an exposed prepreg layer is formed using a dummy core process that leaves the exposed prepreg layer smooth and undamaged. The core circuitry is part of a core structure. The semi-flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The core structure is common to both the semi-flexible PCB portion and the remaining rigid PCB portion.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: June 5, 2018
    Assignee: Multek Technologies Limited
    Inventors: Pui Yin Yu, Mark Zhang, Jiawen Chen
  • Patent number: 9867290
    Abstract: A selective segment via plating process for manufacturing a circuit board selectively interconnects inner conductive layers as separate segments within the same via. Plating resist is applied to a conductive layer of an inner core and then stripped off after an electroless plating process. Stripping of the electroless plating on the plating resist results in a plating discontinuity on the via wall. In a subsequent electroplating process, the plug non-conductive layer can not be plated due to the plating discontinuity. The resulting circuit board structure has separate electrically interconnected segments within the via.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: January 9, 2018
    Assignee: Multek Technologies Limited
    Inventors: Kwan Pen, Pui Yin Yu
  • Publication number: 20180000736
    Abstract: A pharmaceutical composition is provided that is useful to enhance the repair of articular cartilage, to treat a joint injury or to prevent, inhibit or treat osteoarthritis in a mammal. The composition may include an effective amount of an isolated protein that is a chemoattractant for chondrogenic progenitor cells and/or an effective amount of an isolated protein that is a chondro genic factor or a nucleic acid sequence that encodes a chondrogenic factor.
    Type: Application
    Filed: January 7, 2016
    Publication date: January 4, 2018
    Inventors: James A. Martin, Yin Yu, Dong Rim Seol, Aliasger K Salem, Behnoush Khorsand Sourkohi, Anh-Vu T Do, Marc Brouillette
  • Publication number: 20170339788
    Abstract: A printed circuit board has multiple stacked layers laminated together. A through hole is formed through the laminated stack, and plating is applied to the side walls of the though hole, thereby forming a plated through hole. Second through holes are then formed through the laminated stack, where each second through hole overlaps an edge of the plated through hole. By aligning the second through holes at the edge of the plated through hole, the plating of the plated through hole coincident with each second through hole is removed, thereby separating the plated through hole into two separate circuit paths. Forming second through holes in this manner effectively splits the circuit path of the plated through hole into multiple separate circuit paths, which increases the circuit density of the printed circuit board.
    Type: Application
    Filed: June 7, 2016
    Publication date: November 23, 2017
    Applicant: Multek Technologies Limited
    Inventors: Znewa Zeng, Pui Yin Yu
  • Publication number: 20170318685
    Abstract: A disconnect cavity is formed within a PCB, where the disconnect cavity is electrically disconnected from a PCB landing layer. The disconnect cavity is formed using a plating resist process which does not require low flow prepreg nor selective copper etching. Plating resist is printed on a core structure selectively positioned within a PCB stack-up. The volume occupied by the plating resist forms a subsequently formed disconnect cavity. After lamination of the PCB stack-up, depth control milling, drilling and electroless copper plating are performed, followed by a plating resist stripping process to substantially remove the plating resist and all electroless copper plated to the plating resist, thereby forming the disconnect cavity. In a subsequent copper plating process, without electric connectivity copper cannot be plated to the side walls and bottom surface of the disconnect cavity, resulting in the disconnect cavity wall being electrically disconnected from the PCB landing layer.
    Type: Application
    Filed: May 19, 2016
    Publication date: November 2, 2017
    Applicant: Multek Technologies Limited
    Inventors: Jiawen Chen, Pui Yin Yu