Patents by Inventor Ying An

Ying An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Biocompatible material and methods for making and using thereof
    Patent number: 12029753
    Abstract: The present disclosure provides compositions comprising one or more polymers capable of forming a hydrogel and methods for making and using the same. More specifically, the present disclosure provides compositions comprising one or more polymers capable of forming a hydrogel with prolonged mucosal retention, and methods for making and using the same.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: July 9, 2024
    Assignee: THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Ying Chau, Yu Yu
  • Composite material for use in a face mask, and a face mask formed thereof
    Patent number: 12030294
    Abstract: The invention relates to a composite material for use in a face mask. The composite material comprises at least one fabric layer comprising a metallic fiber material; and at least one polymer layer laminated with the at least one fabric layer to form a single composite layer; wherein the at least one polymer layer is of substantially the same shape and size as the at least one fabric layer, such that any air stream passing through the composite layer will be effectively filtered by both the at least one fabric layer and the at least one polymer layer.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: July 9, 2024
    Inventor: Hiu Ying Lam
  • Secure hardware signature and related methods and applications
    Patent number: 12032676
    Abstract: This disclosure provides techniques for recovering a root key from measurement of a circuit function. In some embodiments, a checkpointing feature is used to periodically mark measurements of this function and thereby track drift in the value of the root key over the life of a digital device; the checkpointing feature permits rollback of any measurement of the function in a manner that negates incremental drift and permits recovery of the root key for the life of a device (e.g., an IC circuit or product in which the IC is embedded). This disclosure also provides novel PUF designs and applications.
    Type: Grant
    Filed: December 3, 2022
    Date of Patent: July 9, 2024
    Assignee: JONETIX CORPORATION
    Inventors: Paul Ying-Fung Wu, Richard J. Nathan, Harry Leslie Tredennick
  • System and method to infer thoughts and a process through which a human generated labels for a coding scheme
    Patent number: 12032618
    Abstract: A method for inferring intent and discrepancies in a label coding scheme is described. The method includes compiling data indicating how one or more individuals labeled unstructured content according to the label coding scheme comprising a plurality of labels. The method also includes analyzing a context associated with a content labeled in a particular manner by the one or more individuals. The method further includes detecting discrepancies of meaning for a particular label used by the one or more individuals. The method also includes inferring a strategic thinking of the one or more individuals associated with the discrepancies of meaning detected for the particular label. The method further includes displaying recorded metadata associated with the strategic thinking and the discrepancies of meaning detected for the particular label between the one or more individuals regarding a coded dataset.
    Type: Grant
    Filed: October 20, 2022
    Date of Patent: July 9, 2024
    Assignees: TOYOTA RESEARCH INSTITUTE, INC., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yin-Ying Chen, Shabnam Hakimi, Kenton Michael Lyons, Yanxia Zhang, Matthew Kyung-Soo Hong, Totte Harinen, Monica PhuongThao Van, Charlene Wu
  • Methods for producing a high protein corn meal from a whole stillage byproduct and system therefore
    Patent number: 12031105
    Abstract: The present invention relates generally to corn dry-milling, and more specifically, to methods for producing a high protein corn meal from a whole stillage byproduct produced in a corn dry-milling process for making ethanol and a system therefore. In one embodiment, a method for producing a high protein corn meal from a whole stillage byproduct includes, in a corn dry-milling process for making ethanol, separating the whole stillage byproduct into an insoluble solids portion and a thin stillage portion. The thin stillage portion is separated into a protein portion and a water soluble solids portion. Next, the protein portion is dewatered then dried to define a high protein corn meal that includes at least 40 wt % protein on a dry basis.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: July 9, 2024
    Assignee: Fluid Quip Technologies, LLC
    Inventor: Chie Ying Lee
  • Methods, apparatus and machine-readable media relating to transmission and reconstruction of data streams using data duplication
    Patent number: 12034644
    Abstract: The disclosure provides, inter alia, a method performed by a wireless receiving node for receiving a data stream from one or more wireless transmitting nodes, the data stream comprising a sequence of data items. The method comprising: receiving an indication of an algorithm from a wireless transmitting node of the one or more wireless transmitting nodes; receiving a plurality of data packets from the one or more wireless transmitting nodes, each data packet comprising respective duplicate copies of data items belonging to the data stream; and utilizing the algorithm to select, based on respective times at which the data packets are received, for each position in the sequence, one or more of the duplicate copies of data items for reconstruction of the data stream.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: July 9, 2024
    Assignee: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
    Inventors: Torbjörn Wigren, Ramon Delgado, Katrina Lau, Richard Middleton, Ying Sun
  • User equipments, base stations and methods for transport block determination for mini-slot PUSCH
    Patent number: 12035329
    Abstract: A user equipment (UE) is described. The UE includes receiving circuitry configured to receive resource allocation information of a physical uplink shared channel (PUSCH) and a number of repetitions for the PUSCH. The UE also includes control circuitry configured to calculate a transport block size (TBS) for the PUSCH. The UE further includes transmission circuitry configured to transmit the PUSCH. The TBS is calculated based on a number of resource elements (REs) for a demodulation reference signal (DMRS), REs for additional DMRS, and REs for a DMRS added right after a slot boundary for a repetition of the PUSCH.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: July 9, 2024
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Kazunari Yokomakura, Kai Ying, Tatsushi Aiba
  • Package structure including stacked pillar portions
    Patent number: 12033968
    Abstract: A semiconductor structure including an integrated circuit die and conductive bumps is provided. The integrated circuit die includes bump pads. The conductive bumps are disposed on the bump pads. Each of the conductive bumps includes a first pillar portion disposed on one of the bump pads and a second pillar portion disposed on the first pillar portion. The second pillar portion is electrically connected to one of the bump pads through the first pillar portion, wherein a first width of the first pillar portion is greater than a second width of the second pillar portion. A package structure including the above-mentioned semiconductor structure is also provided.
    Type: Grant
    Filed: May 3, 2023
    Date of Patent: July 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jung-Hua Chang, Szu-Wei Lu, Ying-Ching Shih
  • Media data processing method and related device
    Patent number: 12034947
    Abstract: A media data processing method includes: acquiring a description data box of a jth track in the M tracks, the description data box including temporal domain track indication information, the temporal domain track indication information being used for indicating a track encapsulating mode of the N temporal domain layers, the temporal domain track indication information including temporal domain layer information of a temporal domain layer encapsulated into the jth track, j being a positive integer, and j?M; and decoding the media data according to the temporal domain track indication information, thus improving the flexibility of multi-track encapsulation on different temporal domain layers.
    Type: Grant
    Filed: December 1, 2022
    Date of Patent: July 9, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventor: Ying Hu
  • Semiconductor package structure having a lead frame and a passive component
    Patent number: 12033923
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a lead frame and passive component. The lead frame includes a paddle and a plurality of leads. The lead frame includes a first surface and a second surface opposite to the first surface. The passive component includes an external connector. A pattern of the external connector is corresponding to a pattern of the plurality of leads of the lead frame.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: July 9, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chi-Tsung Chiu, Hui-Ying Hsieh, Chun Hao Chiu, Chiuan-You Ding
  • Zeolite synthesis with alkaline earth metal
    Patent number: 12030042
    Abstract: Provided are a novel form of AFX zeolite, a novel synthesis technique for producing pure phase small pore zeolites, a novel synthesis method for producing a zeolite with an increased Al pair content, a catalyst comprising the AFX zeolite in combination with a metal, and methods of using the same.
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: July 9, 2024
    Assignee: Johnson Matthey Public Limited Company
    Inventors: Hai-Ying Chen, Joseph Fedeyko, Raul Lobo, Nicholas McNamara, Trong Pham
  • Data channel mapping type and DM-RS configuration to enable L1 CLI measurement and reporting
    Patent number: 12035345
    Abstract: Embodiments of this disclosure include apparatuses and methods for data channel mapping type and demodulation reference signal (DM-RS) configuration to enable a physical layer (L1) crosslink interference (CLI) measurement and reporting. Some embodiments are direct to a method of operating a base station (BS), where the method can include generating, by the BS, a demodulation reference signal (DM-RS), determining, by the BS, a position of the DM-RS in a first transmission slot, transmitting, by the BS, the DM-RS to a UE based on the determined position in the first transmission slot, processing, by the BS, a crosslink interference (CLI) measurement fed back based on the DM-RS, wherein the CLI measurement fed back is in a channel state information (CSI) report, and performing, by the BS, a CLI mitigation based on the CLI measurement.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: July 9, 2024
    Assignee: Apple Inc.
    Inventors: Dawei Ying, Hassan Ghozlan, Qian Li, Geng Wu
  • Dynamic indication of soft resource availability via SFI procedure in IAB
    Patent number: 12034531
    Abstract: Systems, apparatuses, methods, and computer-readable media are provided for use in a wireless network for dynamic indication of soft resource availability. Some embodiments are directed to an apparatus in an Integrated Access and Backhaul (IAB) node. The apparatus includes processor circuitry and radio front circuitry. The radio front end circuitry can be configured to receive, from a second IAB node, a slot format indicator (SFI). The SFI can include a slot format entry including a soft symbol indicating availability of a soft resource. The processor circuitry can be configured to use the slot format entry to communicate with a third IAB node, different from the second IAB node, using the soft resource as indicated by the soft symbol.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: July 9, 2024
    Assignee: Apple Inc.
    Inventors: Lili Wei, Qian Li, Dawei Ying, Gang Xiong, Debdeep Chatterjee, Geng Wu
  • Method of forming source/drain regions with expanded widths
    Patent number: 12034077
    Abstract: A device includes a first semiconductor strip, a first gate dielectric encircling the first semiconductor strip, a second semiconductor strip overlapping the first semiconductor strip, and a second gate dielectric encircling the second semiconductor strip. The first gate dielectric contacts the first gate dielectric. A gate electrode has a portion over the second semiconductor strip, and additional portions on opposite sides of the first and the second semiconductor strips and the first and the second gate dielectrics.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: July 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kuo-Cheng Chiang, Chi-Wen Liu, Ying-Keung Leung
  • Magnetic device and magnetic random access memory
    Patent number: 12035636
    Abstract: A magnetic memory includes a first spin-orbital-transfer-spin-torque-transfer (SOT-STT) hybrid magnetic device disposed over a substrate, a second SOT-STT hybrid magnetic device disposed over the substrate, and a SOT conductive layer connected to the first and second SOT-STT hybrid magnetic devices. Each of the first and second SOT-STT hybrid magnetic devices includes a first magnetic layer, as a magnetic free layer, a spacer layer disposed under the first magnetic layer, and a second magnetic layer, as a magnetic reference layer, disposed under the spacer layer. The SOT conductive layer is disposed over the first magnetic layer of each of the first and second SOT-STT hybrid magnetic devices.
    Type: Grant
    Filed: April 27, 2023
    Date of Patent: July 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ji-Feng Ying, Jhong-Sheng Wang, Tsann Lin
  • Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structure
    Patent number: 12033949
    Abstract: A package structure and method of forming the same are provided. The package structure includes a first die and a second die disposed side by side, a first encapsulant laterally encapsulating the first and second dies, a bridge die disposed over and connected to the first and second dies, and a second encapsulant. The bridge die includes a semiconductor substrate, a conductive via and an encapsulant layer. The semiconductor substrate has a through substrate via embedded therein. The conductive via is disposed over a back side of the semiconductor substrate and electrically connected to the through substrate via. The encapsulant layer is disposed over the back side of the semiconductor substrate and laterally encapsulates the conductive via. The second encapsulant is disposed over the first encapsulant and laterally encapsulates the bridge die.
    Type: Grant
    Filed: October 5, 2022
    Date of Patent: July 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Hung Lin, Chih-Wei Wu, Chia-Nan Yuan, Ying-Ching Shih, An-Jhih Su, Szu-Wei Lu, Ming-Shih Yeh, Der-Chyang Yeh
  • Fastener driving machine
    Patent number: 12030165
    Abstract: A fastener driving machine, which comprises an energy storage unit; an impact unit used to drive the energy storage unit to store energy and withstand the energy released by the energy storage unit to drive fasteners into a workpiece; a driving mechanism connected to the impact unit; a rotating power mechanism connected to the driving mechanism to provide rotating power to the driving mechanism. The driving mechanism comprises a stationary annular gear, a crank connected to the rotating power mechanism, and at least one planetary gear which is connected to the crank in a spinning manner and revolves with the rotation of the crank relative to the annular gear, and an engaging shaft eccentrically connected to the planetary gear to push the impact unit. The planetary gear is placed in the annular gear to mesh with the annular gear.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: July 9, 2024
    Assignee: TOGROUP TECHNOLOGY (SUZHOU) CO., LTD
    Inventor: Ying Xu
  • Semiconductor structure having a groove located in the semiconductor substrate and connected to the heat transfer layer
    Patent number: 12033911
    Abstract: Embodiments of the present application provide a semiconductor structure that comprises a semiconductor substrate having a first surface and a second surface opposite to the first surface, a solder pad located at the first surface, a heat transfer layer located at the first surface and being in contact with the solder pad, and a groove located in the semiconductor substrate and being connected to the heat transfer layer.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: July 9, 2024
    Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventors: Jie Liu, Lixia Zhang, Zhan Ying
  • Kart
    Patent number: D1034317
    Type: Grant
    Filed: October 27, 2022
    Date of Patent: July 9, 2024
    Assignee: ZHEJIANG TAOTAO VEHICLES CO., LTD.
    Inventors: Wenbin Huang, Yali Ying, Jie Xu, En Li, Junhui Li
  • Toy gun
    Patent number: D1034842
    Type: Grant
    Filed: September 9, 2022
    Date of Patent: July 9, 2024
    Inventor: Ying Zhang