Abstract: A clip for securing one or more cables associated with a computing device includes a baseplate, a first wall, and a second wall. The first wall and the second wall extend from the baseplate. The first wall has a first inward projection at a distal end thereof. The second wall has a second inward projection at a distal end thereof. The first wall is generally parallel to the second wall. The first wall and the second wall are spaced apart from each other by an interior space configured to receive the one or more cables. The first inward projection and the second inward projection aid in preventing the one or more cables from moving outside of the interior space.

Abstract: A light-emitting device comprises a substrate comprising a sidewall, a first top surface, and a second top surface, wherein the second top surface is closer to the sidewall of the substrate than the first top surface to the sidewall of the substrate; a semiconductor stack formed on the substrate comprising a first semiconductor layer, an active layer, and a second semiconductor layer; a dicing street surrounding the semiconductor stack, and exposing the first top surface and the second top surface of the substrate; a protective layer covering the semiconductor stack; a reflective layer comprising a Distributed Bragg Reflector structure covering the protective layer; and a cap layer covering the reflective layer, wherein the second top surface of the substrate is not covered by the protective layer, the reflective layer, and the cap layer.

Abstract: Metal nanowires, such as silver nanowires coated on a substrate were sintered together to form fused metal nanowire networks that have greatly improved conductivity while maintaining good transparency and low haze. The method of forming such a fused metal nanowire networks are disclosed that involves exposure of metal nanowires to various fusing agents on a short timescale. The resulting sintered network can have a core-shell structure in which metal halide forms the shell. Additionally, effective methods are described for forming patterned structure with areas of sintered metal nanowire network with high conductivity and areas of un-sintered metal nanowires with low conductivity. The corresponding patterned films are also described.

Abstract: A method includes bonding a second package component to a first package component, bonding a third package component to the first package component, attaching a dummy die to the first package component, encapsulating the second package component, the third package component, and the dummy die in an encapsulant, and performing a planarization process to level a top surface of the second package component with a top surface of the encapsulant. After the planarization process, an upper portion of the encapsulant overlaps the dummy die. The dummy die is sawed-through to separate the dummy die into a first dummy die portion and a second dummy die portion. The upper portion of the encapsulant is also sawed through.

Abstract: A semiconductor device, includes a channel region, and a source/drain region adjacent to the channel region. The source/drain region includes a first epitaxial layer, a second epitaxial layer epitaxially formed on the first epitaxial layer and a third epitaxial layer epitaxially formed on the second epitaxial layer, and the first epitaxial layer is made of SiAs.

Abstract: The present invention provides novel chiral bisamino-ether compounds, and method of preparation and use thereof. The chiral bisamino-ether compounds have the structure of formula (I). The method of preparation includes: using chiral aminomethanol compounds as starting materials to react with halogenated aryl compounds in the presence of a base to give a variety of chiral bisamino-ether compounds. The novel chiral bisamino-ether compounds can be used for asymmetric fluorocyclization of unsaturated heterocyclic compounds with excellent enantioselectivity and great potentials for industrial applications.

Abstract: A probe laser beam causes molecules to transition from a ground state to an excited state. A control laser beam causes molecules in the excited state to transition to a laser-induced Rydberg state. Microwave lenses convert a microwave wavefront into respective microwave beams. The microwave beams are counter-propagated through molecules so as to create a microwave interference pattern of alternating maxima and minima. The microwave interference pattern is imposed on the probe beam as a probe transmission pattern. The propagation direction of the microwave wavefront can be determined from the translational position of the probe transmission pattern; the intensity of the microwave wavefront can be determined by the intensity difference between the minima and maxima of the probe transmission pattern.

Abstract: A storage system includes: a memory, configured to write or read a plurality of pieces of data during a read-write operation, the plurality of pieces of data being divided into M bytes, and each byte having N pieces of data; and an encoding circuit, configured to in the encoding stage, generate X first check codes based on the two or more pieces of data in each byte, generate Y second check codes based on all data of two or more bytes of the M bytes in the encoding stage, and generate a third check code based on the plurality of pieces of data, the X first check codes and the Y second check codes. The first check codes, the second check codes and the third check code are used to determine an error state of the plurality of pieces of data.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.

Abstract: A method for manufacturing a semiconductor device includes forming a metal layer in a substrate and sequentially forming a barrier layer and an insulating layer on the substrate. The method includes performing a first etching step to form an opening in the insulating layer, and the opening does not expose the barrier layer. After the first etching step, a gap-filling layer is formed on the insulating layer and fills the opening. The method includes performing a second etching step to form a first via communicating with the opening in the gap-filling layer, and an upper portion of the opening is widened to form a trench. The method includes performing a third etching step to remove the gap-filling layer in a bottom of the opening and to deepen both the trench and the opening. The method includes forming a second via communicating with the opening to expose the metal layer.

Abstract: Embodiments provide a method for packaging a semiconductor, a semiconductor package structure, and a package. The packaging method includes: providing a substrate wafer having a first surface and a second surface arranged opposite to each other, the first surface having a plurality of grooves, a plurality of electrically conductive pillars being provided at a bottom of the groove, and the electrically conductive pillar penetrating through the bottom of the groove to the second surface; providing a plurality of semiconductor die stacks; placing the semiconductor die stack in the groove; and filling an insulating dielectric in a gap between a sidewall of the groove and the semiconductor die stack to form an insulating dielectric layer covering an upper surface of the semiconductor die stack to seal up the semiconductor die stack so as to form the semiconductor package structure.

Abstract: A scrolling system for a window curtain includes a transmission device connected between a shaft to which the curtain is wrapped, and a fixed frame fixed. The transmission device includes a housing in which a first transmission unit and a second transmission unit are accommodated. The first transmission unit includes a first bevel gear which is engaged with a second bevel gear of the second transmission unit. The shaft is connected to the second transmission unit. The first transmission unit includes a loop which is located beyond the housing. A driving rod is hooked to the loop and drives the first bevel gear which drives the second bevel gear so that the second transmission unit is rotated, such that the shaft is rotated to operate the curtain up and down.

Abstract: Disclosed herein are embodiments of an Al—Ce—Ni alloy for use in additive manufacturing. The disclosed alloy embodiments provide fabricated objects, such as bulk components, comprising a heterogeneous microstructure and having good mechanical properties even when exposed to conditions used during the additive manufacturing process. Methods for making and using alloy embodiments also are disclosed herein.

Abstract: Methods of patterning semiconductor devices comprising selective deposition methods are described. A blocking layer is deposited on a metal surface of a semiconductor device before deposition of a dielectric material on a dielectric surface. Methods include exposing a substrate surface including a metal surface and a dielectric surface to a heterocyclic reactant comprising a headgroup and a tailgroup in a processing chamber and selectively depositing the heterocyclic reactant on the metal surface to form a passivation layer, wherein the heterocyclic headgroup selectively reacts and binds to the metal surface.

Abstract: An immunochromatographic detection device adapted for detecting an analyte in a specimen includes a surface-modified cellulose membrane, a detection unit, and a substrate. The surface-modified cellulose membrane includes opposite top and bottom surfaces, cellulose fibers, and an anti-biofouling acrylic copolymer that is bonded to the cellulose fibers. The detection unit is disposed on the top surface of the cellulose membrane, is configured to interact with the specimen, and includes a diffusion layer, a capturing layer, a detection layer, a control line layer, and an absorbent layer. The substrate is disposed on the bottom surface of the surface-modified cellulose membrane.

Abstract: A lens driving device and a driving method thereof are provided. The lens driving device includes a lens frame, a magnetic group, a driving element group and a control device. The lens frame carries at least one optical element. The magnetic group includes a plurality of pairs of magnetic elements. The driving element group includes at least two coils. The control device supplies power to the driving element group so that the lens frame is driven by the driving element group to move. The driving element group is disposed on the lens frame, and the amount of the lens frame is equal to that of the driving element group. The control device in a first driving state supplies the power to the coils in sequence so that the driving element group is moved from a pair of magnetic elements to another pair of magnetic elements.

Abstract: An authority control system includes a biometric identification unit, a near field communication (NFC) signal transmission unit, and an NFC signal receiving unit. The biometric identification unit stores associated data, configured to obtain first biometric data, obtains encoded data according to the first biometric data and the associated data, and transmits the encoded data. The NFC signal transmission unit is configured to receive the encoded data transmitted by the biometric identification unit, and transmit the encoded data by using an NFC transmission technology. The NFC signal receiving unit stores authorization type comparison data. The NFC signal receiving unit is configured to receive the encoded data transmitted by the NFC signal transmission unit, and determines an authorization type according to the encoded data and the authorization type comparison data.

Abstract: The present disclosure provides a power assisted electric bicycle, a transmission device and a control method. The power assisted electric bicycle includes a body, a wheel, a torque sensor, a motor and a controller. The torque sensor is configured to output a plurality of torque signals corresponding to a pedal force. The controller is configured to: receive the torque signals from the torque sensor; compute and determine a first period according to a speed of the power assisted electric bicycle at a first time point; obtain a first maximum value of the torque signals in the first period that ends at the first time point; and, set a first torque output of the motor according to the first maximum value corresponding to the torque signal.