Patents by Inventor Ying Chen

Ying Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240031012
    Abstract: A wireless communication includes determining, by a satellite, at least one first signal, sending the at least one first signal to a terminal based on at least one first beam, and receiving a random access request from the terminal. Each first signal of the at least one first signal corresponds to one first beam of the at least one first beam. Each first signal of the at least one first signal includes information about a first geographical location of a center point of the one first beam of the at least one first beam corresponding to each first signal of the at least one first signal. The information about the first geographical location is useable to determine a second beam from the at least one first beam. The random access request includes an identifier of the second beam.
    Type: Application
    Filed: September 27, 2023
    Publication date: January 25, 2024
    Inventors: Ruonan YANG, Ying CHEN, Rong LI, Jun WANG, Yinggang DU, Yu WANG, Yunfei QIAO
  • Publication number: 20240017106
    Abstract: A fire-spreading prevention and flame-retardant material includes a gel carrier, a first flame retardant, a second flame retardant, a first flame barrier, a second flame barrier and an adhesive. The first flame retardant uses a collosol way to be distributed in the gel carrier. The second flame retardant uses the collosol way to be distributed in the gel carrier. The first flame barrier uses the collosol way to be distributed in the gel carrier. The second flame barrier uses the collosol way to be distributed in the gel carrier. The adhesive is dissolved in the gel carrier to improve a property of the gel carrier.
    Type: Application
    Filed: February 24, 2023
    Publication date: January 18, 2024
    Inventors: JEN-KAI HUANG, PING-YU LEE, HSU-LUN HSU, SSU-YING CHEN
  • Publication number: 20240021917
    Abstract: A fire-spreading prevention battery module includes a plurality of battery cells, a plurality of fire-spreading prevention pads, an upper battery frame, a plurality of upper electrode plates, a lower battery frame, a plurality of first lower electrode plates and two second lower electrode plates. Each battery cell is formed in a cylinder shape. Each fire-spreading prevention pad wraps a peripheral surface of one battery cell. The plurality of the upper electrode plates are mounted on an upper surface of the upper battery frame. The plurality of the first lower electrode plates are mounted to a middle of a lower surface of the lower battery frame. The two second lower electrode plates are mounted to two ends of the lower surface of the lower battery frame. The plurality of the first lower electrode plates are arranged between the two second lower electrode plates.
    Type: Application
    Filed: April 16, 2023
    Publication date: January 18, 2024
    Inventors: JEN-KAI HUANG, PING-YU LEE, HSU-LUN HSU, SSU-YING CHEN, TA-CHANG YANG, MIN-YU WU, MING-CHIA CHI
  • Publication number: 20240021706
    Abstract: A method includes performing an atomic layer deposition (ALD) process to form a dielectric layer on a wafer. The ALD process comprises an ALD cycle includes pulsing calypso ((SiCl3)2CH2), purging the calypso, pulsing ammonia, and purging the ammonia. The method further includes performing a wet anneal process on the dielectric layer, and performing a dry anneal process on the dielectric layer.
    Type: Application
    Filed: August 7, 2023
    Publication date: January 18, 2024
    Inventors: Wen-Kai Lin, Che-Hao Chang, Chi On Chui, Yung-Cheng Lu, Szu-Ying Chen
  • Publication number: 20240022355
    Abstract: This application describes a hybrid automatic repeat request (HARQ) feedback method and apparatus, and a computer-readable storage medium. An example method includes receiving downlink control information (DCI) from a network device, and determining, based on the DCI, a slot interval between a first data block and a HARQ feedback corresponding to the first data block. The method further includes determining a target slot based on a frame structure, and sending, in the target slot to the network device, HARQ information corresponding to the first data block.
    Type: Application
    Filed: September 27, 2023
    Publication date: January 18, 2024
    Inventors: Yunfei QIAO, Ying CHEN, Jun WANG
  • Patent number: 11876550
    Abstract: A supporter is provided. The supporter includes a base, a holder, a positioning member, a connecting rod assembly, and a power assembly. The holder is connected to the base and has a through-hole. The positioning member is disposed in the through-hole of the holder. The connecting rod assembly is disposed on the holder and connected to the positioning member. The power assembly is movably disposed on the holder via the connecting rod assembly. Accordingly, the power assembly is movable in response to the position of the electronic device, which achieves good recharge efficiency whether the electronic device is arranged upright or horizontally.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: January 16, 2024
    Assignee: WISTRON CORP.
    Inventors: Chun-Chien Chen, Chen Yi Liang, Tzu-Ying Chen
  • Patent number: 11870573
    Abstract: Embodiments of this application disclose a polar coding method, apparatus, and device, so as to reduce storage overheads of a system. A sequence for polar coding is obtained based on a length M of a target polar code, wherein the sequence comprises L sequence numbers, ordering of the L sequence numbers in the sequence is the same as ordering of the L sequence numbers in a maximum mother code sequence, wherein the maximum mother code sequence is obtained by sorting N sequence numbers of N polarized channels in ascending order or descending order of reliability metrics, wherein L and N are integer power of 2, M is smaller than or equal to L, L is smaller than or equal to N.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: January 9, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Rong Li, Gongzheng Zhang, Ying Chen, Xiaocheng Liu, Jun Wang
  • Publication number: 20240000194
    Abstract: A fastening device includes a case, a spool, a plurality of ratchet teeth, an incremental releasing set and a knob. The incremental releasing set includes a ratchet arm and an operated portion, the ratchet arm is selectively engaged with at least one of the ratchet teeth, and the operated portion is linked with the ratchet arm. The knob is disposed at the case. The ratchet arm is engaged with at least one of the ratchet teeth to prohibit the spool from rotating in a releasing direction, and as the knob is rotated in a tightening direction, the ratchet arm is disengaged from at least one of the ratchet teeth to allow the spool to tighten the lace; as the operated portion is operated, the ratchet arm is disengaged from at least one of the ratchet teeth, such that allows the lace to be incrementally released.
    Type: Application
    Filed: April 12, 2021
    Publication date: January 4, 2024
    Inventor: Yi-ying CHEN
  • Patent number: 11857925
    Abstract: A catalyst article including a substrate with an inlet side and an outlet side, a first zone and a second zone, where the first zone includes a passive NOx adsorber (PNA), and an ammonia slip catalyst (ASC) comprising a platinum group metal on a support and a first SCR catalyst; where the second zone includes a catalyst selected from the group consisting of a diesel oxidation catalyst (DOC) and a diesel exotherm catalyst (DEC); and where the first zone is located upstream of the second zone. The first zone may include a bottom layer with a blend of: (1) the platinum group metal on a support and (2) the first SCR catalyst; and a top layer with a second SCR catalyst, the top layer located over the bottom layer.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: January 2, 2024
    Assignee: Johnson Matthey Public Limited Company
    Inventors: Hai-Ying Chen, Joseph Fedeyko, Dongxia Liu, Jing Lu
  • Publication number: 20230415251
    Abstract: Disclosed is an electrical discharge machining apparatus at least comprising a carrier platform, an electrical discharge machining unit and a repairing device. The carrier platform is used for carrying at least one to-be-machined object. The electrical discharge machining unit comprises at least one electrode and a power supply unit, and is used for performing an electrical discharge machining procedure on a machined target area of the to-be-machined object by the electrode along a machining direction. When there is an area to be repaired on an appearance of the electrode, the repairing device performs a repairing procedure on the electrode, thereby achieving effects of stable electrical discharge and preventing short-circuit problem in the electrical discharge machining procedure.
    Type: Application
    Filed: June 16, 2023
    Publication date: December 28, 2023
    Applicant: HIGHLIGHT TECH CORP.
    Inventors: CHWUNG-SHAN KOU, WEN-YUNG YEH, CHANG-YING CHEN
  • Publication number: 20230421808
    Abstract: A method of compressing digital image data is provided that includes selecting an entropy code for encoding a line of pixels in the digital image data, wherein the entropy code is selected from a plurality of variable length entropy codes, using spatial prediction to compute a pixel predictor and a pixel residual for a pixel in the line of pixels, and selectively encoding the pixel residual using one of the entropy code or run mode encoding.
    Type: Application
    Filed: September 11, 2023
    Publication date: December 28, 2023
    Inventors: Ying Chen, Madhukar Budagavi, Minhua Zhou
  • Publication number: 20230420413
    Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die, having a first surface and an opposing second surface; a redistribution layer (RDL) having a surface, wherein the first surface of the first die is on and electrically coupled to the surface of the RDL by non-solder interconnects; and a second die at the second surface of the first die, wherein the second die is electrically coupled directly to the second surface of the first die by solder interconnects.
    Type: Application
    Filed: June 23, 2022
    Publication date: December 28, 2023
    Applicant: Intel Corporation
    Inventors: Alois Nitsch, Han-Wen Lin, Yin-Ying Chen, Meng-Chi Lee, Andreas Dost, Hans Gerard Jetten
  • Publication number: 20230415252
    Abstract: Disclosed is an electrical discharge machining apparatus at least comprising a carrier platform and an electrical discharge machining unit. The carrier platform is used to carry at least one to-be-machined object. The electrical discharge machining unit comprises an electrode, a jig and a power supply unit. When the electrical discharge machining unit performs an electrical discharge machining procedure on a machined target area of the to-be-machined object along a machining direction, an electrical discharge section of the electrode and the machined target area of the to-be-machined object move relatively. The invention is capable of improving a machining procedure, saving an overall machining time and saving a time required for electrode replacement.
    Type: Application
    Filed: June 16, 2023
    Publication date: December 28, 2023
    Applicant: HIGHLIGHT TECH CORP.
    Inventors: CHWUNG-SHAN KOU, WEN-YUNG YEH, CHANG-YING CHEN
  • Patent number: 11852602
    Abstract: A liquid detection device and a method for manufacturing the same are provided. The liquid detection device includes: a substrate; a working electrode disposed on the substrate, wherein the working electrode includes a first metal portion and a first sensing portion, and the first sensing portion is disposed on the first metal portion; and a reference electrode disposed on the substrate.
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: December 26, 2023
    Assignee: INNOLUX CORPORATION
    Inventors: Fuh-Tsang Wu, Yi-Hung Lin, Huei-Ying Chen
  • Patent number: 11854800
    Abstract: Embodiment methods for performing a high pressure anneal process during the formation of a semiconductor device, and embodiment devices therefor, are provided. The high pressure anneal process may be a dry high pressure anneal process in which a pressurized environment of the anneal includes one or more process gases. The high pressure anneal process may be a wet anneal process in which a pressurized environment of the anneal includes steam.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: December 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Szu-Ying Chen, Ya-Wen Chiu, Cheng-Po Chau, Yi Che Chan, Chih Ping Liao, YungHao Wang, Sen-Hong Syue
  • Patent number: 11854966
    Abstract: A method of manufacturing a semiconductor device includes forming via structures in a first via layer over a transistor layer, the forming the via structures in the first via layer including forming a first via structure in the first via layer, the first via structure being included in a first deep via arrangement; forming conductive segments in a first metallization layer over the first via layer, the forming the conductive segments in the first metallization layer including forming M_1st routing segments at least a majority of which, relative to a first direction, have corresponding long axes with lengths which at least equal if not exceed a first permissible minimum value for routing segments in the first metallization layer; and forming an M_1st interconnection segment having a long axis which is less than the first permissible minimum value, the M_1st interconnection segment being included in the first deep via arrangement.
    Type: Grant
    Filed: January 19, 2023
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ta-Pen Guo, Chien-Ying Chen, Li-Chun Tien, Lee-Chung Lu
  • Patent number: 11854968
    Abstract: An antifuse structure and IC devices incorporating such antifuse structures in which the antifuse structure includes an dielectric antifuse structure formed on an active area having a first dielectric antifuse electrode, a second dielectric antifuse electrode extending parallel to the first dielectric antifuse electrode, a first dielectric composition between the first dielectric antifuse electrode and the second dielectric antifuse electrode, and a first programming transistor electrically connected to a first voltage supply wherein, during a programming operation a programming voltage is selectively applied to certain of the dielectric antifuse structures to form a resistive direct electrical connection between the first dielectric antifuse electrode and the second dielectric antifuse electrode.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Meng-Sheng Chang, Chien-Ying Chen, Yao-Jen Yang
  • Patent number: 11856760
    Abstract: A one-time programmable (OTP) bit cell includes a substrate including a front side and a back side, an active area on the front side, a first read transistor including a first gate and a first portion of the active area intersected by the first gate, a program transistor including a second gate and a second portion of the active area intersected by the second gate, a first electrical connection to the first gate, a second electrical connection to the second gate, and a third electrical connection to the active area. At least one of the first, second, or third electrical connections includes a metal line positioned on the back side.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chien-Ying Chen, Yao-Jen Yang
  • Patent number: 11851407
    Abstract: Methods, and related compositions, for the improved synthesis of [18F]DCFPyL are disclosed. Also provided are methods, and related compositions, for the use of [18F]DCFPyL so produced.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: December 26, 2023
    Assignee: THE JOHNS HOPKINS UNIVERSTY
    Inventors: Hayden T. Ravert, Daniel P. Holt, Ying Chen, Ronnie C. Mease, Hong Fan, Martin G. Pomper, Robert F. Dannals
  • Publication number: 20230413357
    Abstract: A communication method includes obtaining downlink transmission data of an aerial vehicle that includes a communication module based on which the aerial vehicle establishes a first communication link not adopting a cellular network communication protocol and a second communication link adopting the cellular network communication protocol with a terminal device, sending the downlink transmission data to the terminal device based on the first communication link, determining a target data receiving mode from a first data receiving mode for receiving uplink transmission data sent by the terminal device based on the first communication link and a second data receiving mode for receiving the uplink transmission data based on the first communication link and the second communication link, and controlling the communication module to work in the target data receiving mode. The uplink transmission data includes at least one of feedback data or control data.
    Type: Application
    Filed: September 1, 2023
    Publication date: December 21, 2023
    Inventors: Ning MA, Xiaojun YIN, Ying CHEN