Abstract: A fingerprint sensor includes a die, a plurality of conductive structures, an encapsulant, a plurality of conductive patterns, a first dielectric layer, a second dielectric layer, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The conductive patterns are over the die and are electrically connected to the die and the conductive structures. Top surfaces of the conductive patterns are flat. The first dielectric layer is over the die and the encapsulant. A top surface of the first dielectric layer is coplanar with top surfaces of the conductive patterns. The second dielectric layer covers the first dielectric layer and the conductive patterns. The redistribution structure is over the rear surface of the die.

Abstract: The present invention provides a common-mode signal absorber, which comprises an impedance-matching network and a common-mode signal reflection circuit. A differential-mode signal is inputted into input ends of the impedance-matching network, and outputted from output ends of the common-mode signal reflection circuit. When a common-mode signal is inputted into the common-mode signal absorber, the common-mode signal reflection circuit is for reflecting the common-mode signal within a specific frequency band. Afterward, the reflection of the common-mode signal within the specific frequency band will be absorbed by an impedance element of the impedance-matching network. Thus, the common-mode signal within the specific frequency band may be absorbed by the impedance-matching network so as to avoid to interfere signals transmitted on a communication system.

Abstract: A semiconductor package includes an integrated passive device (IPD) including one or more passive devices over a first substrate; and metallization layers over and electrically coupled to the one or more passive devices, where a topmost metallization layer of the metallization layers includes a first plurality of conductive patterns; and a second plurality of conductive patterns interleaved with the first plurality of conductive patterns. The IPD also includes a first under bump metallization (UBM) structure over the topmost metallization layer, where the first UBM structure includes a first plurality of conductive strips, each of the first plurality of conductive strips electrically coupled to a respective one of the first plurality of conductive patterns; and a second plurality of conductive strips interleaved with the first plurality of conductive strips, each of the second plurality of conductive strips electrically coupled to a respective one of the second plurality of conductive patterns.

Abstract: The present invention provides a common-mode signal absorber, which comprises an impedance-matching network and a common-mode signal reflection circuit. A differential-mode signal is inputted into input ends of the impedance-matching network, and outputted from output ends of the common-mode signal reflection circuit. When a common-mode signal is inputted into the common-mode signal absorber, the common-mode signal reflection circuit is for reflecting the common-mode signal within a specific frequency band. Afterward, the reflection of the common-mode signal within the specific frequency band will be absorbed by an impedance element of the impedance-matching network. Thus, the common-mode signal within the specific frequency band may be absorbed by the impedance-matching network so as to avoid to interfere signals transmitted on a communication system.

Abstract: The present invention provides a noise suppression device and equivalent circuit thereof. The noise suppression device comprises a metal plate and at least one first resonance unit. The first resonance unit comprises a plurality of first resonators. Each of the first resonators comprises a first metal segment and at least one first conductive connection segment, the first metal segment is connected to the first conductive connection segment. When the first resonance unit is configured on the metal plate, each of the first metal segments is electrically connected to the metal plate by the corresponding first conductive connection segment. When the resonance of the first resonator occurs, a noise transmitted on the metal plate can be conducted to the first resonator and suppressed by the first resonator.

Abstract: A package structure including at least one conductive plate, a redistribution layer, a first semiconductor chip, a conductive shielding structure and an insulating encapsulant is provided. The first semiconductor chip is sandwiched in between the at least one conductive plate and the redistribution layer, wherein the first semiconductor chip is disposed on the at least one conductive plate and electrically connected to the redistribution layer. The conductive shielding structure is sandwiched in between the at least one conductive plate and the redistribution layer, wherein the conductive shielding structure surrounds the first semiconductor chip and electrically connects the at least one conductive plate with the redistribution layer. The insulating encapsulant is disposed on the redistribution layer, encapsulating the first semiconductor chip, the conductive shielding structure, and surrounding the at least one conductive plate.

Abstract: The present invention provides a common-mode signal absorber, which comprises an impedance-matching network and a common-mode signal reflection circuit. A differential-mode signal is inputted into input ends of the impedance-matching network, and outputted from output ends of the common-mode signal reflection circuit. When a common-mode signal is inputted into the common-mode signal absorber, the common-mode signal reflection circuit is for reflecting the common-mode signal within a specific frequency band. Afterward, the reflection of the common-mode signal within the specific frequency band will be absorbed by an impedance element of the impedance-matching network. Thus, the common-mode signal within the specific frequency band may be absorbed by the impedance-matching network so as to avoid to interfere signals transmitted on a communication system.