Patents by Inventor Ying-Chih Wang

Ying-Chih Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060180469
    Abstract: The present invention provides a device and methods of use thereof in concentrating a species of interest and/or controlling liquid flow in a device. The methods, inter-alia, make use of a device comprising microchannels, which are linked to nanochannels, whereby induction of an electric field in the nanochannel results in ion depletion in the linkage region between the microchannel and nanochannel, and a space charge layer is formed within the microchannel, which provides an energy barrier for said species of interest which enables its concentration in a region in the microchannel.
    Type: Application
    Filed: January 25, 2006
    Publication date: August 17, 2006
    Inventors: Jongyoon Han, Ying-Chih Wang
  • Patent number: 6992890
    Abstract: A heat sink is provided. The heat sink comprises a hollow chassis having a contact face at a bottom portion thereof for attaching to an electronic component and a heat dissipating face at a top portion thereof. A plurality of circularly arranged fins extend from an inner sidewall of the hollow chassis towards a center of the hollow chassis so that gaps between the fins gradually decrease from the inner sidewall of said hollow chassis towards the center of said hollow chassis. At least a heat pipe is positioned between the contact face and the heat dissipating face. At least a fan is positioned at a side of the hollow chassis for generating air to increase an amount of air blowing through wider gaps between said fins to increase the speed of heat dissipation.
    Type: Grant
    Filed: September 2, 2004
    Date of Patent: January 31, 2006
    Assignee: Glacialtech, Inc.
    Inventors: Ying-Chih Wang, Yong-Chang Kao, Chi-Nan Tsai
  • Publication number: 20050264994
    Abstract: A heat sink is provided. The heat sink comprises a hollow chassis having a contact face at a bottom portion thereof for attaching to an electronic component and a heat dissipating face at a top portion thereof. A plurality of circularly arranged fins extend from an inner sidewall of the hollow chassis towards a center of the hollow chassis so that gaps between the fins gradually decrease from the inner sidewall of said hollow chassis towards the center of said hollow chassis. At least a heat pipe is positioned between the contact face and the heat dissipating face. At least a fan is positioned at a side of the hollow chassis for generating air to increase an amount of air blowing through wider gaps between said fins to increase the speed of heat dissipation.
    Type: Application
    Filed: September 2, 2004
    Publication date: December 1, 2005
    Applicant: GLACIALTECH, INC.
    Inventors: Ying-Chih Wang, Yung-Chang Kao, Chi-Nan Tsai