Patents by Inventor Ying Chung Chen

Ying Chung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12379243
    Abstract: An optical system and a method of manufacturing an optical system are provided. The optical system includes a carrier, a light emitter, a light receiver, a block structure and an encapsulant. The light emitter is disposed on the carrier. The light receiver is disposed on the carrier and physically spaced apart from the light emitter. The light receiver has a light detecting area. The block structure is disposed on the carrier. The encapsulant is disposed on the carrier and covers the light emitter, the light receiver and the block structure. The encapsulant has a recess over the block structure.
    Type: Grant
    Filed: February 6, 2024
    Date of Patent: August 5, 2025
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hsin-Ying Ho, Ying-Chung Chen
  • Patent number: 12362509
    Abstract: A multi-piece connector is provided. The multi-piece connector includes a jumper conductor for electrically interconnecting parts of conductive terminals of the connector, without having to use any additional jumper, such that an electronic device having such a connector can be made more compact in size.
    Type: Grant
    Filed: December 23, 2022
    Date of Patent: July 15, 2025
    Assignee: TARNG YU ENTERPRISE CO., LTD.
    Inventors: Ying-Chung Chen, Mu-Jung Huang
  • Publication number: 20250226618
    Abstract: An electrical connector that can provide a shielding wall capable of transmitting shielded signals on at least three sides of the non-grounding conductive terminal, enabling to effectively reduce interference during high-speed signal transmission, thereby optimizing transmission quality for high-speed signals of the electrical connector, in order to meet the special requirements and development of electronic devices.
    Type: Application
    Filed: December 31, 2024
    Publication date: July 10, 2025
    Inventors: YING-CHUNG CHEN, MU-JUNG HUANG
  • Publication number: 20250226617
    Abstract: An electrical connector is described that provides a shielding wall for at least three sides of non-grounded conductive terminals, enabling the transmission of shielded signals. This design effectively reduces interference for the electrical connector when transmitting high-speed signals, thereby optimizing the transmission quality of high-speed signals for the electrical connector. This meets the specific requirements and advancements in electronic devices.
    Type: Application
    Filed: May 11, 2024
    Publication date: July 10, 2025
    Inventors: YING-CHUNG CHEN, MU-JUNG HUANG
  • Publication number: 20250226619
    Abstract: An electrical connector is described that provides a shielding wall for at least three sides of non-grounded conductive terminals, enabling the transmission of shielded signals. This design effectively reduces interference for the electrical connector when transmitting high-speed signals, thereby optimizing the transmission quality of high-speed signals for the electrical connector. This meets the specific requirements and advancements in electronic devices.
    Type: Application
    Filed: December 31, 2024
    Publication date: July 10, 2025
    Inventors: YING-CHUNG CHEN, MU-JUNG HUANG
  • Patent number: 12352602
    Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.
    Type: Grant
    Filed: December 5, 2023
    Date of Patent: July 8, 2025
    Inventors: Ying-Chung Chen, Hsun-Wei Chan, Lu-Ming Lai, Kuang-Hsiung Chen
  • Patent number: 12326600
    Abstract: The present disclosure provides an electronic module includes a light source configured to radiate a first light beam having a first wavelength and a converting device configured to receive the first light beam and to convert the first light beam to a second light beam having a second wavelength different from the first wavelength. The electronic module also includes a connection element configured to transmit the first light beam from the light source to the converting device and adapted to a predetermined geometric relationship between the light source and the converting device to meet a condition of total internal reflection.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: June 10, 2025
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Shih-Chieh Tang, Ying-Chung Chen
  • Patent number: 12322740
    Abstract: A semiconductor package device, a wearable device, and a temperature detection method are provided. The semiconductor package includes a substrate, an optical module, and a temperature module. The optical module is disposed on the substrate. The temperature module is disposed on the substrate and adjacent to the optical module. The temperature module comprises a semiconductor element and a temperature sensor stacked on the semiconductor element. The optical module is configured to detect a distance between the optical module and an object.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: June 3, 2025
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Ying-Chung Chen
  • Publication number: 20250125557
    Abstract: A female-side connector assembly and its female-side connector and male-side connector, wherein the provided female-side connector and male-side connector are equipped with a metal shell and an insulating base. The metal shell can mate with the insulating base to form a locking side wall, allowing the male-side connector to lock the female-side connector through the locking side wall, preventing the male-side connector from disengaging from the locked female-side connector. This addresses the technical issues of the male-side connector easily disengaging from the locked female-side connector, ensuring that the signal transmission functionality between the female-side connector and the male-side connector meets expectations, thereby enabling the connector assembly to be widely applied in various electronic devices.
    Type: Application
    Filed: June 17, 2024
    Publication date: April 17, 2025
    Inventors: YING-CHUNG CHEN, MU-JUNG HUANG
  • Publication number: 20240427092
    Abstract: The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.
    Type: Application
    Filed: September 10, 2024
    Publication date: December 26, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shih-Chieh TANG, Lu-Ming LAI, Yu-Che HUANG, Ying-Chung CHEN
  • Patent number: 12085768
    Abstract: The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: September 10, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Shih-Chieh Tang, Lu-Ming Lai, Yu-Che Huang, Ying-Chung Chen
  • Patent number: 12080963
    Abstract: An electrical connector assembly and its manufacturing method are described, wherein the electrical connector assembly includes a bridging conductive component. The multiple conductive terminals achieve electrical connection through the bridging conductive component without the use of jumper wires, meeting the requirements for signal transmission in the electrical connector assembly. The manufacturing method of the electrical connector assembly involves the step of combining multiple electrical connector components with the bridging conductive component. Thus, during the assembly of the electrical connector assembly, customization of the electrical connection relationship of conductive terminals can be achieved by adjusting multiple electrical connector components and the bridging conductive component. This customization ensures compliance with the requirements for signal transmission in the electrical connector assembly, meeting the specific needs and developments of electronic devices.
    Type: Grant
    Filed: March 5, 2024
    Date of Patent: September 3, 2024
    Assignees: DONGGUAN TARNG YU ELECTRONICS CO., LTD., TARNG YU ENTERPRISE CO., LTD.
    Inventors: Ying-Chung Chen, Mu-Jung Huang
  • Publication number: 20240264377
    Abstract: An optical package device and a method of manufacturing the same are disclosed. The optical package device includes an optical component and an optical guiding component. The optical component is configured to change a phase of an input optical signal from a first state to a second state, and to output a first beam with a phase of the second state. The optical guiding component is disposed adjacent to the optical component, the first beam propagating from the optical component toward the optical guiding component. The physical axis of the optical component perpendicular thereto is not parallel with a physical axis of the optical guiding component perpendicular thereto.
    Type: Application
    Filed: February 3, 2023
    Publication date: August 8, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Ying-Chung CHEN
  • Publication number: 20240243207
    Abstract: An optical device package is provided. The optical device package includes a sensor and a light-transmitting region. The sensor includes a sensing region. The light-transmitting region is at least partially in the sensor, and the light-transmitting region allows an external light to transmit therethrough and reach the sensing region. A width of the light-transmitting region adjacent to a level of the sensing region is equal to or smaller than a width of the sensing region.
    Type: Application
    Filed: January 12, 2023
    Publication date: July 18, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsiang-Cheng TSAI, Ying-Chung CHEN, Kuo-Hua LAI
  • Publication number: 20240243039
    Abstract: At least some embodiments of the present disclosure relate to an electronic structure. The package structure includes a lead frame, an electronic component, and a conductive wire physically and electrically connecting the electronic component to the lead frame. An elevation of a first end of the conductive wire is substantially equal to an elevation of a second end of the conductive wire.
    Type: Application
    Filed: January 18, 2023
    Publication date: July 18, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Ying-Chung CHEN
  • Patent number: 12040321
    Abstract: An optical device includes an optical component and an electrical component. The optical component has a sensing surface and a backside surface opposite to the sensing surface. The electrical component is disposed adjacent to the backside surface of the optical component and configured to support the optical component. A portion of the backside surface of the optical component is exposed from the electrical component.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: July 16, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hsiang-Cheng Tsai, Ying-Chung Chen
  • Publication number: 20240219641
    Abstract: An optical module is disclosed. The optical module includes a carrier and a lid disposed over the carrier. The carrier and the lid are collaboratively define a first cavity for accommodating a photonic component. The optical module also includes a first electrical contact disposed over a first side of the lid and configured to provide an electronic connection for the optical module. A first aperture penetrating the lid is formed at the first side of the lid and corresponds to a light transmission/reception area of the photonic component.
    Type: Application
    Filed: December 30, 2022
    Publication date: July 4, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Ling HUANG, Ying-Chung CHEN
  • Publication number: 20240222543
    Abstract: An optical device includes an emitter, a receiver, a transparent element, and a block layer. The transparent element is disposed over the emitter and the receiver. The transparent element defines a recess between the emitter and the receiver. The block layer is conformally disposed over the transparent element and the recess.
    Type: Application
    Filed: December 30, 2022
    Publication date: July 4, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Ying-Chung CHEN
  • Publication number: 20240178598
    Abstract: A combined electrical connector at least composed of an outer shell component and a tongue component. The tongue component is at least composed of a tongue major conductive terminal assembly and a tongue minor conductive terminal assembly. Therefore, after the electrical connector design is completed, customization and adjustment of the quantity, structure, and electrical connection relationship of the conductive terminals of the electrical connector can still be achieved by adjusting the outer shell component and the tongue component. This allows meeting the specific requirements and developments of electronic devices.
    Type: Application
    Filed: November 24, 2023
    Publication date: May 30, 2024
    Inventors: YING-CHUNG CHEN, MU-JUNG HUANG
  • Publication number: 20240178607
    Abstract: A type of combined electrical connector is at least made by combining an outer shell component and a tongue component. The tongue component at least consists of a tongue major conductive terminal assembly and a tongue minor conductive terminal assembly. Therefore, after the electrical connector design is completed, customization of the quantity, structure, and electrical connection relationships of the conductive terminals can still be achieved by adjusting the outer shell component and the tongue component to meet the specific requirements and advancements in electronic devices.
    Type: Application
    Filed: November 24, 2023
    Publication date: May 30, 2024
    Inventors: YING-CHUNG CHEN, MU-JUNG HUANG