Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.

Abstract: An optical device includes a substrate, an electronic component, a lid and a barrier. The electronic component is disposed on the substrate. The electronic component has an active surface faces away from the substrate. The lid is disposed on the substrate. The lid has a wall structure extending toward the active surface of electronic component and is spaced apart from the active surface of the electronic component. The barrier is disposed on the active surface of the electronic component and is spaced apart from the wall structure of the lid.

Abstract: An optical package device comprises a carrier, a die, a support element, and an encapsulant. The die is on the carrier. The support element is on the carrier and adjacent to the die. The encapsulant covers the die and the support element. The encapsulant has a first top surface over the die and a second top surface adjacent to the first top surface. A ratio of a distance between the first top surface and the second top surface of the encapsulant to a distance between the die and the first top surface of the encapsulant is less than 0.1.

Abstract: An optical module includes a carrier, a light source disposed on an upper side of the carrier, an optical sensor disposed on the upper side of the carrier, and a housing disposed on the upper side of the carrier over the light source and the optical sensor. The housing defines a first aperture exposing at least a portion of the light source and a second aperture exposing at least a portion of the optical sensor. An outer sidewall of the housing includes at least one singulation portion adjacent to the upper side of the carrier and perpendicular to the upper side of the carrier.

Abstract: The present disclosure provides an optical module and a manufacturing process thereof. The optical module includes a carrier, a light source, a light detector, a molding compound and a lid. The light source is disposed adjacent to a surface of the carrier. The light detector is disposed adjacent to the surface of the carrier. The molding compound encapsulates the light source and the light detector, and includes at least one guiding structure. The lid is disposed between the light source and the light detector, and surrounds the light source and the light detector.

Abstract: A board to board connector assembly includes a male board connector, a female board connector, and an engagement structure for effectively engaging the male board connector with the female board connector. This assures effective engagement between the female and male board connectors even in the case of insufficient contact area therebetween, such that height of engagement between the female and male board connectors can be reduced desirably, making the board to board connector assembly well applicable to various miniaturized electronic devices. Moreover, the board to board connector assembly of the invention includes a plurality of conductors for simultaneously transmitting various signals, such that the number of connectors used in the electronic devices can be reduced. This also allows the board to board connector assembly to be readily applied to various miniaturized electronic devices.

Abstract: An optical system and a method of manufacturing an optical system are provided. The optical system includes a carrier, a light emitter, a light receiver, a block structure and an encapsulant. The light emitter is disposed on the carrier. The light receiver is disposed on the carrier and physically spaced apart from the light emitter. The light receiver has a light detecting area. The block structure is disposed on the carrier. The encapsulant is disposed on the carrier and covers the light emitter, the light receiver and the block structure. The encapsulant has a recess over the block structure.

Abstract: An electrical connector assembly as well as a board connector and a cable connector thereof are provided, in which power terminals and signal terminal are designed with different terminal structures in response to different functions, in order to ensure delivery of power and signal between the board connector and the cable connector, as well as reduce volumes occupied by the power terminals and the signal terminal in the board connector and the cable connector respectively, for achieving the purpose of reducing feature dimensions of the electrical connector assembly as well as the board connector and the cable connector thereof.

Abstract: A semiconductor device package comprises a carrier having a through hole. A lid is over the carrier and comprises a first side wall, a second side wall, and a connection wall. The second side wall is opposite the first side wall, and the connection wall is between the first side wall and the second side wall. The lid and the carrier form a plurality of chambers. The first side wall, the second side wall and the connection wall form a space to fluidly connect the plurality of chambers.

Abstract: An altitude increasing connector and the method for manufacturing the same for an electrical connection of a sensor element and a circuit substrate inside a portable electronic device, such that the sensor element is altitude increased, thereby an appropriate disposition altitude of the sensor element is adjusted, in order to ensure normal function of the sensor element, so that the yield of the portable electronic device is increased. The altitude increasing connector has a plurality of conductive terminals, each of which has a first welding pad for welding the sensor element and a second welding pad for welding the circuit substrate, wherein a distance between welding surfaces of both the first, second welding pads of each conductive terminal is fixed, such that a relative distance between electrical joints of both the sensor element and the circuit substrate is fixed.

Abstract: An electrical connector assembly as well as a board connector and a cable connector thereof are provided, in which power terminals and signal terminal are designed with different terminal structures in response to different functions, in order to ensure delivery of power and signal between the board connector and the cable connector, as well as reduce volumes occupied by the power terminals and the signal terminal in the board connector and the cable connector respectively, for achieving the purpose of reducing feature dimensions of the electrical connector assembly as well as the board connector and the cable connector thereof.

Abstract: An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.

Abstract: An optical device includes: (1) an emitter; (2) a detector disposed adjacent to the emitter; (3) an encapsulation layer encapsulating the emitter and the detector; (4) a dielectric layer disposed on the emitter, the detector and the encapsulation layer; (5) a redistribution layer disposed on the dielectric layer and electrically connected to the emitter and the detector; and (6) a light shielding structure disposed on the encapsulation layer and corresponding to a location between the emitter and the detector.

Abstract: A semiconductor package device comprises a substrate, a light emitter, a light detector and a transparent conductive film. The substrate as a first surface and a second surface opposite to the first surface. The light emitter is disposed on the first surface of the substrate and has a light emission area adjacent to the first surface of the substrate. The light detector is disposed on the first surface of the substrate and has a light receiving area adjacent to the first surface of the substrate. The transparent conducting film is disposed on the second surface of the substrate.