Abstract: A method of manufacturing a semiconductor device includes: providing a substrate; forming a gate structure on the substrate; depositing a first dielectric layer over the gate structure; depositing a conductive interconnect in a trench of the first dielectric layer thereby exposing a surface of the conductive interconnect through the first dielectric layer; depositing a conductive layer over the exposed surface of the conductive interconnect; depositing a silicon-containing layer over the conductive layer and the conductive interconnect; and forming a metal silicide layer to be a silicide form of the conductive layer by reacting the conductive layer with silicon in the silicon-containing layer.

Abstract: The disclosure provides an electronic system, a method for instructing an installation of the electronic system, and a computer program product. The electronic system includes a plurality of electronic device sets, a packing box, and a printed matter. The packing box is segmented into a plurality of containing packages, wherein each of the containing packages contains one of the electronic device sets, and the containing packages are labelled with a plurality of sequential numbers corresponding to an installation order of the electronic device sets contained therein. The printed matter is printed with downloading information related to installation software for providing a plurality of installation instructions of sequentially installing the electronic device sets one by one after being installed with the installation software.

Abstract: The disclosure provides an electronic system, a method for instructing an installation of the electronic system, and a computer program product. The electronic system includes a plurality of electronic device sets, a packing box, and a printed matter. The packing box is segmented into a plurality of containing packages, wherein each of the containing packages contains one of the electronic device sets, and the containing packages are labelled with a plurality of sequential numbers corresponding to an installation order of the electronic device sets contained therein. The printed matter is printed with downloading information related to installation software for providing a plurality of installation instructions of sequentially installing the electronic device sets one by one after being installed with the installation software.

Abstract: A method for updating a page of an electronic device is provided. The page includes a first row and a second row. Each of the first row and the second row includes one or two tiles. Each tile comprises a picture. The method comprises the following steps. After an update that results in insertion of a plurality of new tiles into the page occurs, three new tiles of the plurality of new tiles are displayed by using either a first tile layout or a second tile layout in a third row and a fourth row. The number of tiles in the third row is one and the number of tiles in the fourth row is two in the first tile layout. The number of tiles in the third row is two and the number of tiles in the fourth row is one in the second tile layout.

Abstract: A method for updating a page of an electronic device is provided. The page includes a first row and a second row. Each of the first row and the second row includes one or two tiles. Each tile comprises a picture. The method comprises the following steps. After an update that results in insertion of a plurality of new tiles into the page occurs, three new tiles of the plurality of new tiles are displayed by using either a first tile layout or a second tile layout in a third row and a fourth row. The number of tiles in the third row is one and the number of tiles in the fourth row is two in the first tile layout. The number of tiles in the third row is two and the number of tiles in the fourth row is one in the second tile layout.