Patents by Inventor Ying Sheng

Ying Sheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11972972
    Abstract: A method for forming an isolation structure includes: forming a trench at a surface of a substrate; forming a mask pattern on the substrate, wherein the mask pattern has an opening communicated with the trench; filling a first isolation material layer in the opening and the trench, wherein a surface of the first isolation material layer defines a first recess; filling a second isolation material layer into the first recess; partially removing the first and second isolation material layers, to form a second recess, performing first and second oblique ion implantation processes, to form damage regions in the first isolation material layer; performing a decoupled plasma treatment, to transform portions of the damage regions into a protection layer having etching selectivity with respect to the damage regions; and removing the damage regions.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: April 30, 2024
    Assignee: Winbond Electronics Corp.
    Inventors: Che-Jui Hsu, Ying-Fu Tung, Chun-Sheng Lu, Mu-Lin Li
  • Publication number: 20240126827
    Abstract: Systems and methods for efficiently identifying and extracting machine-actionable structured data from web documents are provided. The technology employs neural network architectures which process the raw HTML content of a set of seed websites to create transferrable models regarding information of interest. These models can then be applied to the raw HTML of other websites to identify similar information of interest. Data can thus be extracted across multiple websites in a functional, structured form that allows it to be used further by a processing system.
    Type: Application
    Filed: December 13, 2023
    Publication date: April 18, 2024
    Inventors: Ying Sheng, Yuchen Lin, Sandeep Tata, Nguyen Vo
  • Patent number: 11952690
    Abstract: A breathable and waterproof non-woven fabric is manufactured by a manufacturing method including the following steps. Performing a kneading process on 87 to 91 parts by weight of a polyester, 5 to 7 parts by weight of a water repellent, and 3 to 6 parts by weight of a flow promoter to form a mixture, in which the polyester has a melt index between 350 g/10 min and 1310 g/10 min at a temperature of 270° C., and the mixture has a melt index between 530 g/10 min and 1540 g/10 min at a temperature of 270° C. Performing a melt-blowing process on the mixture, such that the flow promoter is volatilized and a melt-blown fiber is formed, in which the melt-blown fiber has a fiber body and the water repellent disposed on the fiber body with a particle size (D90) between 350 nm and 450 nm.
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: April 9, 2024
    Assignee: TAIWAN TEXTILE RESEARCH INSTITUTE
    Inventors: Ying-Chi Lin, Wei-Hung Chen, Li-Chen Chu, Rih-Sheng Chiang
  • Patent number: 11955554
    Abstract: A method of fabrication of a multi-gate semiconductor device that includes providing a fin having a plurality of a first type of epitaxial layers and a plurality of a second type of epitaxial layers. The plurality of the second type of epitaxial layers is oxidized in the source/drain region. A first portion of a first layer of the second type of epitaxial layers is removed in a channel region of the fin to form an opening between a first layer of the first type of epitaxial layer and a second layer of the first type of epitaxial layer. A portion of a gate structure is then formed in the opening.
    Type: Grant
    Filed: July 15, 2022
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Huan-Sheng Wei, Hung-Li Chiang, Chia-Wen Liu, Yi-Ming Sheu, Zhiqiang Wu, Chung-Cheng Wu, Ying-Keung Leung
  • Patent number: 11953224
    Abstract: A device providing automatic control of temperature for an environment of a working station includes an air box, a baffle member, and a driving assembly. The air box is coupled to a machine defining a working space which the working station is in. The air box defines an opening. The opening allows cooling air to be introduced into the working space. The baffle member is slidably coupled to the air box at the opening. The driving assembly coupled to the baffle member drives the baffle member to cover the opening completely, to cover the opening partially, or to leave the opening uncovered in accordance with a difference between a current temperature of the working space and a desired target temperature of the working space. A related system and method are also disclosed.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: April 9, 2024
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
    Inventors: Qi-Qi Zhu, Yu-Tsang Tu, Yen-Sheng Lin, Ying-Quan Zhao
  • Publication number: 20240111342
    Abstract: An electronic device is provided, and the electronic device includes a base, a cover plate, and a bezel. The base has a sidewall where an opening portion is formed. An airflow selectively passes through the opening portion. The cover plate is pivotally connected to the base. The bezel is movably connected to the cover plate, wherein the bezel is rotated facing the opening portion selectively. The arrangement of the bezel may reduce the gap between the bezel and the down edge of the opening portion of the base, reducing the airflow flowing downward back to the heat-dissipation mechanism in the base. Therefore, the heat-dissipation efficiency of the electronic device is enhanced.
    Type: Application
    Filed: December 28, 2022
    Publication date: April 4, 2024
    Inventors: Chi-Yu HUNG, Chung-Jung WU, Ying-Sheng ZENG
  • Patent number: 11938582
    Abstract: A scanning device includes a scanner, a fixing seat, a sensor, and a processor. The fixing seat is provided with a positioning groove for fixing a position of a workpiece. The sensor senses whether the workpiece is on the fixing base. The processor is communicatively coupled to the scanner and the sensor and used for receiving signals from the sensor and sending instructions to the scanner. If the sensor senses the workpiece on the fixing base, the processor controls the scanner to scan an identification code on the workpiece. If the sensor does not sense the workpiece on the fixing base, the processor controls the scanner to stop scanning.
    Type: Grant
    Filed: October 11, 2020
    Date of Patent: March 26, 2024
    Assignee: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
    Inventors: Ying-Quan Zhao, Yen-Sheng Lin
  • Patent number: 11937251
    Abstract: A station (STA) for communicating with an Access Point (AP) in a wireless communication system is provided. The STA includes a wireless transceiver and a processor. The wireless transceiver performs wireless transmission and reception to and from the AP. The processor receives allocation information indicating a first user block for the STA in a first RU of an MU-PPDU from the AP via the wireless transceiver, and the first RU includes multiple user blocks allocated for different STAs. Also, the processor sends Uplink (UL) data or receives Downlink (DL) data in the first user block to or from the AP via the wireless transceiver according to the allocation information.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: March 19, 2024
    Assignee: MEDIATEK INC.
    Inventors: Ying-You Lin, Hung-Tao Hsieh, Tung-Sheng Yang
  • Patent number: 11934490
    Abstract: A method for automatically classifying transition motion includes following steps performed by a computing device: obtaining a plurality of transition motions, with each transition motion being associated with a source motion, a destination motion, and a transition mechanism converting the source motion into the destination motion; extracting a property vector from each transition motion and thereby generating a plurality of property vectors, wherein each property vector includes a plurality of transition properties; and performing a clustering algorithm according to the property vectors to generate a plurality of transition types.
    Type: Grant
    Filed: June 23, 2022
    Date of Patent: March 19, 2024
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Jonathan Hans Soeseno, Ying-sheng Luo, Trista Pei-Chun Chen
  • Publication number: 20240070472
    Abstract: The present disclosure provides a packing method including following steps. Genetic algorithm is utilized to calculate multiple packing programs. Multiple candidate packing programs including all items are selected from the packing programs. Among each of the candidate packing programs, at least one of the items to be placed earlier is classified into a first subset, and at least another one of the items to be placed later is classified into a second subset. Among each of the candidate packing programs, a first packing for the first subset is maintained, and a second packing for the second subset is recalculated by using a greedy algorithm to generate an updated second packing.
    Type: Application
    Filed: September 14, 2022
    Publication date: February 29, 2024
    Inventors: Ying-Sheng LUO, Trista Pei-Chun CHEN, Li-Ya SU, Ching Hui LI
  • Patent number: 11913925
    Abstract: A sensing device is provided. The sensing device includes a processing circuit and a multi-sensor integrated single chip. The multi-sensor integrated single chip includes a substrate and a temperature sensor, a pressure sensor, and an environmental sensor disposed on the substrate. The temperature sensor senses temperature. The pressure sensor senses pressure. The environmental sensor senses an environmental state. The processing circuit obtains a first sensed temperature value from the temperature sensor when the environmental sensor does not operate, and it obtains a second sensed temperature value from the temperature sensor when the environmental sensor operates. The processing circuit obtains a sensed pressure value from the pressure sensor. The processing circuit obtains at least one temperature calibration reference of the pressure sensor according to the first and second sensed temperature values and calibrates the sensed pressure value according to the temperature calibration reference.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: February 27, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ying-Che Lo, Yu-Sheng Lin, Po-Jen Su, Ting-Hao Hsiao
  • Patent number: 11886533
    Abstract: Systems and methods for efficiently identifying and extracting machine-actionable structured data from web documents are provided. The technology employs neural network architectures which process the raw HTML content of a set of seed websites to create transferable models regarding information of interest. These models can then be applied to the raw HTML of other websites to identify similar information of interest. Data can thus be extracted across multiple websites in a functional, structured form that allows it to be used further by a processing system.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: January 30, 2024
    Assignee: Google LLC
    Inventors: Ying Sheng, Yuchen Lin, Sandeep Tata, Nguyen Vo
  • Publication number: 20230394116
    Abstract: A method for automatically classifying transition motion includes following steps performed by a computing device: obtaining a plurality of transition motions, with each transition motion being associated with a source motion, a destination motion, and a transition mechanism converting the source motion into the destination motion; extracting a property vector from each transition motion and thereby generating a plurality of property vectors, wherein each property vector includes a plurality of transition properties; and performing a clustering algorithm according to the property vectors to generate a plurality of transition types.
    Type: Application
    Filed: June 23, 2022
    Publication date: December 7, 2023
    Inventors: Jonathan Hans Soeseno, Ying-sheng Luo, Trista Pei-Chun Chen
  • Patent number: 11810235
    Abstract: A method for establishing a complex motion controller includes following steps: obtaining a source controller and a destination controller, wherein the source controller is configured to generate a source motion, and the destination controller is configured to generate a destination motion; determining a transition tensor between the source controller and the destination controller, wherein the transition tensor has a plurality of indices, one of the plurality of indices corresponds to a plurality of phases of the source motion; calculating a plurality of transition outcomes of the transition tensor and recording the plurality of transition outcomes according to the plurality of indices; calculating a plurality of transition qualities according to the plurality of transition outcomes; and searching for an optimal transition quality from the plurality of transition qualities to establish a complex motion controller for generating a complex motion corresponding to one of the plurality of phases.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: November 7, 2023
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Ying-sheng Luo, Jonathan Hans Soeseno, Trista Pei-Chun Chen, Wei-Chao Chen
  • Publication number: 20230352413
    Abstract: Semiconductor devices having electrical interconnections through vertically stacked semiconductor dies, and associated systems and methods, are disclosed herein. In some embodiments, a semiconductor assembly includes a die stack having a plurality of semiconductor dies. Each semiconductor die can include surfaces having an insulating material, a recess formed in at least one surface, and a conductive pad within the recess. The semiconductor dies can be directly coupled to each other via the insulating material. The semiconductor assembly can further include an interconnect structure electrically coupled to each of the semiconductor dies. The interconnect structure can include a monolithic via extending continuously through each of the semiconductor dies in the die stack. The interconnect structure can also include a plurality of protrusions extending from the monolithic via.
    Type: Application
    Filed: June 26, 2023
    Publication date: November 2, 2023
    Inventors: Ruei Ying Sheng, Andrew M. Bayless, Brandon P. Wirz
  • Publication number: 20230335918
    Abstract: An electronic device and an antenna structure are provided. The electronic device includes a metal housing, and the antenna structure is disposed in the metal housing. The antenna structure includes a printed circuit board, two radiating elements, two feeding transmission lines and a connector. The two radiating elements are disposed on the printed circuit board and are close to the two slots. Projections of the two radiating elements projected onto the metal housing at least partially overlap with the two slots. The two feeding transmission line are disposed in the printed circuit board. The two feeding transmission lines are electrically connected to the two radiating elements, respectively, and lengths of the two feeding transmission lines are the same. The connector is connected to the printed circuit board and electrically connected to the two feeding transmission lines.
    Type: Application
    Filed: November 9, 2022
    Publication date: October 19, 2023
    Inventors: YING-SHENG FANG, SHANG-SIAN YOU
  • Patent number: 11715696
    Abstract: Semiconductor devices having electrical interconnections through vertically stacked semiconductor dies, and associated systems and methods, are disclosed herein. In some embodiments, a semiconductor assembly includes a die stack having a plurality of semiconductor dies. Each semiconductor die can include surfaces having an insulating material, a recess formed in at least one surface, and a conductive pad within the recess. The semiconductor dies can be directly coupled to each other via the insulating material. The semiconductor assembly can further include an interconnect structure electrically coupled to each of the semiconductor dies. The interconnect structure can include a monolithic via extending continuously through each of the semiconductor dies in the die stack. The interconnect structure can also include a plurality of protrusions extending from the monolithic via.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: August 1, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Ruei Ying Sheng, Andrew M. Bayless, Brandon P. Wirz
  • Publication number: 20230153754
    Abstract: The present disclosure provides a package packing method. The package packing method includes the following steps. An order including multiple items is received. The selected boxes with the same minimum width and minimum height are selected from multiple of boxes according to a length and a width of a main content item. The selection boxes have different depths. The minimum width and minimum height of the selection boxes are set as two-dimensional size dimension of a reference boxes. Under a condition of the two-dimensional size of the reference box, a minimum depth of the reference box and a packing scheme are calculated according to size of each of the main content item and attached content items, to fit the content items into the reference box. A target box is selected from these selected boxes according to the minimum depth of the reference box.
    Type: Application
    Filed: March 16, 2022
    Publication date: May 18, 2023
    Inventors: Ying-Sheng LUO, Trista Pei-Chun CHEN, Li-Ya SU, Ching Hui LI
  • Publication number: 20230079986
    Abstract: A method for establishing a complex motion controller includes following steps: obtaining a source controller and a destination controller, wherein the source controller is configured to generate a source motion, and the destination controller is configured to generate a destination motion; determining a transition tensor between the source controller and the destination controller, wherein the transition tensor has a plurality of indices, one of the plurality of indices corresponds to a plurality of phases of the source motion; calculating a plurality of transition outcomes of the transition tensor and recording the plurality of transition outcomes according to the plurality of indices; calculating a plurality of transition qualities according to the plurality of transition outcomes; and searching for an optimal transition quality from the plurality of transition qualities to establish a complex motion controller for generating a complex motion corresponding to one of the plurality of phases.
    Type: Application
    Filed: December 10, 2021
    Publication date: March 16, 2023
    Inventors: Ying-sheng Luo, Jonathan Hans Soeseno, Trista Pei-Chun Chen, Wei-Chao Chen
  • Patent number: D1007545
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: December 12, 2023
    Assignee: SHENZHEN ELEGOO TECHNOLOGY CO., LTD
    Inventors: Ying Sheng Hong, Sheng Zhe Zhang, Wei Qi Zeng