Abstract: A printed circuit board includes a layer. A layer of copper is covered on a surface of the layer. A through hole passes through the printed circuit board. An approximately C-shaped thermal engraving is defined in the surface of the layers, surrounding the through hole and without being covered by the layer of copper. An opening of the thermal engraving faces an output terminal of the power supply.

Abstract: A printed circuit board includes a reference layer, at least one first hole defined in the reference layer and adjacent from a first pin in a first column of pins of an electronic component, and at least one second hole defined in the reference layer and adjacent from a second pin of the electronic component. The at least one second hole is defined in the reference layer and opposite to the at least one first hole. The second pin is in a neighboring second column of pins from the first column of pins. A diameter of the at least one first hole is greater than a diameter of the at least one second hole such that a difference in current flowing through the first pin and the second pin is reduced.

Abstract: A printed circuit board includes a signal layer, a dielectric layer, and a reference layer. The signal layer includes a pair of differential signal lines. The dielectric layer is sandwiched between the signal layer and the reference layer. A first void is defined in the reference layer between projections of the pair of differential signal lines. Two second voids are defined in the reference layer at opposite sides of the projections of the pair of differential signal lines.

Abstract: A FPCB includes a signal layer, a ground layer, and a dielectric layer lying between the signal layer and the ground layer. At least one high speed signal transmission line is formed on the signal layer. The ground layer has a copper-removed area corresponding to the transmission line. Two ground lines are symmetrically disposed at two opposite sides of the signal transmission line and substantially parallel to the signal transmission line, each ground line and the signal transmission line is spaced at a first predetermined distance. Each ground line and the signal transmission line are spaced at a first predetermined distance.

Abstract: A system for optimizing analog circuit designs includes an input device, a data processing device, and a data storage device. The data processing device includes a selecting module, a calculation module, and a determining module. The selecting module is for receiving input from the input device and selecting electronic components composing the circuit from the data storage device. The calculation module is for calculating average values and standard deviations of each electronic component, generating normal distribution samples of each electronic component, and calculating output voltages of the circuit. The determining module is for determining whether the circuit meets a process capability standard.

Abstract: An exemplary probe apparatus includes a fixture, a first probe assembly, a motor, a lead screw, two guide members, a second probe, and a reduction gear unit. The first probe assembly is fixedly attached to the fixture and includes a first probe. The motor has a drive shaft attached to the fixture. The lead screw is coupled to the fixture. The two guide members are attached to the fixture and parallel to the lead screw. The second probe assembly is moveably attached to the lead screw and the at least one guide member, and includes a second probe. The reduction gear unit is coupled to the drive shaft and the lead screw to transmit power from the motor to the second probe assembly through the lead screw. The second probe assembly is configured for moving the second probe towards or away from the first probe along the two guide members.

Abstract: A portable device includes a central processing unit, a vibration sensor to sense vibration of the portable device, an image processing unit to process image data, and a memory unit storing a vibration reduction module. The vibration reduction module includes a vibration signal collecting sub-module to collect a vibration signal of the portable device, a filter sub-module to filter noise of the vibration signal, a vibration offset calculating sub-module to calculate a vibration offset of the portable device according to the filtered vibration signal, a vibration compensation calculating sub-module to calculate a compensation value corresponding to the vibration offset of the portable device, and an image controlling sub-module to control images of the portable device to move a distance which is equal to the compensation value via the image processing unit, to make the images of the portable device keep a fixed position.

Abstract: A computer-implemented method for designing a voltage regulator module (VRM) is disclosed. The method includes receiving design parameters and a component data for each component and storing the design parameters and the component data for each component into a component selection table, calculating a work efficiency of the VRM, and storing the work efficiency into a power computation table. The method further includes simulating a derating of each component according to a corresponding rated stress of each component if the work efficiency is greater than or equal to a predetermined work efficiency, calculating a stress ratio of each component, and storing the stress ratio into a component derating table. The component selection table, the power computation table and the component derating table are stored to form a desired VRM model if the stress ratio of each component meets a corresponding derating specification.

Abstract: A printed circuit board includes a layer. A layer of copper is covered on a surface of the layer. A through hole passes through the printed circuit board. A number of thermal engravings are defined in the layer around the through hole. Each thermal engraving is a groove defined in the surface of the layer, without covered with the layer of copper. The number of thermal engravings are not in contact with each other.

Abstract: A design method of printed circuit boards includes the following steps. First, simulate a printed circuit board including power layers, and vias connected to all the power layers. Then, change connections of the vias that tend to draw too much current to be connected to fewer power layers, than the vias that tend to draw less current. Repeat adjusting connections of the vias until all vias draw a similar amount of current such that no via draws more current than an upper limit the vias are designed for. Finally, according to the results, design/fabricate a PCB with vias respectively insulated, as needed, from the power layers that do not need to be connected to the vias.

Abstract: A differential signal transmission device transmits N differential signal pairs from a differential signal generator to a number of receiving terminals. The N differential signal pairs include N positive signals and N negative signals. The N positive signals are clustered at a first positive clustering point. The first positive clustering point is connected to a second positive clustering point via a first matching resistor. The second positive clustering point is grounded via a first grounding resistor, and outputs a number of positive signals to the number of receiving terminals respectively. The N negative signals are clustered at a first negative clustering point. The first negative clustering point is connected to a second negative clustering point via a second matching resistor. The second negative signal clustering point is grounded via a second grounding resistor, and outputs a number of negative signals to the number of receiving terminals respectively.

Abstract: A circuit topology for multiple loads includes a driving terminal for transmitting a driving signal, a number of transmitting lines, and a number of loads operable to receive the driving signal from the driving terminal. The number of loads are connected to the driving terminal one by one via the number of transmitting lines. Two transmitting lines of the number of transmitting lines, which are nearest and farthest respectively from the driving terminal, are both greater than widths of the other transmitting lines.

Abstract: A circuit topology for multiple loads includes a driving terminal for transmitting a driving signal, a number of transmitting lines, and a number of loads operable to receive the driving signal from the driving terminal. The number of loads are connected to the driving terminal one by one via the number of transmitting lines. Two transmitting lines of the number of transmitting lines, which are nearest and farthest respectively from the driving terminal, are both greater than widths of the other transmitting lines.

Abstract: A printed circuit board includes a reference layer, at least one first hole defined in the reference layer and adjacent from a first pin in a first column of pins of an electronic component, and at least one second hole defined in the reference layer and adjacent from a second pin of the electronic component. The at least one second hole is defined in the reference layer and opposite to the at least one first hole. The second pin is in a neighboring second column of pins from the first column of pins. A diameter of the at least one first hole is greater than a diameter of the at least one second hole such that a difference in current flowing through the first pin and the second pin is reduced.

Abstract: A system for optimizing analog circuit designs includes an input device, a data processing device, and a data storage device. The data processing device includes a selecting module, a calculation module, and a determining module. The selecting module is for receiving input from the input device and selecting electronic components composing the circuit from the data storage device. The calculation module is for calculating average values and standard deviations of each electronic component, generating normal distribution samples of each electronic component, and calculating output voltages of the circuit. The determining module is for determining whether the circuit meets a process capability standard.

Abstract: A printed circuit board includes a first layout layer, a second layout layer, a copper foil layer, a first via and a second via. The first layout layer has a first signal line and a second signal line, each of which has a curved first portion. The second layout layer has a third signal line and a fourth signal line, each of which also has a curved first portion. The curved first portions of the first signal line, the second signal line, the third signal line and the fourth signal line are coupled to the first via and the second via. In this case, the curved first portions of the first signal line, the second signal line, the third signal line and the fourth signal line cooperatively generate spiral inductance characteristic.

Abstract: A design method of printed circuit boards includes the following steps. First, simulate a printed circuit board including power layers, and vias connected to all the power layers. Then, change connections of the vias that tend to draw too much current to be connected to fewer power layers, than the vias that tend to draw less current. Repeat adjusting connections of the vias until all vias draw a similar amount of current such that no via draws more current than an upper limit the vias are designed for. Finally, according to the results, design/fabricate a PCB with vias respectively insulated, as needed, from the power layers that do not need to be connected to the vias.

Abstract: A printed circuit board (PCB) includes a power layer having a base portion, and at least two extending portions. The at least two extending portions are extended from edges near at least one corner of the base portion for preventing the PCB from forming constructive interferences and lowering the resonance magnitude thereof.

Abstract: An exemplary motherboard for supporting different types of memory includes a driving module, a first slot, a second slot, and a transmission line connected the driving module, the first slot and the second slot in turn. The first slot is arranged for mounting a first type of memory. The second slot is arranged for mounting a second type of memory. The first memory and the second memory are alternatively mounted on the motherboard. The transmission line is grounded via a capacitor for eliminating echo signals generated by the first and second type memories. The motherboard for supporting different memory modes satisfies different type memories, and maintains integrality of signals transmitted therein.

Abstract: A system for measuring a signal waveform is provided. The system comprises a parameter receiving module, a waveform receiving module, a waveform filter, and a data storing module. The parameter receiving module is configured for receiving one or more filtration conditions. The waveform receiving module is configured for receiving the signal waveform. The waveform filter is configured for filtering the signal waveform to obtain a desired waveform. The data storing module is configured for storing the desired waveform into a storage device.